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公开(公告)号：KR101278173B1
公开(公告)日：2013-07-26
申请号：KR1020130044780
申请日：2013-04-23
Applicant: 국방과학연구소
Abstract: PURPOSE: A method for manufacturing molybdenum (Mo)-silicon (Si)-boron (B) alloy powder is provided to utilize a chemo-mechanical process in which powder is consecutively compounded uniformly, miniaturized, reduced, and synthesized, thereby simply manufacturing the alloy powder. CONSTITUTION: A method for manufacturing molybdenum (Mo)-silicon (Si)-boron (B) alloy powder includes: a step of manufacturing composite powder with ball-milling molybdenum trioxide (MoO3), silicon nitride (SiN4), and boron nitride (BN); a step of reducing MoO3 to Mo with heating the composite powder under a hydrogen atmosphere; and a step of forming a Mo-Si-B intermetallic compound phase with continuously heating the composite powder in which MoO3 is reduced to Mo. [Reference numerals] (AA) Start; (BB) End; (S100) Prepare MoO3, Si3N4, and BN powder; (S110) Manufacture composite powder using MoO3, Si3N4, and BN powder; (S120) Reduce the composite powder by heating; (S130) Form an Mo-Si-B intermetallic compound by heating the composite powder
Abstract translation: 目的：提供钼（Mo） - 硅（Si） - 硼（B）合金粉末的制造方法，以利用化学机械过程，其中粉末连续地均匀混合，小型化，还原和合成，从而简单地制造 合金粉。 构成：制造钼（Mo） - 硅（Si） - 硼（B）合金粉末的方法包括：制备具有球磨三氧化钼（MoO 3），氮化硅（SiN 4）和氮化硼 BN）; 在氢气氛下加热复合粉末，将MoO 3还原成Mo的步骤; 以及将MoO 3还原为Mo的复合粉末连续加热形成Mo-Si-B金属间化合物相的工序。 （BB）结束; （S100）制备MoO 3，Si 3 N 4和BN粉末; （S110）使用MoO3，Si3N4和BN粉末制造复合粉末; （S120）通过加热减少复合粉末; （S130）通过加热复合粉末形成Mo-Si-B金属间化合物
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公开(公告)号：KR1020040098935A
公开(公告)日：2004-11-26
申请号：KR1020030031266
申请日：2003-05-16
Applicant: 국방과학연구소
IPC: G06F13/00
Abstract: PURPOSE: An HPI(Host Port interface)-EMIF(External Memory Interface) bridge for a high-performance parallel signal processing system is provided to process a signal effectively and fast by downloading a program and data needed for execution on an external system to a DSP(Digital Signal Processor), and executing the DMA(Direct Memory Access) transfer between local memories connected to the DSP in parallel. CONSTITUTION: A PCI(Peripheral Component Interconnect) controller(100) includes a PCI master controller(110) initializing a PCI bus, and sending an address and data to the PCI bus when the HPI-EMIF bridge is operated as a master, a PCI target controller(120) sending a PCI signal received from the PCI bus when the HPI-EMIF bridge is operated as a target, and a PCI configuration register(130) storing the data related to the DMA transfer between local memories. An internal controller(200) includes a DMA controller(210) controlling the DMA transfer between local memories, an SDRAM controller(220) controlling access of the local memory, and an HPI controller(230) controlling the HPI of the DSP in order to download the program and the data to the DSP from an external processor.
