PROBE STATION CHUCK
    1.
    发明专利
    PROBE STATION CHUCK 审中-公开

    公开(公告)号:JP2002170867A

    公开(公告)日:2002-06-14

    申请号:JP2001269039

    申请日:2001-09-05

    Inventor: DUNKLEE JOHN

    Abstract: PROBLEM TO BE SOLVED: To provide a chuck which can keep flatness of an upper chuck assembly element which holds a wafer when a probe is applied on a wafer. SOLUTION: This chuck comprises the upper chuck assembly element 180 having a top surface 198 that holds a wafer, and a chuck spacing device including three independent pins 204 which form a clearance between the upper chuck assembly element 180 and a central chuck assembly element 182 under the element 180. This chuck spacing device includes an insulative U-shaped component of which the first surface is pressed on a upper surface 224 of the central chuck assembly element 182, and the second surface is pressed each other with a first surface of a conductive U-shaped member. A second surface of the conductive U-shaped member is pressed each other with an under surface of the upper chuck assembly element 180. The thickness in the first surface of the insulative U-shaped member 246 is thinner than one third of the thickness of the conductive U-shaped member 244.

    Chuck for probe station
    2.
    发明专利
    Chuck for probe station 审中-公开
    抓住探测台

    公开(公告)号:JP2008306215A

    公开(公告)日:2008-12-18

    申请号:JP2008230799

    申请日:2008-09-09

    Inventor: DUNKLEE JOHN

    CPC classification number: H01L21/68785 G01R31/2887 Y10T279/11 Y10T279/35

    Abstract: PROBLEM TO BE SOLVED: To provide a chuck, such that an upper part chuck assembly element for supporting a wafer will not lose flatness, when a probe is loaded on a wafer. SOLUTION: A chuck includes an upper part chuck assembly element 180 having an upper face 198 for supporting a wafer. Between the upper part chuck assembly element and a central chuck assembly element 182 thereunder, three independent pins 200,202, and 204 are provided forming spacing. A chuck alienating device is provided, connected to the upper part chuck assembly element 180. The chuck alienation device includes an insulated U-shaped member 246 having a first face which pushes to engage into the upper face 224 of the central chuck assembly element and a second face which pushes, to be engaged into a first face of a conductive U-shaped member 244. A second face of the conductive U-shaped member 244 pushes to be engaged into a lower face of the upper part chuck assembly element. The first face of the insulated U-shaped member is thinner than one third of the thickness of the conductive U-shaped member. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供卡盘,当将探针装载在晶片上时,用于支撑晶片的上部卡盘组件元件不会失去平坦度。 解决方案:卡盘包括具有用于支撑晶片的上表面198的上部卡盘组件元件180。 在上部卡盘组件元件和下面的中心卡盘组件元件182之间,形成间隔的三个独立的销钉200,202和204。 提供了一种卡盘疏散装置,连接到上部卡盘组件元件180.卡盘异物装置包括绝缘的U形构件246,其具有推动接合到中心卡盘组件元件的上表面224中的第一面,以及 推动接合到导电U形构件244的第一面的第二面。导电U形构件244的第二面被推入以与上部卡盘组件的下表面接合。 绝缘的U形构件的第一面比导电U形构件的厚度的三分之一薄。 版权所有(C)2009,JPO&INPIT

    CHUCK ASSEMBLY FOR PROBE STATION
    3.
    发明专利

    公开(公告)号:JP2002164396A

    公开(公告)日:2002-06-07

    申请号:JP2001269047

    申请日:2001-09-05

    Abstract: PROBLEM TO BE SOLVED: To obtain a chuck assembly having a reduced shaking and stress that acts on a plunger, which enables arranging of a wafer on a probe more easily and correctly, during inspecting the wafer and the like by the probe. SOLUTION: This chuck assembly is provided with an adjustment plate 182, which is freely rotatable toward the chuck assembly, suitable for supporting the chuck and has a tab 203 and a plunger 200. The plunger 200 that is connected to the adjustment plate has a receptacle 201, by the rotations of which the adjustment plate is rotated selectively. A position stage 184 has a pair of straight bearings and is a basic insulator for supporting for the adjustment plate. A downward force will not be applied to the plunger, while the adjustment plate is being rotated and activated by the plunger.

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