Abstract:
PURPOSE: A wafer surface inspection is provided to improve the accuracy of a surface analysis in wafer by emitting the right which is emitted from a light source of an optical microscope as an angle of incidence of a prescribed range which is not perpendicularity. CONSTITUTION: A supporting plate(10) is located at the lower part of a projection lens of an optical microscope. A search point controlling part(20) is connected to the upper part of the supporting plate. A wafer which inspects a surface is horizontally arranged on the search point controlling part. The search point controlling part controls a search point about a wafer surface of the right which is emitted from the optical microscope through the projection lens. A search angle controlling part(30) is connected to between the search spot controlling part and the supporting plate and controls a search angle about a search spot of the right.
Abstract:
The present invention relates to an alumina sintering furnace structure that sinters high purity alumina used for single crystal growth, and the alumina sintering furnace structure includes: a chamber; a pot furnace for receiving alumina powder to the chamber to conduct the sintering for the alumina powder; heating means having a heating material adapted to emit high temperature heat for the alumina sintering to the pot furnace, the heating material producing the heat if power is supplied thereto by means of a terminal; a first reflection plate adapted to reflect the high temperature heat emitted from the heating means around the heating means onto the pot furnace; and vacuum means connected to the interior of the chamber to maintain the interior of the chamber to a vacuum state and to accelerate the alumina sintering. Accordingly, through the formation of the heating means formed of the heating material made of tungsten or molybdenum and the first reflection plate made of yttria-stabilized zirconia, the alumina powder can be sintered to a high temperature within a short period of time, thus remarkably reducing the work time, improving the productivity and minimizing the production cost, without having any separate high expensive equipment. Further, the alumina powder can be sintered at the high temperature, thus achieving tight tissues to suppress the formation of bubbles acting as a main defect upon the formation of single crystal, improving the purity of the alumina itself to remove the impurities from the single crystal, and providing a high quality aluminum product advantageous to the single crystal growth.
Abstract:
PURPOSE: A method of manufacturing a diamond wire for processing semiconductor materials and a diamond wire manufactured by the same are provided to minimize the contamination of materials due to slurry by employing a diamond wire in which diamond abrasive particles used in multi-wire saw cutting are attached to a wire. CONSTITUTION: A method of manufacturing a diamond wire for processing semiconductor materials comprises steps of: feeding a wire(S1), coating a UV hardener on the surface of a wire(S2), attaching diamond particles to the surface of the wire in which the UV hardener is spread(S3), and hardening the UV hardener(S5). The wire feed step includes a cleaning process for removing organic materials or other foreign substances from the surface of a wire, a heat treatment process for heat-treating the wire at 100°C-130°C, and a surface activation process for passing the wire through diluted acid solution of 5%-20%.
Abstract:
PURPOSE: An apparatus for growing a single crystal is provided to maintain a proper temperature for growing the single crystal in a chamber for growing the single crystal by automatically controlling the flow of cooling water inputted to the chamber. CONSTITUTION: A cooling water manufacturing device(100) constantly controls the temperature of cooling water and discharges the cooling water. A cooling water distributing unit(200) distributes cooling water supplied from the cooling water manufacturing device. A chamber(400) for growing a single crystal includes one or more water cooling tubes. A cooling water supply tube(300) transfers the distributed cooling water to the water cooling tube. A flow control device(320) is buried in the cooling water supply tube.