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公开(公告)号：KR1020130044172A
公开(公告)日：2013-05-02
申请号：KR1020120116530
申请日：2012-10-19
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: H01L21/0274 , G03F7/2043
Abstract: PURPOSE: A coating processing apparatus is provided to reduce the stay time of an object substrate and the tack time of a process operation. CONSTITUTION: A nozzle(31) includes an outlet extended in the width direction of an object substrate(G). The nozzle discharges a process solution from the outlet to the object substrate. A nozzle transfer unit(32) moves the nozzle upwardly or downwardly. A nozzle maintenance unit(35) is installed in the lower part of a substrate transfer path(4) and controls the outlet of the nozzle. A space formation unit(21,22,23A,23B,30) forms an empty space in the upper and the lower part of a process stage. [Reference numerals] (32) Nozzle transfer unit
Abstract translation: 目的：提供涂布处理装置，以减少对象基板的停留时间和处理操作的粘着时间。 构成：喷嘴（31）包括沿对象基板（G）的宽度方向延伸的出口。 喷嘴将处理液从出口排出到对象基板。 喷嘴传送单元（32）使喷嘴向上或向下移动。 喷嘴维护单元（35）安装在基板输送路径（4）的下部，并控制喷嘴的出口。 空间形成单元（21,22,23A，23B，30）在处理台的上部和下部形成空的空间。 （附图标记）（32）喷嘴转印单元
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公开(公告)号：KR1020130044171A
公开(公告)日：2013-05-02
申请号：KR1020120116526
申请日：2012-10-19
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/677 , G02F1/13 , H01L21/027 , B05C5/00
CPC classification number: H01L21/67721 , B05C5/004 , G02F1/1303 , H01L21/0273 , H01L21/67748
Abstract: PURPOSE: A processing stage apparatus and a coating processing apparatus using the same are provided to prevent the contamination of an object substrate due to the maintenance process of a nozzle. CONSTITUTION: A substrate receiving part(2) includes a first substrate transfer unit(5B) which horizontally moves a substrate(G), and a first reciprocation unit(10). A first reciprocation unit moves the first substrate transfer unit in a substrate transfer direction. A substrate process unit includes a stage(15), a second substrate transfer unit(16), and a second reciprocation unit(24,25). A second substrate transfer unit moves up and down on the loading surface of a stage. A second reciprocation unit elevates the second substrate transfer unit on the loading surface of the stage. A substrate discharging unit includes a third substrate transfer part(29) and a third reciprocation unit(30).
Abstract translation: 目的：提供一种处理台装置和使用其的涂布处理装置，以防止由于喷嘴的维护过程而导致的对象基板的污染。 构成：基板收纳部（2）具有水平移动基板（G）的第一基板搬送单元（5B）和第一往复运动单元（10）。 第一往复运动单元使基板传送单元沿基板传送方向移动。 基板处理单元包括台（15），第二基板转印单元（16）和第二往复单元（24,25）。 第二基板传送单元在载物台的载荷表面上上下移动。 第二往复运动单元将第二基板输送单元提升在载物台的载荷表面上。 基板排出单元包括第三基板转印部（29）和第三往复运动单元（30）。
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公开(公告)号：KR1020110139663A
公开(公告)日：2011-12-29
申请号：KR1020110060677
申请日：2011-06-22
Applicant: 도쿄엘렉트론가부시키가이샤
Inventor： 가와구찌요시히로
IPC: G03F7/26
CPC classification number: G03F7/70791 , G03F7/38 , G03F7/70875 , H01L21/324 , H01L21/67098 , H01L21/6715
Abstract: PURPOSE: A thermal treating apparatus and a thermal treating method are provided to uniformly form the line-width of wiring patterns on the surface of a substrate and to suppress of the variation of thermal treating temperature in the substrate. CONSTITUTION: A horizontally transferring substrate along a substrate transferring path is detected before the substrate is introduced into a first chamber(S1). The transferring position of the substrate is recognized based on the detection of the substrate. The front region and the rear region of the substrate are divided. Cool air is sprayed toward the front region and the rear region of the substrate(S3). Cool air is stopped when the center region of the substrate is introduced into the first chamber(S4, S5). The temperatures of the front region and the rear region of the substrate are lower than the temperature of the center region of the substrate.
