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公开(公告)号:JP2002170867A
公开(公告)日:2002-06-14
申请号:JP2001269039
申请日:2001-09-05
Applicant: CASCADE MICROTECH INC
Inventor: DUNKLEE JOHN
Abstract: PROBLEM TO BE SOLVED: To provide a chuck which can keep flatness of an upper chuck assembly element which holds a wafer when a probe is applied on a wafer. SOLUTION: This chuck comprises the upper chuck assembly element 180 having a top surface 198 that holds a wafer, and a chuck spacing device including three independent pins 204 which form a clearance between the upper chuck assembly element 180 and a central chuck assembly element 182 under the element 180. This chuck spacing device includes an insulative U-shaped component of which the first surface is pressed on a upper surface 224 of the central chuck assembly element 182, and the second surface is pressed each other with a first surface of a conductive U-shaped member. A second surface of the conductive U-shaped member is pressed each other with an under surface of the upper chuck assembly element 180. The thickness in the first surface of the insulative U-shaped member 246 is thinner than one third of the thickness of the conductive U-shaped member 244.
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公开(公告)号:JP2008306215A
公开(公告)日:2008-12-18
申请号:JP2008230799
申请日:2008-09-09
Inventor: DUNKLEE JOHN
CPC classification number: H01L21/68785 , G01R31/2887 , Y10T279/11 , Y10T279/35
Abstract: PROBLEM TO BE SOLVED: To provide a chuck, such that an upper part chuck assembly element for supporting a wafer will not lose flatness, when a probe is loaded on a wafer. SOLUTION: A chuck includes an upper part chuck assembly element 180 having an upper face 198 for supporting a wafer. Between the upper part chuck assembly element and a central chuck assembly element 182 thereunder, three independent pins 200,202, and 204 are provided forming spacing. A chuck alienating device is provided, connected to the upper part chuck assembly element 180. The chuck alienation device includes an insulated U-shaped member 246 having a first face which pushes to engage into the upper face 224 of the central chuck assembly element and a second face which pushes, to be engaged into a first face of a conductive U-shaped member 244. A second face of the conductive U-shaped member 244 pushes to be engaged into a lower face of the upper part chuck assembly element. The first face of the insulated U-shaped member is thinner than one third of the thickness of the conductive U-shaped member. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题:为了提供卡盘,当将探针装载在晶片上时,用于支撑晶片的上部卡盘组件元件不会失去平坦度。 解决方案:卡盘包括具有用于支撑晶片的上表面198的上部卡盘组件元件180。 在上部卡盘组件元件和下面的中心卡盘组件元件182之间,形成间隔的三个独立的销钉200,202和204。 提供了一种卡盘疏散装置,连接到上部卡盘组件元件180.卡盘异物装置包括绝缘的U形构件246,其具有推动接合到中心卡盘组件元件的上表面224中的第一面,以及 推动接合到导电U形构件244的第一面的第二面。导电U形构件244的第二面被推入以与上部卡盘组件的下表面接合。 绝缘的U形构件的第一面比导电U形构件的厚度的三分之一薄。 版权所有(C)2009,JPO&INPIT
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公开(公告)号:JP2002164396A
公开(公告)日:2002-06-07
申请号:JP2001269047
申请日:2001-09-05
Applicant: CASCADE MICROTECH INC
Inventor: NORDGREN GREG , DUNKLEE JOHN
Abstract: PROBLEM TO BE SOLVED: To obtain a chuck assembly having a reduced shaking and stress that acts on a plunger, which enables arranging of a wafer on a probe more easily and correctly, during inspecting the wafer and the like by the probe. SOLUTION: This chuck assembly is provided with an adjustment plate 182, which is freely rotatable toward the chuck assembly, suitable for supporting the chuck and has a tab 203 and a plunger 200. The plunger 200 that is connected to the adjustment plate has a receptacle 201, by the rotations of which the adjustment plate is rotated selectively. A position stage 184 has a pair of straight bearings and is a basic insulator for supporting for the adjustment plate. A downward force will not be applied to the plunger, while the adjustment plate is being rotated and activated by the plunger.
