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公开(公告)号：KR1020130013649A
公开(公告)日：2013-02-06
申请号：KR1020110075380
申请日：2011-07-28
Applicant: 도레이첨단소재 주식회사
IPC: C09J175/06 , C09J7/02 , H05K3/28
CPC classification number: C09J175/06 , C09J7/22 , C09J7/38 , C09J7/401 , C09J2201/606 , C09J2201/622 , C09J2203/30 , C09J2205/10 , H05K3/284
Abstract: PURPOSE: An adhesive composition is provided to prevent the deformation and surface staining of a flexible circuit board by effectively controlling initial adhesion and adhesion after hot compression. CONSTITUTION: An adhesive composition contains: 6-15 parts by weight of a mixture of toluenediisocyanate-based and hexamethylenediisocyanate curing agents; and 0.1-10 parts by weight of a plasticizer with an ester value of 100 or more based on 100.0 parts by weight of an acrylic resin with a hydroxy group. The ratio of the toluenediisocyanate and hexamethylenediisocyanate in the isocyanate-based curing agent of the curing agent mixture is 1:0.5-1:6. A flexible circuit board protection film consists of an adhesive layer spread on one side or both sides, and the adhesive layer is formed of the adhesive composition.
Abstract translation: 目的：提供一种粘合剂组合物，通过有效地控制热压缩后的初始粘合和粘附性来防止柔性电路板的变形和表面污染。 构成：粘合剂组合物包含：6-15重量份的甲苯二异氰酸酯基和六亚甲基二异氰酸酯固化剂的混合物; 和0.1-10重量份基于100.0重量份具有羟基的丙烯酸树脂的酯值为100以上的增塑剂。 甲苯二异氰酸酯和六亚甲基二异氰酸酯在固化剂混合物的异氰酸酯类固化剂中的比例为1:0.5-1:6。 柔性电路板保护膜由在一侧或两侧扩散的粘合剂层组成，并且粘合剂层由粘合剂组合物形成。
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公开(公告)号：KR1020170107263A
公开(公告)日：2017-09-25
申请号：KR1020160030998
申请日：2016-03-15
Applicant: 도레이첨단소재 주식회사
Abstract: 본발명의일 실시예에따르면, 도어고정체에체결되는힌지브라켓, 상기힌지브라켓과힌지핀을통해힌지결합되며, 도어에체결되는도어브라켓을포함하며, 상기힌지핀은섬유강화플라스틱으로형성된도어힌지조립체를제공한다.
Abstract translation: 根据本发明的一个实施例，其通过铰链支架铰接一个门，铰链支架和铰链销被紧固到夹具，包括：门架被固定到所述门，所述门的铰链销是一种纤维增强塑料的形成 提供铰链组件。
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公开(公告)号：KR1020120085032A
公开(公告)日：2012-07-31
申请号：KR1020110006416
申请日：2011-01-21
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/14 , C09J7/02 , C09J163/00 , H01L21/56
CPC classification number: C09J133/14 , C09J7/35 , C09J7/385 , C09J7/40 , C09J163/00 , C09J2201/606 , C09J2201/61 , C09J2201/622 , C09J2203/30 , H01L21/566 , H01L21/568
Abstract: PURPOSE: An adhesive for protective film of flexible circuit board and a protection film for flexible printed circuit board using the same are provided to prevent surface contamination and wrinkle formation on the flexible circuit board. CONSTITUTION: An adhesive for protective film of flexible circuit board comprises an acrylic resin including a carboxylic acid functional group and polyfunctional epoxy based hardener having 3-5 epoxy functional groups. A flexible printed circuit board protection film comprises a base film and an adhesive layer in which the adhesive composition is spread on one side or both sides of the base film. The adhesive force between the base film and the adhesive layer after the hot pressing is lower than the adhesive force after the initial syndactylism. The ratio of the adhesive force satisfies the follow chemical formula 1 : 0.5
