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公开(公告)号：JP5181415B2
公开(公告)日：2013-04-10
申请号：JP2005286715
申请日：2005-09-30
Applicant: 富士通株式会社
IPC: H05K1/02
CPC classification number: H05K1/0263 , H01L24/17 , H01L2224/16235 , H05K1/0262 , H05K2201/0367 , H05K2201/09054 , H05K2201/09309 , H05K2201/10272 , H05K2201/10545 , H05K2201/10734
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公开(公告)号：JPWO2005013657A1
公开(公告)日：2006-09-28
申请号：JP2005507394
申请日：2003-08-01
Applicant: 富士通株式会社
IPC: H05K7/20 , F28D15/02 , H01L23/31 , H01L23/367 , H01L23/427 , H05K1/02 , H05K7/18
CPC classification number: H05K1/0206 , H01L23/3128 , H01L23/3677 , H01L2224/48227 , H01L2924/15311 , H05K2201/10416
Abstract: 本発明による電子機器の冷却装置は、第1面(2A)及び第2面(2B)並びに第1面から第2面に貫通する開口(2C)を有するプリント配線板(2)と、開口内に充填された熱伝導率の良好な材質からなるフィラー(4)と、フィラーに熱的に接触するようにプリント配線板の第1面に実装された発熱部品(6)と、フィラーに熱的に接触するようにプリント配線板の第2面に設けられた熱拡散板(20)と、熱拡散板に熱的に接触するように設けられたヒートパイプ(22)とを備えている。この構成によると、装置の小型化に適した効果的な発熱部品の冷却が可能な冷却装置を提供することができる。
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公开(公告)号：JP4338545B2
公开(公告)日：2009-10-07
申请号：JP2004042877
申请日：2004-02-19
Applicant: 富士通株式会社
IPC: H01G2/06 , H01G4/228 , H01G4/252 , H01G4/35 , H01G4/38 , H01L21/60 , H01L23/12 , H01L23/32 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/16
CPC classification number: H01G4/35 , H01L23/49827 , H01L23/50 , H01L24/81 , H01L2224/16 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/19103 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H05K1/0219 , H05K1/0231 , H05K1/162 , H05K2201/10378 , H05K2201/10734 , H01L2924/00
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Patent Agency Ranking
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7.发明专利
公开(公告)号：JP5293787B2
公开(公告)日：2013-09-18
申请号：JP2011189221
申请日：2011-08-31
Applicant: 富士通株式会社
IPC: H05K1/02
Abstract: PROBLEM TO BE SOLVED: To solve a deterioration of a noise margin of a power supply system following a reduction in drive voltage of an electric component, and a noise problem between power sources and ground following a simultaneous switching waveform. SOLUTION: The capacitor built-in type power supply device for the electric component (10) comprises: the power sources (44, 47) which supply power; a printed board (50) which has a built-in signal line pattern; a power supply bar (48) which has a conductive projection provided in a shape and at a position corresponding to the shape and the position to an electrode of the electric component, and is provided outside the printed board; a ground bar (49) provided outside the printed board; and a high dielectric layer (55) provided at a part corresponding to the electric component between the power supply bar and the ground bar. Power from the power sources is supplied to the electrode of the electric component via the power supply bar and the ground bar. COPYRIGHT: (C)2012,JPO&INPIT
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公开(公告)号：JP5082970B2
公开(公告)日：2012-11-28
申请号：JP2008078454
申请日：2008-03-25
Applicant: 富士通株式会社
CPC classification number: H01L23/433 , F28F2013/005 , F28F2255/02 , H01L2924/0002 , H05K1/144 , H01L2924/00
Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.
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公开(公告)号：JP3910815B2
公开(公告)日：2007-04-25
申请号：JP2001272600
申请日：2001-09-07
Applicant: 富士通株式会社
CPC classification number: G02B6/3897 , G02B6/4453
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公开(公告)号：JP3701481B2
公开(公告)日：2005-09-28
申请号：JP30439498
申请日：1998-10-26
Applicant: 富士通株式会社
CPC classification number: H04Q1/10 , H01R12/52 , H01R12/716 , H01R2201/16 , H04Q2201/12 , H05K7/1458 , Y10S439/908
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