公开(公告)号：KR1020130135110A

公开(公告)日：2013-12-10

申请号：KR1020130060985

申请日：2013-05-29

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 미즈나가고오이치 ,  도요자와아키히로 ,  오오시마가즈히코

IPC: H01L21/027 ,  H01L21/02

CPC classification number: H01L21/0273 ,  H01L21/02104 ,  H01L21/02255

Abstract: The present invention rapidly increases and decreases the temperature of a heat processing plate. The present invention relates to a heat processing device capable of performing heat processing by laminating a wafer (W) on the heat processing plate (50). The heat processing device comprises a second cooling plate (62), a first cooling plate (61), and a cooling plate elevating tool (60). The second cooling plate approaches and cools the heat processing plate (50). The first cooling plate cools the second cooling plate. The cooling plate elevating tool moves the second cooling plate (62) between a waiting position for cooling the first cooling plate (61) and a cooling position for cooling the heat processing plate (50). An elastic member (95) is installed between the second cooling plate (62) and the cooling plate elevating tool (60).

Abstract translation: 本发明快速增加和降低了热处理板的温度。 本发明涉及能够通过将热处理板（50）上的晶片（W）层叠来进行热处理的热处理装置。 热处理装置包括第二冷却板（62），第一冷却板（61）和冷却板升降工具（60）。 第二冷却板接近并冷却热处理板（50）。 第一冷却板冷却第二冷却板。 冷却板升降工具使第二冷却板（62）在用于冷却第一冷却板（61）的等待位置和用于冷却热处理板（50）的冷却位置之间移动。 弹性构件（95）安装在第二冷却板（62）和冷却板升降工具（60）之间。

公开(公告)号：KR102050107B1

公开(公告)日：2019-11-28

申请号：KR1020130060985

申请日：2013-05-29

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 미즈나가고오이치 ,  도요자와아키히로 ,  오오시마가즈히코

IPC: H01L21/027 ,  H01L21/02