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    METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER
    8.
    发明申请
    METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER 有权
    将帽子焊接到支撑层的方法

    公开(公告)号：US20130083501A1

    公开(公告)日：2013-04-04

    申请号：US13630872

    申请日：2012-09-28

    Applicant: STMicroelectronics Ltd (Malta)

    Inventor： Mark A. Azzopardi ,  Kevin Formosa ,  Ivan Ellul

    IPC: B32B1/02 ,  B32B15/01 ,  H05K5/03 ,  B23K1/20

    CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/16152 ,  Y10T428/1241 ,  Y10T428/13 ,  H01L2924/00

    Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

    Abstract translation: 一个实施例公开了一种用于将集成电子设备的盖焊接到支撑层的方法，包括以下步骤：提供支撑层; 提供包括第一材料的芯和第二材料的涂层的盖，所述第一和第二材料分别相对于焊料可润湿和不可湿润，所述涂层被布置为暴露所述第一材料的表面 核心; 将盖与支撑层联接; 并通过焊料将芯的表面焊接到支撑层。

    METHOD FOR STRIP TESTING OF MEMS DEVICES, TESTING STRIP OF MEMS DEVICES AND MEMS DEVICE THEREOF
    9.
    发明申请
    METHOD FOR STRIP TESTING OF MEMS DEVICES, TESTING STRIP OF MEMS DEVICES AND MEMS DEVICE THEREOF 有权
    MEMS器件的条带测试方法，MEMS器件的测试条和其MEMS器件

    公开(公告)号：US20130082258A1

    公开(公告)日：2013-04-04

    申请号：US13629157

    申请日：2012-09-27

    Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics Ltd (Malta)

    Inventor： Mark Anthony Azzopardi ,  Conrad Cachia ,  Stefano Pozzi

    IPC: H01L21/50 ,  H01L23/58

    CPC classification number: B81C99/004 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for testing a strip of MEMS devices, the MEMS devices including at least a respective die of semiconductor material coupled to an internal surface of a common substrate and covered by a protection material; the method envisages: detecting electrical values generated by the MEMS devices in response to at least a testing stimulus; and, before the step of detecting, at least partially separating contiguous MEMS devices in the strip. The step of separating includes defining a separation trench between the contiguous MEMS devices, the separation trench extending through the whole thickness of the protection material and through a surface portion of the substrate, starting from the internal surface of the substrate.

    Abstract translation: 一种用于测试MEMS器件条的方法，所述MEMS器件至少包括耦合到公共衬底的内表面并由保护材料覆盖的半导体材料的相应裸片; 该方法设想：响应于至少一个测试刺激来检测由MEMS器件产生的电值; 并且在所述检测步骤之前，至少部分地分离所述条带中的连续的MEMS器件。 分离步骤包括在连续的MEMS器件之间限定分离沟槽，分离沟槽从衬底的内表面开始延伸穿过保护材料的整个厚度并穿过衬底的表面部分。

    SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY PROCESS
    10.
    发明申请
    SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY PROCESS 有权
    半导体集成器件组装工艺

    公开(公告)号：US20130214368A1

    公开(公告)日：2013-08-22

    申请号：US13772210

    申请日：2013-02-20

    Applicant: STMicroelectronics Ltd (Malta) ,  STMicroelectronics S.r.l.

    Inventor： Kenneth Fonk ,  Luca Maggi ,  Jeremy Spiteri

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0045 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00325 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step.

    Abstract translation: 集成装置的组装方法设想：提供集成至少一个电子电路并具有顶表面的第一半导体材料体; 提供集成至少一个微机电结构并具有底表面的第二半导体材料; 并且在所述第一主体的顶表面和所述第二主体的所述底表面之间插入所述第一主体上的所述第二主体的弹性间隔件材料。 在层叠步骤之前，该步骤被设想为以第一体积的方式在第一体的顶表面处提供约束和间隔结构，该限制和间隔结构在其内部限定弹性间隔物材料，并且将第二体与第一体 身体在堆叠步骤。

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