公开(公告)号：KR1020110132995A

公开(公告)日：2011-12-09

申请号：KR1020110053168

申请日：2011-06-02

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 가와구찌요시히로 ,  사따께마사노리 ,  야히로슌이찌

IPC: H01L21/027

CPC classification number: H01L21/0274 ,  G03F1/60 ,  G03F7/202

Abstract: PURPOSE: A thermal processing device, a thermal processing method, and a recording medium are provided to suppress a change of a thermal processing temperature and make the line width of a wiring pattern between substrates uniform. CONSTITUTION: A substrate returning path(2) transfers a substrate(G) in X direction. The substrate returning path includes a cylindrical roller(20) which is expanded in Y direction. A chamber(8) forms a thermal processing space. The chamber includes a first chamber for forming a thermal processing space of a pre-heating unit(4) and a second chamber for forming a thermal processing space of a main heater unit. An outlet has a slit shape. The outlet is placed on the rear wall of the chamber.

Abstract translation: 目的：提供热处理装置，热处理方法和记录介质，以抑制热处理温度的变化，并使基板之间的布线图案的线宽均匀。 构成：基板返回路径（2）在X方向上传送基板（G）。 基板返回路径包括在Y方向上扩展的圆筒滚子（20）。 室（8）形成热处理空间。 该室包括用于形成预热单元（4）的热处理空间的第一室和用于形成主加热器单元的热处理空间的第二室。 出口具有狭缝形状。 出口被放置在室的后壁上。