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公开(公告)号：JP2019047102A
公开(公告)日：2019-03-22
申请号：JP2017244817
申请日：2017-12-21
Applicant: 同泰電子科技股▲ふん▼有限公司 , UNIFLEX Technology Inc.
Abstract: 【課題】本発明は、大型のフレキシブル回路基板上で互いに接続する多段回路を形成できるフレキシブル回路基板及びその製造方法を提供することを目的とする。 【解決手段】 フレキシブル回路基板は、フレキシブル基材ロール及びパターン回路層を含む。フレキシブル基材ロールは、フレキシブル基材から巻き取られてなり、フレキシブル基材の長さは実質的に500mmより大きい。パターン回路層は、複数の第一の回路部と、複数の第二の回路部と、それぞれ第一の回路部及び第二の回路部の間に接続される複数のパッド部とを含み、各第一の回路部はそれぞれ対応する第二の回路部と実質的に共線であり、対応するパッド部を介して互いに接続される。 【選択図】図4
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公开(公告)号：JP6500079B2
公开(公告)日：2019-04-10
申请号：JP2017244817
申请日：2017-12-21
Applicant: 同泰電子科技股▲ふん▼有限公司 , UNIFLEX Technology Inc.
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公开(公告)号：US20200305276A1
公开(公告)日：2020-09-24
申请号：US16894883
申请日：2020-06-08
Applicant: UNIFLEX Technology Inc.
Inventor： Cheng-I Tu , Ying-Hsing Chen , Meng-Huan Chia , Hsin-Ching Su , Yi-Chun Liu , Cheng-Chung Lai , Yuan-Chih Lee
Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
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公开(公告)号：US10333042B1
公开(公告)日：2019-06-25
申请号：US16040549
申请日：2018-07-20
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Meng-Huan Chia , Cheng-I Tu , Yuan-Chih Lee
IPC: H01L33/62 , H01L25/075 , H01L23/14 , H01L23/538 , H01L23/00 , B32B15/08 , B32B15/20 , B32B27/28 , H01L33/64
Abstract: A package structure for a display includes a flexible base film, a plurality of pads, a light-emitting component array, and a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. A material of the flexible base film includes polyimide and black fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component array includes a plurality of light-emitting component sets disposed on the pads and electrically connected to the pads. Each light-emitting component set includes a plurality of light-emitting components having different colors. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.
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公开(公告)号：US10306767B2
公开(公告)日：2019-05-28
申请号：US15834066
申请日：2017-12-07
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Yuan-Chih Lee , Hung-Tai Ting
Abstract: A manufacturing method of a substrate structure including vias includes the following steps. A substrate is provided, wherein a material of the substrate includes polyimide. An etching stop layer is formed on the substrate, wherein the etching stop layer covers two opposite surfaces of the substrate. A patterned process is performed on the etching stop layer to form a plurality of openings exposing a part of the substrate. An etching process is performed on the substrate to remove the part of the substrate exposed by the openings and form a plurality of vias.
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Patent Agency Ranking
公开(公告)号：US20170156205A1
公开(公告)日：2017-06-01
申请号：US15284510
申请日：2016-10-03
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Chiu-Pei Huang , Pei-Hao Hung , Yuan-Chih Lee
CPC classification number: H05K1/0278 , H05K1/115 , H05K3/064 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4652 , H05K3/4664 , H05K3/4691 , H05K2201/0195 , H05K2201/09127 , H05K2201/09509 , H05K2201/09545 , H05K2203/0502
Abstract: A rigid-flex circuit board includes a flexible circuit board, a plurality of patterned photo-imageable substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface. The exposed regions are respectively located at the top surface and the bottom surface. The patterned photo-imageable substrates are disposed on the top surface and the bottom surface respectively. Each patterned photo-imageable substrate includes an opening exposing the corresponding exposed region. Each patterned photo-imageable substrate includes photo-sensitive material. The patterned circuit layers are disposed on the patterned photo-imageable substrates respectively and expose the exposed regions. A manufacturing method of the rigid-flex circuit board is also provided.
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公开(公告)号：US11140773B2
公开(公告)日：2021-10-05
申请号：US16894882
申请日：2020-06-08
Applicant: UNIFLEX Technology Inc.
Inventor： Cheng-I Tu , Ying-Hsing Chen , Meng-Huan Chia , Hsin-Ching Su , Yi-Chun Liu , Cheng-Chung Lai , Yuan-Chih Lee
Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
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公开(公告)号：US20200305275A1
公开(公告)日：2020-09-24
申请号：US16894882
申请日：2020-06-08
Applicant: UNIFLEX Technology Inc.
Inventor： Cheng-I Tu , Ying-Hsing Chen , Meng-Huan Chia , Hsin-Ching Su , Yi-Chun Liu , Cheng-Chung Lai , Yuan-Chih Lee
Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
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公开(公告)号：US10580350B2
公开(公告)日：2020-03-03
申请号：US15951548
申请日：2018-04-12
Applicant: UNIFLEX Technology Inc.
Inventor： Yuan-Chih Lee , Chia-Ming Li
IPC: G09G3/32 , H01L25/075 , H05B33/08 , H01L33/52
Abstract: A micro light emitting diode module contains: multiple flip-chip LEDs and a dielectric layer. The multiple flip-chip LEDs are arranged side by side. The flip-chip LEDs have a light emitting side and an electrical connecting side. The electrical connecting side of the flip-chip LEDs has a p-contact pad and an n pad. The dielectric layer is formed on the electrical connecting side of the flip-chip LEDs. The dielectric layer has multiple electric channels in which multiple electrical circuits are formed. The electrical circuits are corresponded to the p-contact pads and the n-contact pads of the flip-chip LEDs respectively, and each electrical circuit is electrically connected to its corresponding p-contact pad or n-contact pad. By reconstruction of circuits on LED array, the present invention not only has high processing yield, but also significantly reduces the manufacturing time. A method for making the micro light emitting diode module is also provided.
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公开(公告)号：US09860978B1
公开(公告)日：2018-01-02
申请号：US15458047
申请日：2017-03-14
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Pei-Hao Hung , Ying-Hsing Chen , Chiu-Pei Huang , Min-Ming Tsai , Shan-Yi Tseng , Yuan-Chih Lee
CPC classification number: H05K1/0281 , H05K1/0277 , H05K1/0306 , H05K1/05 , H05K1/115 , H05K3/4691 , H05K2201/041
Abstract: A rigid-flex board structure includes a flexible printed circuit (FPC) board, a substrate, a reinforcing layer, a patterned circuit layer and a plurality of conductive vias. The FPC board includes at least one exposing area. The substrate is disposed on the FPC board and includes an opening exposing the exposing area. The reinforcing layer is embedded in the substrate and a rigidity of a material of the reinforcing layer is greater than a rigidity of a material of the substrate. The patterned circuit layer is disposed on the substrate. The conductive vias are configured to electrically connect the patterned circuit layer and the FPC board.
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