公开(公告)号：WO2002047451A3

公开(公告)日：2002-06-13

申请号：PCT/US2001/044163

申请日：2001-11-06

Applicant: INTEL CORPORATION (a Delaware Corporation) ,  SEARLS, Damion, T. ,  DISHONGH, Terrace, J. ,  DUJARI, Prateek ,  LIAN, Bin

Inventor： SEARLS, Damion, T. ,  DISHONGH, Terrace, J. ,  DUJARI, Prateek ,  LIAN, Bin

IPC: H01L23/467

Abstract: A heat dissipation device that includes a conduit in a base portion thereof. An opening extends from a dissipation surface of the base portion to a conduit. The conduit allows air from a fan to flow within the base portion, which can improve heat removal from hotspots, and alleviate air stagnation in the heat dissipation device.

公开(公告)号：WO2010027890A2

公开(公告)日：2010-03-11

申请号：PCT/US2009055133

申请日：2009-08-27

Applicant: INTEL CORP ,  SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES E

Inventor： SEARLS DAMION ,  ROTH WESTON C ,  RAMIREZ MARGARET D ,  JACKSON JAMES D ,  THOMAS RAINER E ,  GEALER CHARLES E

IPC: H01L23/48 ,  H01L23/12

CPC classification number: H05K1/181 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

Abstract translation: 公开了包括直接附接到主板的集成电路（IC）裸片的系统级组件的实施例。 直接连接到主板或其他电路板的IC管芯可以被称为直接芯片连接（DCA）管芯。 封装设置在DCA管芯的至少一部分上并与主板耦合。 该封装包括设置在衬底上的一个或多个其他IC管芯。 描述并要求保护其他实施例。

公开(公告)号：AU3819001A

公开(公告)日：2001-09-24

申请号：AU3819001

申请日：2001-02-13

Applicant: INTEL CORP ,  SEARLS DAMION T ,  DISHOHGH TERRANCE J ,  PULLEN DAVID H

Inventor： SEARLS DAMION T ,  DISHONGH TERRANCE J ,  PULLEN DAVID H

IPC: H01L23/427

Abstract: In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.

公开(公告)号：WO2010027890A3

公开(公告)日：2010-03-11

申请号：PCT/US2009/055133

申请日：2009-08-27

Applicant: INTEL CORPORATION ,  SEARLS, Damion ,  ROTH, Weston, C. ,  RAMIREZ, Margaret, D. ,  JACKSON, James, D. ,  THOMAS, Rainer, E. ,  GEALER, Charles, E.

Inventor： SEARLS, Damion ,  ROTH, Weston, C. ,  RAMIREZ, Margaret, D. ,  JACKSON, James, D. ,  THOMAS, Rainer, E. ,  GEALER, Charles, E.

IPC: H01L23/48 ,  H01L23/12

Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

公开(公告)号：WO0235655A3

公开(公告)日：2002-08-29

申请号：PCT/US0131815

申请日：2001-10-12

Applicant: INTEL CORP ,  SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

Inventor： SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01R12/57 ,  H01R12/70 ,  H05K3/34 ,  H01R12/36 ,  H01R4/02

CPC classification number: H01R12/57 ,  H01R12/7011 ,  H01R12/707 ,  H05K3/3426 ,  Y02P70/613

Abstract: An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.

Abstract translation: 用于将电子器件表面安装到基底的增强的接合厚度引线，其中增强的接合厚度引线的一部分基本上平行于物质。 增强的接头厚度引线包括弓形结构，其为用于将引线连接到衬底的焊料提供增强的接合厚度。 焊料的增强的接合厚度导致电子器件的更牢固的附着。

公开(公告)号：EP1264343A2

公开(公告)日：2002-12-11

申请号：EP01910599.8

申请日：2001-02-13

Applicant: INTEL CORPORATION ,  Searls, Damion T. ,  Dishongh, Terrance J. ,  Pullen, David H.

Inventor： SEARLS, Damion T. ,  DISHONGH, Terrance, J. ,  PULLEN, David, H.