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公开(公告)号:WO2004049395A2
公开(公告)日:2004-06-10
申请号:PCT/US0333767
申请日:2003-10-24
Applicant: CASCADE MICROTECH INC , DUNKLEE JOHN , COWAN CLARENCE E
Inventor: DUNKLEE JOHN , COWAN CLARENCE E
CPC classification number: G01R31/2851 , G01R31/2886 , G01R31/2887
Abstract: A probe assembly suitable for high-current measurements of an electrical device.
Abstract translation: 适用于电气设备的高电流测量的探头组件。
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公开(公告)号:WO2004102598A2
公开(公告)日:2004-11-25
申请号:PCT/US2004012338
申请日:2004-04-21
Applicant: CASCADE MICROTECH INC , DUNKLEE JOHN
Inventor: DUNKLEE JOHN
IPC: G01R31/02 , G01R31/26 , G01R31/28 , H01G20060101 , H01G
CPC classification number: G01R31/2886
Abstract: A probe assembly having a switch that selectively electrically connects, for example, either a Kelvin connection or a suspended guard element with the probe assembly.
Abstract translation: 探针组件,其具有选择性地电连接例如开尔文连接或悬挂的保护元件与探针组件的开关。
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公开(公告)号:WO2007005365A2
公开(公告)日:2007-01-11
申请号:PCT/US2006024780
申请日:2006-06-26
Applicant: CASCADE MICROTECH INC , GLEASON K REED , NAVRATIL PETER , SARTOR CALI , ALLISON THANE , MARTIN JOHN , DUNKLEE JOHN
Inventor: GLEASON K REED , NAVRATIL PETER , SARTOR CALI , ALLISON THANE , MARTIN JOHN , DUNKLEE JOHN
IPC: B01L3/00
CPC classification number: G01N35/1016 , B01L3/0268 , B01L3/0293 , B01L3/502715 , B01L3/50273 , B01L9/527 , B01L2200/025 , B01L2200/027 , B01L2200/0684 , B01L2200/16 , B01L2300/1805 , B01L2400/0415 , B01L2400/0418 , B01L2400/0439 , B01L2400/0487 , G01N2035/1034 , G01N2035/1044
Abstract: A fluid dispensing apparatus and system for facilitating dispensing small volume, fluid samples to microfluidic devices.
Abstract translation: 一种流体分配装置和系统,用于便于将微量流体样品分配到微流体装置。
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公开(公告)号:WO2005067445A2
公开(公告)日:2005-07-28
申请号:PCT/US2004030276
申请日:2004-09-14
Applicant: CASCADE MICROTECH INC , ANDREWS PETER , FROEMKE BRAD , DUNKLEE JOHN
Inventor: ANDREWS PETER , FROEMKE BRAD , DUNKLEE JOHN
CPC classification number: G01R31/2887
Abstract: An improved chuck with lift pins within a probe station.
Abstract translation: 探针台内带有升降杆的改进夹头。
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公开(公告)号:AU2003286669A8
公开(公告)日:2004-06-18
申请号:AU2003286669
申请日:2003-10-24
Applicant: CASCADE MICROTECH INC
Inventor: DUNKLEE JOHN , COWAN CLARENCE E
Abstract: A probe assembly suitable for high-current measurements of an electrical device.
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公开(公告)号:DE10143174A1
公开(公告)日:2002-04-18
申请号:DE10143174
申请日:2001-09-04
Applicant: CASCADE MICROTECH INC
Inventor: NORDGREN GREG , DUNKLEE JOHN
Abstract: A probe station for testing a wafer.
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公开(公告)号:WO2004107400A2
公开(公告)日:2004-12-09
申请号:PCT/US2004012248
申请日:2004-04-22
Applicant: CASCADE MICROTECH INC , STEWART CRAIG , LORD ANTHONY , SPENCER JEFF , BURCHAM TERRY , MCMANN PETER , JONES RODD , DUNKLEE JOHN , LESHER TIM , NEWTON DAVID
Inventor: STEWART CRAIG , LORD ANTHONY , SPENCER JEFF , BURCHAM TERRY , MCMANN PETER , JONES RODD , DUNKLEE JOHN , LESHER TIM , NEWTON DAVID
CPC classification number: G01R31/2887
Abstract: A chuck includes a conductive element that contacts a device under test in a location on the chuck.
Abstract translation: 卡盘包括在卡盘上的位置接触被测设备的导电元件。
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