METHOD AND DEVICE FOR PRODUCING A SOLDERED JOINT

    公开(公告)号:IL149489A

    公开(公告)日:2006-10-31

    申请号:IL14948902

    申请日:2002-05-06

    Abstract: A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber (12, 13) which are independent of each other.

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