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公开(公告)号：KR101325985B1
公开(公告)日：2013-11-07
申请号：KR1020120004033
申请日：2012-01-12
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J133/04 , C09J7/02
Abstract: 본 발명은 비할로겐계 난연성 접착제 조성물 및 이를 이용한 커버레이 필름에 관한 것이다.
본 발명의 비할로겐계 난연성 접착제 조성물은 (a) 비스페놀 A계 에폭시 수지 20 내지 50 중량% 및 인 함유 에폭시 수지 50 내지 80 중량%가 혼용된 비할로겐계 에폭시 수지 100 중량부에 대하여, (b) 아크릴계 열가소성 수지 30 내지 80 중량부, (c) 에폭시 수지경화용 경화제 1 내지 25 중량부, (d) 경화촉진제 0.1 내지 1 중량부 및 (e) 인계 반응형 유기난연제 2 내지 7 중량부로 이루어진 것으로서, 기본 수지인 에폭시 수지에 인 함유 에폭시 수지를 혼용하여 조성물의 인 함유량을 높이고, 반응형 인계 유기난연제를 사용함으로써, UL94 V-0 수준의 난연성을 구현할 수 있을 뿐 아니라, 우수한 접착성 및 내열성을 충족한다. 이에, 본 발명의 비할로겐계 난연성 접착제 조성물은 플렉서블 인쇄회로기판의 회로보호용도의 커버레이 필름으로 유용하게 활용될 수 있다.-
Patent Agency Ranking
公开(公告)号：KR1020130083317A
公开(公告)日：2013-07-22
申请号：KR1020120004033
申请日：2012-01-12
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J133/04 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J133/04 , C09J2201/60 , C09J2201/61 , C09J2205/102
Abstract: PURPOSE: A non-halogen group flame retardant adhesive composition is provided to increase the phosphorus content in the composition by mixing epoxy resin containing phosphorus in an epoxy resin, to implement the fire retardant of the UL94 V-0 level by using a reactive phosphorous organic flame retardant, and to satisfy the excellent adhesive property and heat resistance. CONSTITUTION: A non-halogen group flame retardant adhesive composition comprises (a) 100 parts by weight of non-halogen group epoxy resin in which 20-50 weight% of bisphenol-A epoxy resin and 50-80 weight% of phosphorus-including epoxy resin are mixed; (b) 30-80 parts by weight of acryl group thermoplastic resin; (c) 1-25 parts by weight of a curing agent for hardening epoxy resin; (d) 0.1-1 part by weight of a curing accelerator; and (e) 2-7 parts by weight of reactive phosphorus organic flame retardant. A cover lay film comprises an electric insulating base film; an adhesive layer formed with the non-halogen flame retardant adhesive composition on at least one side of the base film; and a release member with a release paper or a release film laminated on the adhesive layer.
Abstract translation: 目的：提供一种非卤素阻燃粘合剂组合物，通过将环氧树脂中含磷的环氧树脂混合来提高组合物中的磷含量，通过使用反应性磷有机物来实现UL94 V-0水平的阻燃剂 阻燃，并且具有优异的粘合性和耐热性。 构成：非卤素类阻燃剂粘合剂组合物包含（a）100重量份的非卤素环氧树脂，其中20-50重量％的双酚A环氧树脂和50-80重量％的含磷环氧树脂 树脂混合; （b）30-80重量份丙烯酰基热塑性树脂; （c）1-25重量份用于固化环氧树脂的固化剂; （d）0.1-1重量份固化促进剂; 和（e）2-7重量份的活性磷有机阻燃剂。 覆盖膜包括电绝缘基膜; 在所述基膜的至少一侧上形成有所述非卤素阻燃剂粘合剂组合物的粘合剂层; 以及具有层压在粘合剂层上的剥离纸或剥离膜的剥离构件。
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公开(公告)号：KR1020130086902A
公开(公告)日：2013-08-05
申请号：KR1020120008024
申请日：2012-01-26
Applicant: 도레이첨단소재 주식회사
IPC: C09J9/02 , C09J163/00 , C09J7/02 , H05K9/00
CPC classification number: C09J9/02 , C09J7/22 , C09J7/30 , C09J7/35 , C09J163/00 , C09J2201/602 , C09J2203/30 , C09J2205/102 , H05K9/0073 , H05K9/0081
Abstract: PURPOSE: A conducting flame retardant adhesive is provided to obtain VTM-O level flame retardancy by using a non-halogen-based organic flame retardant in a thermosetting epoxy base resin. CONSTITUTION: A conducting flame retardant adhesive comprises 40-250 parts by weight of conductive filler per 100.0 parts by weight of a binder resin composition. The binder resin composition includes 100.0 parts by weight of a thermosetting epoxy resin; 50-250 parts by weight of a carboxylic group-containing acrylonitrile-butadiene rubber; 3-15 parts by weight of a hardener for hardening an epoxy resin; 0.3-5 parts by weight of a hardening accelerator; and 5-50 parts by weight of a non-halogen-based organic flame retardant. The conducting filler consists of the mixed shape of a conducting wire and conducting metal powder.