Abstract translation: 目的：提供柔性电路板用保护膜用粘合剂和使用其的柔性印刷电路板用保护膜，以防止柔性电路板上的表面污染和皱纹形成。 构成：柔性电路板用保护膜用粘合剂包括含有羧酸官能团的丙烯酸树脂和具有3-5个环氧官能团的多官能环氧基硬化剂。 柔性印刷电路板保护膜包括基膜和粘合剂组合物在基膜的一侧或两侧上扩散的粘合剂层。 热压后的基膜和粘合剂层之间的粘合力低于最初的联合作用后的粘合力。 粘合力的比例满足以下化学式1：0.5
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公开(公告)号：KR1020110072083A
公开(公告)日：2011-06-29
申请号：KR1020090128869
申请日：2009-12-22
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/08 , C09J7/02 , C09J11/06 , H05K3/46
CPC classification number: C09J7/38 , C09J7/385 , C09J11/06 , C09J2203/326 , H05K3/46
Abstract: PURPOSE: A surface protection film for a flexible printed circuit board is provided to minimize surface contamination caused by etchant impregnation in a patterning process and adhesive strength increase in a high temperature compression process. CONSTITUTION: A surface protection film for a flexible printed circuit board comprises a base film and an adhesive layer coated on one side or both sides of the base film. The adhesive layer is formed by an adhesive composition. The adhesive composition comprises an acrylic resin having a hydroxyl functional group and an isocyanate-based hardener, and 4-11 parts by weight of toluene diisocyanate- and hexamethylene diisocyanate-based hardener mixture based on 100 parts by weight of the acrylic resin.
Abstract translation: 目的：提供用于柔性印刷电路板的表面保护膜，以最小化在图案化过程中由蚀刻剂浸渍引起的表面污染和高温压缩过程中的粘合强度增加。 构成：用于柔性印刷电路板的表面保护膜包括基膜和涂覆在基膜的一侧或两侧上的粘合剂层。 粘合剂层由粘合剂组合物形成。 粘合剂组合物包含基于100重量份丙烯酸树脂的具有羟基官能团的丙烯酸树脂和异氰酸酯系硬化剂，以及4-11重量份的甲苯二异氰酸酯和六亚甲基二异氰酸酯系固化剂混合物。
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Patent Agency Ranking
公开(公告)号：KR101798532B1
公开(公告)日：2017-12-12
申请号：KR1020120008612
申请日：2012-01-27
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/04 , C09J175/04 , C09J11/04 , H01L23/373
Abstract: 본발명은열전도성과재작업성이우수한점착수지조성물및 이를이용한방열시트에관한것으로서, 아크릴계공중합체, 가교제, 무기입자및 가소제의혼합물로구성되며, 상기가소제로서아크릴계공중합체 100 중량부를기준으로 0.1 내지 15 중량부의, 에스테르값이 200 이상인가소제를함유함을특징으로하는방열시트용점착제조성물에관한것이다. 본발명에의한방열시트는열전도성및 접착력을효과적으로제어하여발열이심한전자제품의방열부재로사용되어열을효과적으로방출할수 있다. 뿐만아니라강한접착력으로인하여발열체와히트싱크를단단히접착시킬수 있어볼트, 너트와같은기타접합소재를제거하여공정을간소화할 수있다. 또한, 본발명의점착제조성물은고속박리에유리하여재작업성을증가시킬수 있다. 고속박리에대한저항성이작아재작업성이우수하여작업효율을높일수 있다.
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公开(公告)号：KR1020140086146A
公开(公告)日：2014-07-08
申请号：KR1020120156279
申请日：2012-12-28
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/02 , C09J201/00 , H04B1/38
CPC classification number: C09J7/22 , C09J7/385 , C09J7/40 , C09J201/00 , C09J2201/606 , C09J2203/318 , H04B1/3827
Abstract: Disclosed is an anti-scattering film which: is specialized in mobile devices such as smartphone, tablet PC, and the likes; includes a hard coating layer having HB to 5H of pencil hardness, 50-100° of surface contact angles, and 5-20 mm of elasticity, and an adhesive layer having 1000-1500 gf / 25mm of peel strength for a cover glass, thereby enhancing anti-scratch properties during a process; and has low contact angle, thereby enhancing adhesion between a printed layer and the hard coating layer during printing.
