Patent search ap:("富士通株式会社") AND inv:"织茂政一" Page 1

1.

发明授权
具有树脂封壳的元件及其制作方法失效转让

公开(公告)号：CN1307698C

公开(公告)日：2007-03-28

申请号：CN200410047635.3

申请日：1996-11-08

Applicant: 富士通株式会社

Inventor： 米田义之 , 辻和人 , 织茂政一 , 迫田英治 , 野本隆司 , 小野寺正德 , 河西纯一

IPC: H01L21/50 , H01L21/56 , H01L21/60 , H01L21/48

CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)，树脂凸部上设有相应的金属膜(113，155，315)。芯片的电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)电连接，每个所述树脂凸部都被所述金属膜整体地覆盖。

2.

发明授权
具有树脂封壳的元件失效转让

公开(公告)号：CN1215537C

公开(公告)日：2005-08-17

申请号：CN96114520.X

申请日：1996-11-08

Applicant: 富士通株式会社

Inventor： 米田义之 , 辻和人 , 织茂政一 , 迫田英治 , 野本隆司 , 小野寺正德 , 河西纯一

IPC: H01L21/31 , H01L21/56

CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)，树脂凸部上设有相应的金属膜(113，155，315)。芯片的电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)电连接，每个所述树脂凸部都被所述金属膜整体地覆盖。

3.

发明公开
具有树脂封壳的元件及其制作方法失效转让

公开(公告)号：CN1549317A

公开(公告)日：2004-11-24

申请号：CN200410047635.3

申请日：1996-11-08

Applicant: 富士通株式会社

Inventor： 米田义之 , 辻和人 , 织茂政一 , 迫田英治 , 野本隆司 , 小野寺正德 , 河西纯一

IPC: H01L21/50 , H01L21/56 , H01L21/60 , H01L21/48

CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)，树脂凸部上设有相应的金属膜(113，155，315)。芯片的电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)电连接，每个所述树脂凸部都被所述金属膜整体地覆盖。

4.

发明公开
具有树脂封壳的元件及其制作方法失效转让

公开(公告)号：CN1152797A

公开(公告)日：1997-06-25

申请号：CN96114520.X

申请日：1996-11-08

Applicant: 富士通株式会社

Inventor： 米田义之 , 辻和人 , 织茂政一 , 迫田英治 , 野本隆司 , 小野寺正德 , 河西纯一

IPC: H01L21/56 , H01L23/28

CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)。树脂凸部上设有相应的金属膜(113，155，315)。芯片电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)接通。

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