-
Patent Agency Ranking
公开(公告)号：CN101128087A
公开(公告)日：2008-02-20
申请号：CN200710084712.6
申请日：2007-02-26
Applicant: 富士通株式会社
CPC classification number: H01L21/563 , H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/0401 , H01L2224/0558 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/26175 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75743 , H01L2224/83096 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H05K3/28 , H05K3/305 , H05K2201/09772 , H05K2201/09781 , H05K2201/09909 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00 , H01L2924/01031 , H01L2924/00012 , H01L2924/3512
Abstract: 本发明提供一种用于提高半导体器件的可靠性和效率的半导体衬底和半导体器件。在要以倒装芯片方法安装半导体元件的半导体衬底中，至少一个岛形导电层和布线层选择性地设置在要安装半导体元件的元件安装区上，并且在岛形导电层上设置绝缘树脂层。在元件安装区，通过粘附材料将半导体元件固定到电路衬底以制造半导体器件。这样，抑制了半导体器件内部的布线层的分层，并抑制了电极的损坏。从而实现了具有高可靠性的电路衬底和具有该电路衬底的半导体器件。
-
公开(公告)号：CN1893051A
公开(公告)日：2007-01-10
申请号：CN200610100025.4
申请日：2006-06-28
Applicant: 富士通株式会社
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L23/3128 , H01L21/563 , H01L23/49811 , H01L23/49833 , H01L24/13 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05684 , H01L2224/1134 , H01L2224/13027 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14 , H01L2224/1411 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17107 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/81194 , H01L2224/81203 , H01L2224/81801 , H01L2225/06558 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/351 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05541 , H01L2224/05005
Abstract: 一种半导体器件，包括在其主表面上设置有外部连接端子焊盘的半导体元件。该半导体元件经由多个凸状外部连接端子和一个连接部件连接到支撑板上的导电层，所述多个凸状外部连接端子设置于该外部连接端子焊盘上，并且该连接部件同时覆盖所述多个凸状外部连接端子。
-
公开(公告)号：CN1633704A
公开(公告)日：2005-06-29
申请号：CN02829251.0
申请日：2002-08-09
Applicant: 富士通株式会社
IPC: H01L21/60
CPC classification number: H01L29/0657 , H01L23/3128 , H01L23/4334 , H01L24/81 , H01L25/065 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2924/01079 , H01L2924/12044 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511
Abstract: 半导体芯片(10)通过表面形成的涂层材料(11)变形为大致圆筒形后固定。变形的半导体芯片(10)与内插板(12)倒装芯片连接。半导体芯片(10)在内插板(12)上用封装树脂(13)封装。内插板(12)的背面配置有作为外部连接端子的焊锡球(14)。
-
公开(公告)号：CN101236946A
公开(公告)日：2008-08-06
申请号：CN200810003253.9
申请日：2008-01-28
Applicant: 富士通株式会社
IPC: H01L23/488 , H01L23/498 , H01L23/10 , H01L21/31 , H01L23/13 , H01L25/00 , H05K1/02 , H05K1/18
CPC classification number: H01L24/32 , H01L21/563 , H01L23/564 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/75743 , H01L2224/81203 , H01L2224/81801 , H01L2224/83051 , H01L2224/83192 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 一种布线板和半导体器件，在所述布线板中电子部件经由凸点安装在主表面上，并且所述电子部件周围的至少一部分被树脂覆盖，所述布线板包括：阻挡物，设置在所述布线板的主表面上安装所述电子部件的区域周围的至少一部分；其中，所述阻挡物与所述树脂接触的表面具有连续形成曲线的结构。
-
公开(公告)号：CN100401486C
公开(公告)日：2008-07-09
申请号：CN02829251.0
申请日：2002-08-09
Applicant: 富士通株式会社
IPC: H01L21/60
CPC classification number: H01L29/0657 , H01L23/3128 , H01L23/4334 , H01L24/81 , H01L25/065 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2924/01079 , H01L2924/12044 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511
Abstract: 半导体芯片(10)通过表面形成的涂层材料(11)变形为大致圆筒形后固定。变形的半导体芯片(10)与内插板(12)倒装芯片连接。半导体芯片(10)在内插板(12)上用封装树脂(13)封装。内插板(12)的背面配置有作为外部连接端子的焊锡球(14)。
-
-
-
-
Search Results
5
records
(took 0.086 seconds)