IPC: H01L23/427

CPC classification number: F28D15/00 ,  C09K5/063 ,  F28D20/021 ,  F28D2021/0031 ,  F28F23/00 ,  G06F1/20 ,  H01L23/4275 ,  H01L2924/0002 ,  Y02E60/145 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat sink includes a heat sink body including a number of fins and a cavity for holding a phase change material and a number of particles to enhance the mixing of the phase change material during the operation of the heat sink. In operation, the body of the heat sink conducts thermal energy to the phase change material. The energy is absorbed during the phase change of the phase change material. After absorbing energy and changing to a liquid state, the phase change material continues to dissipate energy by convection. The convention currents in the cavity are directed by the shape of the cavity surfaces an enhanced by the particles intermixed with the phase change material.

公开(公告)号：WO2006019621A1

公开(公告)日：2006-02-23

申请号：PCT/US2005/024302

申请日：2005-07-08

Applicant: INTEL CORPORATION ,  SEARLS, Damion ,  OSBURN, Edward

Inventor： SEARLS, Damion ,  OSBURN, Edward

IPC: H05K1/02

CPC classification number: H01L23/49844 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10166 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In one embodiment, the present invention includes a method of mounting a semiconductor device (30) to a first side of a circuit board (20); and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices may be output filters, inductors (46), capacitors (41), and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

Abstract translation: 在一个实施例中，本发明包括将半导体器件（30）安装到电路板（20）的第一侧的方法; 以及将至少一个电压调节器装置安装到所述电路板的第二侧，所述第二侧与所述第一侧相对。 电压调节器装置可以是输出滤波器，电感器（46），电容器（41）等。 在某些实施例中，器件可以位于半导体器件的正下方。

公开(公告)号：WO0247451A2

公开(公告)日：2002-06-13

申请号：PCT/US0144163

申请日：2001-11-06

Applicant: INTEL CORP ,  SEARLS DAMION T ,  DISHONGH TERRACE J ,  DUJARI PRATEEK ,  LIAN BIN

Inventor： SEARLS DAMION T ,  DISHONGH TERRACE J ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01L23/467 ,  H05K7/00

CPC classification number: H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A heat dissipation device that includes a conduit in a base portion thereof. An opening extends from a dissipation surface of the base portion to a conduit. The conduit allows air from a fan to flow within the base portion, which can improve heat removal from hotspots, and alleviate air stagnation in the heat dissipation device.

Abstract translation: 一种散热装置，其包括在其基部的导管。 开口从基部的耗散表面延伸到导管。 导管允许来自风扇的空气在基部内流动，这可以改善从热点排出的热量，并减轻散热装置中的空气滞留。

公开(公告)号：WO0169677A3

公开(公告)日：2002-02-14

申请号：PCT/US0104565

申请日：2001-02-13

Applicant: INTEL CORP ,  SEARLS DAMION T ,  DISHONGH TERRANCE J ,  PULLEN DAVID H

Inventor： SEARLS DAMION T ,  DISHONGH TERRANCE J ,  PULLEN DAVID H

IPC: H01L23/427

CPC classification number: F28D15/00 ,  C09K5/063 ,  F28D20/021 ,  F28D2021/0031 ,  F28F23/00 ,  G06F1/20 ,  H01L23/4275 ,  H01L2924/0002 ,  Y02E60/145 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat sink includes a heat sink body including a number of fins and a cavity for holding a phase change material and a number of particles to enhance the mixing of the phase change material during the operation of the heat sink. In operation, the body of the heat sink conducts thermal energy to the phase change material. The energy is absorbed during the phase change of the phase change material. After absorbing energy and changing to a liquid state, the phase change material continues to dissipate energy by convection. The convention currents in the cavity are directed by the shape of the cavity surfaces an enhanced by the particles intermixed with the phase change material.

Abstract translation: 散热器包括散热体，散热体包括多个翅片和用于保持相变材料的空腔和多个颗粒，以在散热器的操作期间增强相变材料的混合。 在操作中，散热器的主体对相变材料传导热能。 能量在相变材料的相变期间被吸收。 在吸收能量并变为液体状态之后，相变材料通过对流继续耗散能量。 空腔中的常规电流由空腔表面的形状引导，由与相变材料混合的颗粒增强。