Abstract translation: 目的：提供用于高性能并行信号处理系统的HPI（主机端口接口）-EMIF（外部存储器接口）桥接器，用于通过将外部系统上执行所需的程序和数据下载到 DSP（数字信号处理器），并且并行地连接到DSP的本地存储器之间执行DMA（直接存储器访问）传送。 构成：当HPI-EMIF桥作为主机操作时，PCI（外围组件互连）控制器（100）包括PCI主控制器（110）初始化PCI总线，以及向PCI总线发送地址和数据，PCI 目标控制器（120）当HPI-EMIF桥作为目标时发送从PCI总线接收的PCI信号;以及PCI配置寄存器（130），存储与本地存储器之间的DMA传输相关的数据。 内部控制器（200）包括控制本地存储器之间的DMA传输的DMA控制器（210），控制本地存储器访问的SDRAM控制器（220）和控制DSP的HPI的HPI控制器（230），以便 从外部处理器将程序和数据下载到DSP。
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公开(公告)号：KR1019950007640B1
公开(公告)日：1995-07-13
申请号：KR1019920010786
申请日：1992-06-20
Applicant: 국방과학연구소
CPC classification number: B64G1/403 , F02K9/346 , F16J15/14 , Y10T29/49346
Abstract: coating a silicon sealant to a predetermined uniform thickness over the thermal insulation of the motor case and nozzle assembly; fastening a plurality of spacing bolts having threaded ends into the corresponding threaded spacing holes of the nozzle flange; aligning the nozzle assembly with the motor case such that an end of the after dome flange of the motor case is positioned over the first O-ring; maintaining the interior of the motor case at a primary vacuum pressure to move voids from the silicon sealant; applying a secondary vacuum pressure higher than the primary vacuum pressure to the interior of the motor case to move the nozzle assembly toward the motor case; and fastening the high strength bolts into the threaded holes of the motor case.
Abstract translation: 在电机壳体和喷嘴组件的隔热层上涂覆硅密封剂至预定的均匀厚度; 将具有螺纹端的多个间隔螺栓紧固到喷嘴凸缘的相应螺纹间隔孔中; 将喷嘴组件与电动机壳体对准，使得电动机壳体的后圆顶凸缘的端部位于第一O形环上方; 将电动机壳体的内部保持在初级真空压力下以从硅密封剂移动空隙; 将高于初级真空压力的二次真空压力施加到电动机壳体的内部，以使喷嘴组件朝向电动机壳体移动; 并将高强度螺栓紧固到电动机壳体的螺纹孔中。
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Patent Agency Ranking6.发明授权컴포넌트기반 통합 시뮬레이션 환경과 ＭＡＴＬＡＢ／ＳＩＭＵＬＩＮＫ 레거시 시뮬레이션 프로그램 간 연동방법 및 연동인터페이스 설계방법 有权基于组件的综合模拟环境与MATLAB / SIMULINK LEGACY模拟程序之间的交互的方法和用于交互的接口设计方法
公开(公告)号：KR101670307B1
公开(公告)日：2016-10-31
申请号：KR1020150133348
申请日：2015-09-21
Applicant: 국방과학연구소
Abstract: 본발명은컴포넌트기반통합시뮬레이션환경(AddSIM)과 MATLAB/SIMULINK 레거시시뮬레이션프로그램간 연동방법을제공하는것이가능한시뮬레이션시스템및 그연동방법에관한것이다. 본발명의레거시시뮬레이션프로그램은, MATLAB/SIMULINK환경에서개발되어레거시시뮬레이션엔진을보유하여단독으로시뮬레이션을수행하는레거시모델을포함한다. 또한, 본발명의컴포넌트기반통합시뮬레이션환경은동적재구성가능한컴포넌트로구성된 AddSIM 플레이어를포함한다. 상기 AddSIM 플레이어들과레거시모델간의연동을위한데이터교환과시간동기화는컴포넌트기반통합시뮬레이션환경(AddSIM)의시뮬레이션커널의제어하에수행된다.
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公开(公告)号：KR102211025B1
公开(公告)日：2021-02-02
申请号：KR1020190070917
申请日：2019-06-14
Applicant: 국방과학연구소
Abstract: 본발명의일 실시예에따른소프트웨어제품라인기반의무기체계소프트웨기술문서생성방법은, 생성하고자하는무기체계소프트웨어의특징(Feature)를입력받는단계; 미리저장된자산(Asset) 중상기입력받은특징에대응되는관심자산을확인하는단계; 및상기확인된관심자산을분석하여미리정해진기술문서양식에따라무기체계소프트웨어기술문서를생성하는단계를포함한다.
