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Patent Agency Ranking
公开(公告)号：KR2020140001829U
公开(公告)日：2014-03-28
申请号：KR2020130007670
申请日：2013-09-12
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/324
CPC classification number: H01L21/67098 , H01L21/324 , H01L21/67248
Abstract: 본 고안은, 웨이퍼를 균일하게 냉각시키고, 또한, 기판 처리 장치 전체의 스루풋 저하를 경감하는 온도 조정 플레이트를 구비하는 열처리 장치를 제공하는 것을 과제로 한다.
배치된 기판을 유지하면서 이 기판을 정해진 온도로 열처리하는 온도 조정 플레이트를 구비하는 열처리 장치에 있어서, 온도 조정 플레이트(71)는, 냉각 기체 유로(75)와, 온도 조정 플레이트의 둘레 가장자리부에 형성된 복수의 노치부(71a)와, 상기 복수의 노치부(71a)에는 냉각 기체를 토출하는 냉각 기체 토출구(75b)를 구비한다.-
公开(公告)号：KR1020130135110A
公开(公告)日：2013-12-10
申请号：KR1020130060985
申请日：2013-05-29
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027 , H01L21/02
CPC classification number: H01L21/0273 , H01L21/02104 , H01L21/02255
Abstract: The present invention rapidly increases and decreases the temperature of a heat processing plate. The present invention relates to a heat processing device capable of performing heat processing by laminating a wafer (W) on the heat processing plate (50). The heat processing device comprises a second cooling plate (62), a first cooling plate (61), and a cooling plate elevating tool (60). The second cooling plate approaches and cools the heat processing plate (50). The first cooling plate cools the second cooling plate. The cooling plate elevating tool moves the second cooling plate (62) between a waiting position for cooling the first cooling plate (61) and a cooling position for cooling the heat processing plate (50). An elastic member (95) is installed between the second cooling plate (62) and the cooling plate elevating tool (60).
Abstract translation: 本发明快速增加和降低了热处理板的温度。 本发明涉及能够通过将热处理板（50）上的晶片（W）层叠来进行热处理的热处理装置。 热处理装置包括第二冷却板（62），第一冷却板（61）和冷却板升降工具（60）。 第二冷却板接近并冷却热处理板（50）。 第一冷却板冷却第二冷却板。 冷却板升降工具使第二冷却板（62）在用于冷却第一冷却板（61）的等待位置和用于冷却热处理板（50）的冷却位置之间移动。 弹性构件（95）安装在第二冷却板（62）和冷却板升降工具（60）之间。
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公开(公告)号：KR1020120036258A
公开(公告)日：2012-04-17
申请号：KR1020110084531
申请日：2011-08-24
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: H01L21/67178 , H01L21/67109 , H01L21/6719 , H01L21/68707 , H01L21/6875 , H01L21/0274 , G03F7/202
Abstract: PURPOSE: A heat treatment apparatus and a heat treatment method thereof are provided to fix a substrate by adsorbing the substrate on a first batch support member before a second batch support member. CONSTITUTION: A first gap distance of a heat treatment plate is established from a substrate arrangement surface. A space from the first gap distance is absorbed by an absorption hole(63). The absorption hole is arranged on the substrate arrangement surface of the heat treatment plate. A first batch support member(64) is shrunk by the pressure of a substrate drawn by the absorption hole. A second batch support member(62) arranged on the heat treatment plate is touched to the substrate.
Abstract translation: 目的：提供一种热处理装置及其热处理方法，用于在第二批次支撑构件之前将基板吸附在第一批支撑构件上以固定基板。 构成：从衬底布置表面建立热处理板的第一间隙距离。 从第一间隙距离的空间被吸收孔（63）吸收。 吸收孔设置在热处理板的基板配置面上。 第一批支撑构件（64）通过由吸收孔拉出的基底的压力而收缩。 布置在热处理板上的第二批支撑构件（62）被触摸到基板。
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公开(公告)号：KR102050107B1
公开(公告)日：2019-11-28
申请号：KR1020130060985
申请日：2013-05-29
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027 , H01L21/02
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公开(公告)号：KR200482870Y1
公开(公告)日：2017-03-09
申请号：KR2020130007670
申请日：2013-09-12
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/324
Abstract: 본고안은, 웨이퍼를균일하게냉각시키고, 또한, 기판처리장치전체의스루풋저하를경감하는온도조정플레이트를구비하는열처리장치를제공하는것을과제로한다. 배치된기판을유지하면서이 기판을정해진온도로열처리하는온도조정플레이트를구비하는열처리장치에있어서, 온도조정플레이트(71)는, 냉각기체유로(75)와, 온도조정플레이트의둘레가장자리부에형성된복수의노치부(71a)와, 상기복수의노치부(71a)에는냉각기체를토출하는냉각기체토출구(75b)를구비한다.
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