Abstract translation: 公开了一种抗散射膜，其专门用于诸如智能电话，平板电脑等移动设备; 包括具有铅笔硬度HB至5H，表面接触角为50-100°，弹性为5-20mm的硬涂层，以及覆盖玻璃的剥离强度为1000-1500gf / 25mm的粘合剂层，由此 在加工过程中增强抗划痕性能; 并且具有低接触角，从而在印刷期间增强印刷层和硬涂层之间的粘合性。
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公开(公告)号：KR1020130087327A
公开(公告)日：2013-08-06
申请号：KR1020120008612
申请日：2012-01-27
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/04 , C09J175/04 , C09J11/04 , H01L23/373
CPC classification number: C09J11/06 , C09J9/00 , C09J11/04 , C09J133/04 , H01L23/373
Abstract: PURPOSE: An adhesive composition is provided to effectively control adhesion and thermal conductivity, thereby emitting heat outside a heat-radiating unit when used in the heat-radiating unit. CONSTITUTION: An adhesive composition consists of the mixture of an acrylic copolymer, a crosslinking agent, an inorganic particle, and a plasticizer and includes 0.1-15 parts by weight of a plasticizer with an ester value of 200 or more based on 100.0 parts by weight of the acrylic copolymer as a plasticizer. The acrylic copolymer is obtained by copolymerizing three or more monomers selected from monomers without crosslinkable groups and monomers with crosslinkable groups. A heat-radiating sheet has an adhesive sheet which is obtained by coating the adhesive composition on one or both sides of a heat resistant film with a thickness of 1-100 micron.
Abstract translation: 目的：提供粘合剂组合物以有效地控制粘合和导热性，从而当在散热单元中使用时在散热单元外部发热。 组成：粘合剂组合物由丙烯酸共聚物，交联剂，无机颗粒和增塑剂的混合物组成，并且包含0.1-15重量份的基于100.0重量份的酯值为200以上的增塑剂 的丙烯酸共聚物作为增塑剂。 丙烯酸共聚物通过共聚三种或更多种选自不具有可交联基团的单体和具有可交联基团的单体而获得。 散热片具有通过将粘合剂组合物涂覆在厚度为1-100微米的耐热薄膜的一面或两面而获得的粘合片。
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公开(公告)号：KR101267828B1
公开(公告)日：2013-05-27
申请号：KR1020110075380
申请日：2011-07-28
Applicant: 도레이첨단소재 주식회사
IPC: C09J175/06 , C09J7/02 , H05K3/28
Abstract: 본발명에서는하이드록시관능기를가진아크릴계수지와이소시아네이트계경화제를함유하되, 상기아크릴계수지 100 중량부에대해톨루엔디이소시아네이트(TDI)계와헥사메틸렌디이소시아네이트(HDI)계경화제혼합물 6 내지 15 중량부, 에스테르값이 100 이상인가소제를 0.1~10 중량부를포함하는것을특징으로하는연성회로기판보호필름용점착제조성물및 이를이용한연성회로기판보호필름을제공한다. 본발명에의한연성회로기판보호필름은초기및 고온압축후의점착력및 고속박리특성을효과적으로제어하여피착제인연성회로기판의표면오염과변형을방지할수 있다. 뿐만아니라, 연성회로기판의회로인쇄공정중 식각액침투에의한표면오염및 고온압축공정에서의점착력상승을최소화하여박리후 연성제품에의점착제전사및 제품손상을방지할수 있으며고속박리성이우수하여작업성을높일수 있다.
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公开(公告)号：KR102131562B1
公开(公告)日：2020-07-07
申请号：KR1020190081287
申请日：2019-07-05
Applicant: 도레이첨단소재 주식회사
IPC: B64C27/473 , B64C39/02
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