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公开(公告)号：KR101056682B1
公开(公告)日：2011-08-12
申请号：KR1020110032911
申请日：2011-04-08
Applicant: 국방과학연구소
CPC classification number: G06F9/455 , F41H13/00 , G06F9/4413
Abstract: PURPOSE: A weapon system simulation system based on component of standard structure pre-stored in a dispersed repository and simulation method thereof are provided to prevent overlap development of a model by considering a new model about re-usage possibility. CONSTITUTION: A component(122) manufactures a model(120) with reference to international standard. The model(120) includes a repository(121), a simulation engine(110), and an API interface(125). The repository(121) includes one or more players(123) consisted of component combinations. The simulation engine includes a kernel unit that manages and collects simulation result. The interface receives and transfers configuration information and control command of scenario from a user.
Abstract translation: 目的：提供一种基于分散存储库中预先存储的标准结构组件的武器系统仿真系统及其模拟方法，以通过考虑关于再利用可能性的新模型来防止模型的重叠发展。 规定：组件（122）参照国际标准生产型号（120）。 模型（120）包括储存库（121），模拟引擎（110）和API接口（125）。 存储库（121）包括由组件组合组成的一个或多个玩家（123）。 仿真引擎包括一个管理和收集仿真结果的内核单元。 接口从用户接收并传送场景的配置信息和控制命令。
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公开(公告)号：KR100496652B1
公开(公告)日：2005-06-22
申请号：KR1020030031266
申请日：2003-05-16
Applicant: 국방과학연구소
IPC: G06F13/00
Abstract: 본 발명은 고성능 병렬신호처리 시스템을 위한 HPI-EMIF 브릿지에 관한 것으로서, 외부 시스템에서 실행에 필요한 프로그램 및 데이터를 DSP(Digital Signal Processor)에 다운로드하고, 로컬 메모리를 액세스하고, 병렬적으로 연결된 DSP의 로컬 메모리간의 DMA(Direct Memory Access) 전송을 수행할 수 있도록 한 고성능 병렬신호처리 시스템을 위한 HPI-EMIF 브릿지에 관한 것이다. 이를 위해, 본 발명에 의한 고성능 병렬신호처리 시스템을 위한 HPI-EMIF 브릿지는 이 HPI-EMIF 브릿지가 마스터로 동작할 때 PCI 버스를 초기화하고 PCI 버스에 주소 및 데이터를 보내는 PCI 마스터 제어기와, 이 HPI-EMIF 브릿지가 타겟으로 동작할 때 PCI 버스로부터 수신한 PCI 신호를 후술하는 SDRAM 제어기 및 HPI 제어기에 보내는 PCI 타겟 제어기와, 로컬 메모리간 DMA 전송에 관련된 데이터를 저장하는 PCI 구성 레지스터를 포함하는 PCI 제어기와; 로컬 메모리간 DMA 전송을 제어하는 DMA 제어기와, 로컬 메모리의 액세스를 제어하는 SDRAM 제어기와, 외부 프로세서에서 DSP로 프로그램 및 데이터를 다운로드하기 위해 DSP의 HPI를 제어하는 HPI 제어기를 포함하는 내부 제어기를 포함한다.
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公开(公告)号：KR1020200143073A
公开(公告)日：2020-12-23
申请号：KR1020190070917
申请日：2019-06-14
Applicant: 국방과학연구소
Abstract: 본발명의일 실시예에따른소프트웨어제품라인기반의무기체계소프트웨기술문서생성방법은, 생성하고자하는무기체계소프트웨어의특징(Feature)를입력받는단계; 미리저장된자산(Asset) 중상기입력받은특징에대응되는관심자산을확인하는단계; 및상기확인된관심자산을분석하여미리정해진기술문서양식에따라무기체계소프트웨어기술문서를생성하는단계를포함한다.
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