Abstract translation: 目的：提供导电阻燃粘合剂，通过在热固性环氧树脂基树脂中使用非卤素类有机阻燃剂来获得VTM-O级阻燃性。 构成：导电阻燃粘合剂包含每100.0重量份粘合剂树脂组合物40至250重量份的导电填料。 粘合剂树脂组合物包含100.0重量份的热固性环氧树脂; 50-250重量份含羧基的丙烯腈 - 丁二烯橡胶; 3-15重量份用于硬化环氧树脂的硬化剂; 0.3-5重量份的硬化促进剂; 和5-50重量份的非卤素类有机阻燃剂。 导电填料由导线和导电金属粉末的混合形式组成。
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公开(公告)号：KR1020120081383A
公开(公告)日：2012-07-19
申请号：KR1020110002698
申请日：2011-01-11
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J109/02 , C09J11/00 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/35 , C09J11/00 , C09J109/02 , C09J2201/61 , C09J2203/30 , C09J2205/102
Abstract: PURPOSE: An adhesive composition for a halogen-free coverlay film is provided to have excellent conservation safety, not to need additional cost for storing a coverlay film, thereby capable of reducing cost. CONSTITUTION: An adhesive composition for a halogen-free coverlay film comprises a non-halogen-based epoxy resin, a carboxy group-containing acrylonitrile butadiene rubber, a hardener, 50-100.0 parts by weight of a latent hardener based on 100.0 parts by weight of the hardener, and non-halogen phosphorous-based flame retardant, and an inorganic filler. The non-halogen phosphorous-based epoxy resin comprises at least two epoxy groups per a molecule. The equivalent ratio of the non-halogen phosphorous-based epoxy resin is 230-1000 g/eq. The hardener is a mixture of two or more selected from an amine based resin, an acid anhydride based resin, or a phenol resin.
Abstract translation: 目的：提供一种无卤素覆盖膜用粘合剂组合物以具有优异的保存安全性，而不需要额外的成本来存储覆盖膜，从而能够降低成本。 构成：用于无卤素覆盖膜的粘合剂组合物包括非卤素类环氧树脂，含羧基的丙烯腈丁二烯橡胶，硬化剂，50-100.0重量份基于100.0重量份的潜在硬化剂 的固化剂和非卤素磷系阻燃剂，以及无机填料。 非卤素磷系环氧树脂每分子含有至少两个环氧基。 无卤磷系环氧树脂的当量比为230〜1000g / eq。 固化剂是选自胺系树脂，酸酐系树脂或酚醛树脂中的两种以上的混合物。
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公开(公告)号：KR1020110080421A
公开(公告)日：2011-07-13
申请号：KR1020100000628
申请日：2010-01-05
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J201/00 , C09J7/02 , H01L21/56
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/38 , C09J201/00 , C09J2203/30 , C09J2205/10 , H01L21/563
Abstract: PURPOSE: A halogen-free adhesive composition for a coverlay film is provided to satisfy fire retardancy, dhesive property, heat resistance, bleed-out resistance, and pattern filling properties. CONSTITUTION: A halogen-free adhesive composition for a coverlay film comprises (a) 100 parts by weight of a non-halogen based epoxy resin, (b) 50-250 parts by weight of a thermoplastic resin, (c) 0.01-10 parts by weight of an alkoxy silane coupling agent having one or more amino groups, (d) 1-50 parts by weight of a hardener, (e) 0.005-0.5 parts by weight of a curing accelerator, (f) 10-70 parts by weight of a halogen-free phosphorous-based flame retardant, and (g) 10-70 parts by weight of filler consisting of inorganic particles.
Abstract translation: 目的：提供一种用于覆盖膜的无卤粘合剂组合物，以满足阻燃性，粘合性，耐热性，耐渗出性和图案填充性能。 构成：用于覆盖膜的无卤粘合剂组合物包含（a）100重量份的非卤素基环氧树脂，（b）50-250重量份的热塑性树脂，（c）0.01-10份 重量的具有一个或多个氨基的烷氧基硅烷偶联剂，（d）1-50重量份的硬化剂，（e）0.005-0.5重量份的固化促进剂，（f）10-70重量份 无卤磷系阻燃剂的重量，（g）10-70重量份由无机颗粒组成的填料。
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公开(公告)号：KR1020110080420A
公开(公告)日：2011-07-13
申请号：KR1020100000627
申请日：2010-01-05
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J109/02 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/38 , C09J11/00 , C09J109/02 , C09J2203/30 , C09J2205/10
Abstract: PURPOSE: An adhesive composition is provided to maintain properties such as adhesive property, heat resistance, fire retardancy, and bleed-out resistance and to improve adhesive property using organic particles as a filler. CONSTITUTION: A halogen-free adhesive composition for a coverlay film comprises (a) 100 parts by weight of a non-halogen based epoxy resin, (b) 50-250 parts by weight of a carboxyl group-containing acrylonitrile-butadiene rubber, (c) 1-25 parts by weight of at least one or more hardeners selected from amine-, acid anhydride-, or phenol-based resins, (d) 0.05-0.5 parts by weight of one curing accelerator selected from imidazole-, phosphine-, or fluorinated boron metal compounds, (e) 5-60 parts by weight of a single or mixed non-halogen organic flame retardant selected from phosphorous, melamine, or phosphagen, and (f) 10-100.0 parts by weight of filler consisting of organic particles.
Abstract translation: 目的：提供粘合剂组合物以保持粘合性，耐热性，阻燃性和耐渗出性等特性，并且使用有机颗粒作为填料提高粘合性。 构成：用于覆盖膜的无卤粘合剂组合物包含（a）100重量份的非卤素系环氧树脂，（b）50〜250重量份的含羧基的丙烯腈 - 丁二烯橡胶（ c）1-25重量份的至少一种或多种选自胺，酸酐或酚醛树脂的硬化剂，（d）0.05-0.5重量份选自咪唑，膦 - 或氟化硼金属化合物，（e）5-60重量份选自磷，三聚氰胺或磷酸酯的单一或混合的非卤素有机阻燃剂，和（f）10-100.0重量份由 有机颗粒。
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