公开(公告)号：WO0169680A2

公开(公告)日：2001-09-20

申请号：PCT/US0107926

申请日：2001-03-13

Applicant: LEGACY ELECTRONICS INC ,  KLEDZIK KENNETH J ,  ENGLE JASON C

Inventor： KLEDZIK KENNETH J ,  ENGLE JASON C

IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

Abstract: A package carrier (100) for increasing the circuit density on printed circuit boards (503). The package carrier (100) mounts on a printed circuit board (503) on top of a first integrated circuit package (507) that is also mounted on the printed circuit board (503). The carrier (100) has an upper major surface (102U) having a pad array on which a second integrated circuit package (501) is mountable. The carrier (100) has a plurality of leads by means of which the carrier (100) is surface mounted to the printed circuit board (503). Each carrier lead is also electrically connected to a single pad of the pad array on the upper surface (102U). The integrated circuit package (507) beneath the carrier (100) shares all or most printed circuit board (503) connections in common with the carrier (100) and consequently the integrated ciurcut package (501) mounted upon the carrier (100). The carrier (100) also includes heat sink or heat disipation structures.

Abstract translation: 一种用于增加印刷电路板（503）上的电路密度的封装载体（100）。 封装载体（100）安装在也安装在印刷电路板（503）上的第一集成电路封装（507）的顶部上的印刷电路板（503）上。 载体（100）具有具有垫阵列的上主表面（102U），其上可安装第二集成电路封装（501）。 载体（100）具有多个引线，载体（100）通过该引线表面安装到印刷电路板（503）。 每个载体引线也电连接到上表面（102U）上的焊盘阵列的单个焊盘。 载体（100）下方的集成电路封装（507）与载体（100）共同分享全部或大部分印刷电路板（503）连接，从而共同安装在载体（100）上的集成切割封装（501）。 载体（100）还包括散热器或散热结构。

公开(公告)号：WO0234021A3

公开(公告)日：2002-09-06

申请号：PCT/US0132329

申请日：2001-10-16

Applicant: LEGACY ELECTRONICS ,  KLEDZIK KENNETH J ,  ENGLE JASON C

Inventor： KLEDZIK KENNETH J ,  ENGLE JASON C

IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/182 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09072 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: An improved multi-chip module includes a circuit board (301) having an array of electrical interconnection pads to which are mounted a plurality of IC package units (201). Each IC package unit (201) includes multiple IC packages (105) which are mounted on opposite sides of a package carrier (101). The package units (201) may be mounted on one or both sides of the circuit board (301). A variety of package carriers are used to create a number of different modules. One type of package carrier (101) has a pair of major planar surfaces (102). Each planar surface (102) incorporates electrical contact pads (103). At least one IC package (105) is surface mounted on each major planar surface by interconnecting the conntection elements or leads (104) of the package (105) with contact pads (103) on the planar surface (102), to form the IC package unit (201). Another type of package carrier substrate has multiple recesses for back to back surface mounting of the IC packages. The packages also include in various versions heat sinks.

Abstract translation: 改进的多芯片模块包括具有电互连焊盘阵列的电路板（301），多个IC封装单元（201）安装到所述电互连焊盘阵列。 每个IC封装单元（201）包括安装在封装载体（101）的相对侧上的多个IC封装（105）。 封装单元（201）可以安装在电路板（301）的一侧或两侧上。 各种封装载体被用来创建许多不同的模块。 一种类型的包装载体（101）具有一对主平坦表面（102）。 每个平面表面（102）包含电接触垫（103）。 通过将封装（105）的连接元件或引线（104）与平坦表面（102）上的接触垫（103）互连，将至少一个IC封装（105）表面安装在每个主平面表面上，以形成IC 封装单元（201）。 另一种类型的封装载体基板具有多个用于IC封装的背面安装的凹部。 这些封装还包括各种版本的散热器。