公开(公告)号：CA2030145A1

公开(公告)日：1991-05-21

申请号：CA2030145

申请日：1990-11-16

Applicant: DUEBER THOMAS E

Inventor： DUEBER THOMAS E

IPC: C09J133/16 ,  C09J7/02 ,  C09J133/02 ,  C09J133/04 ,  C09J133/08 ,  C09J133/20 ,  H05K3/38 ,  B32B7/12 ,  B32B15/08

Abstract: PE-0 1 35 Title FLAME RETARDANT ADHESIVE COMPOSITION AND LAMINATES A flame retardant adhesive composition comprising 5099% latex, 10-50% substantially nonreactive, biominated polymer and 0-15% antiniony oxide. The latex comprises 1-10% crosslinking agent and 90-99% copolymer comprising 15-50% acrylonitrile and/or methacrylonitrile, 45-84% acrylate and/or methacrylate and 1-10% methacrylic acid, acrylic acid, itaconic acid or mixtures thereof. This composition is a particularly useful adhesive for polyimide films in the fabrication of solderable flexible circuits.

公开(公告)号：WO2007146382A3

公开(公告)日：2007-12-21

申请号：PCT/US2007/013965

申请日：2007-06-13

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  DUEBER, Thomas, E. ,  SUMMERS, John, D.

Inventor： DUEBER, Thomas, E. ,  SUMMERS, John, D.

IPC: C08G73/00 ,  C08G73/10 ,  C08J5/18 ,  C09D179/08

Abstract: Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperature of 190°C or less.

公开(公告)号：WO2007047384A1

公开(公告)日：2007-04-26

申请号：PCT/US2006/039912

申请日：2006-10-12

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY ,  DUEBER, Thomas, E. ,  SUMMERS, John, D. ,  AUMAN, Brian, C. ,  SUBRAMANIAN, Munirpallam, A. ,  ROGADO, Nyrissa, S.

Inventor： DUEBER, Thomas, E. ,  SUMMERS, John, D. ,  AUMAN, Brian, C. ,  SUBRAMANIAN, Munirpallam, A. ,  ROGADO, Nyrissa, S.

IPC: C08L79/08 ,  C08L63/00 ,  H01L23/29 ,  H01B1/20

CPC classification number: H01L21/02118 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/02 ,  G03F7/023 ,  G03F7/0387 ,  H01L21/02282 ,  H01L21/312 ,  H05K1/095 ,  H05K2201/0154 ,  Y10T428/31522 ,  C08L2666/20 ,  C08L2666/22

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen- printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250°C, a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract translation: 吸水性聚酰亚胺/环氧基组合物（如糊剂（或溶液））特别适用于制造电子可印刷的材料和电子元件。 发现一组疏水性环氧化物（和可溶性聚酰亚胺）特别耐吸湿性。 用这些环氧化物（和这些聚酰亚胺）制成的聚酰亚胺/环氧树脂浆料可以任选含有热交联剂，粘合促进剂，封闭异氰酸酯和其它无机填料。 本发明的聚酰亚胺/环氧树脂糊料的玻璃化转变温度可以高于250℃，吸水率小于2％，并且具有正的溶解度测量。

公开(公告)号：WO2009009072A1

公开(公告)日：2009-01-15

申请号：PCT/US2008/008430

申请日：2008-07-09

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  LEE, Yueh-ling ,  FANG, Xin, Shane ,  DUEBER, Thomas, E. ,  WESSEL, Richard, A. ,  ZWICKER, Harry, Richard

Inventor： LEE, Yueh-ling ,  FANG, Xin, Shane ,  DUEBER, Thomas, E. ,  WESSEL, Richard, A. ,  ZWICKER, Harry, Richard

IPC: H05K1/03 ,  H05K3/18

CPC classification number: H05K1/0373 ,  H05K3/0032 ,  H05K3/184 ,  H05K3/185 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31678

Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor (10) having an insulating substrate and a cover layer. The insulating substrate (12) is made from a dielectric material and also a metal oxide activatable filler. The cover layer (14) can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process. The cover layer comprises a polymeric matrix material.

Abstract translation: 本发明涉及通过激光（或类似能量束）消融的非平版印刷图案，其中消融系统最终导致电路特征相对没有碎片诱导的过度电镀缺陷（与消融过程有关的碎片） 并且完全添加电镀引起的过度镀覆缺陷。 本发明的组合物包括具有绝缘基板和覆盖层的电路板前体（10）。 绝缘基板（12）由电介质材料和金属氧化物可活化填料制成。 覆盖层（14）可以是牺牲的或非牺牲的，并且用于修复由消融过程产生的不需要的碎屑。 覆盖层包括聚合物基质材料。

公开(公告)号：WO2007146382A2

公开(公告)日：2007-12-21

申请号：PCT/US2007013965

申请日：2007-06-13

Applicant: DU PONT ,  DUEBER THOMAS E ,  SUMMERS JOHN D

Inventor： DUEBER THOMAS E ,  SUMMERS JOHN D

CPC classification number: C08G73/1039 ,  C08G73/1064 ,  C09D179/08 ,  H01G4/224 ,  H01G9/08 ,  H05K1/162 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09763

Abstract: Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperature of 190°C or less.

Abstract translation: 公开的区域组合物包括：吸水率为2％或更低的聚酰亚胺树脂，以及任选的一种或多种电绝缘填料，消泡剂和着色剂以及一种或多种有机溶剂。 该组合物可用作密封剂并具有190℃或更低的固结温度。

公开(公告)号：WO2007146383A1

公开(公告)日：2007-12-21

申请号：PCT/US2007/013966

申请日：2007-06-13

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  DUEBER, Thomas, E. ,  SUMMERS, John, D.

Inventor： DUEBER, Thomas, E. ,  SUMMERS, John, D.

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K3/1291 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2203/1126

Abstract: Disclosed is an organic encapsulant composition that, when applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards, allows the capacitor to resist printed wiring board chemicals and survive accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.

Abstract translation: 公开了一种有机密封剂组合物，当应用于箔上形成的陶瓷电容器和嵌入式印刷线路板时，允许电容器抵抗印刷线路板化学品并且在高湿度，高温和施加的直流偏压下进行加速寿命测试 。