Abstract translation: 目的：提供一种热处理装置和热处理方法，以均匀地形成基板表面上的布线图案的线宽，并抑制基板中热处理温度的变化。 构成：在将基板引入第一室（S1）之前，检测沿着基板传送路径的水平传送基板。 基于基板的检测来识别基板的转印位置。 基板的前部区域和后部区域被划分。 冷却空气朝向基板的前部区域和后部区域喷射（S3）。 当基板的中心区域被引入第一室时，停止冷空气（S4，S5）。 衬底的前部区域和后部区域的温度低于衬底的中心区域的温度。
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Patent Agency Ranking
公开(公告)号：KR101259182B1
公开(公告)日：2013-04-29
申请号：KR1020060068243
申请日：2006-07-21
Applicant: 도쿄엘렉트론가부시키가이샤
Inventor： 가와구찌요시히로
Abstract: 본 발명의 과제는 노즐을 이용하여 피처리판 상에 처리액을 공급하는 처리액 토출 기능의 안정성 및 재현성을 보정하면서 토출 개시 시의 상승 능력을 개선하는 것이다.
이 레지스트 펌프(150)는 다이어프램 펌프(164)를 시린지부(166)에서 구동한다. 실린더(178)의 용적은 플런저(184)의 위치에 대략 정확하게 비례하므로, 응답 속도 및 안정성이 높은 펌프 성능을 실현할 수 있다. 또한, 작동유(S)를 저류하는 작동유 탱크(194)를 구비하고, 이 작동유 탱크(19)로부터 배관(200)을 거쳐서 작동유 봉입부[작동유실(172), 실린더(178)]에 작동유(S)를 수시 공급할 수 있는 구성으로 하고 있고, 이에 의해 작동유의 누설이나 공기의 혼입이 있어도 펌프를 분해할 정도의 메인터넌스 처리가 불필요하게 되어 있다.
기판 처리 장치, 레지스트 펌프, 실린더, 플런저, 작동유 펌프-
公开(公告)号：KR1020110132995A
公开(公告)日：2011-12-09
申请号：KR1020110053168
申请日：2011-06-02
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: H01L21/0274 , G03F1/60 , G03F7/202
Abstract: PURPOSE: A thermal processing device, a thermal processing method, and a recording medium are provided to suppress a change of a thermal processing temperature and make the line width of a wiring pattern between substrates uniform. CONSTITUTION: A substrate returning path(2) transfers a substrate(G) in X direction. The substrate returning path includes a cylindrical roller(20) which is expanded in Y direction. A chamber(8) forms a thermal processing space. The chamber includes a first chamber for forming a thermal processing space of a pre-heating unit(4) and a second chamber for forming a thermal processing space of a main heater unit. An outlet has a slit shape. The outlet is placed on the rear wall of the chamber.
Abstract translation: 目的：提供热处理装置，热处理方法和记录介质，以抑制热处理温度的变化，并使基板之间的布线图案的线宽均匀。 构成：基板返回路径（2）在X方向上传送基板（G）。 基板返回路径包括在Y方向上扩展的圆筒滚子（20）。 室（8）形成热处理空间。 该室包括用于形成预热单元（4）的热处理空间的第一室和用于形成主加热器单元的热处理空间的第二室。 出口具有狭缝形状。 出口被放置在室的后壁上。
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公开(公告)号：KR1020070012245A
公开(公告)日：2007-01-25
申请号：KR1020060068243
申请日：2006-07-21
Applicant: 도쿄엘렉트론가부시키가이샤
Inventor： 가와구찌요시히로
CPC classification number: B05C11/1026 , G02F1/133 , H01L21/027
Abstract: A substrate processing apparatus having nozzle with processing solution discharging function is provided to improve solution discharging performance while ensuring stability and reproducibility in pressure and flow rate of discharging the solution by adapting suitable construction of the nozzle for discharging the processing solution. The substrate processing apparatus includes: a nozzle(120) for discharging a desired processing solution for a substrate; a reservoir tank for storing the processing solution; a tube diaphragm pump(164) which has a tube diaphragm(168) and a housing(170) so as to suck the processing solution into the tube diaphragm and forced-transport the solution from the tube diaphragm to the nozzle; a syringe part(166) which has a cylinder communicating with an actuation fluid chamber of the tube diaphragm pump and a plunger fitted into the cylinder, develops the plunger to press the actuation fluid, and returns the plunger to its original position so as to draw off the actuation fluid from the chamber; and a fluid feeding part for supplying the actuation fluid to the actuation fluid chamber and an actuation fluid sealing part formed by the cylinder.
Abstract translation: 提供具有处理液排出功能的喷嘴的基板处理装置，通过适应用于排出处理液的喷嘴的适当结构，确保溶液的排出压力和流量的稳定性和再现性，提高溶液排出性能。 基板处理装置包括：喷嘴（120），用于排出用于基板的期望的处理溶液; 用于储存处理液的储存罐; 管隔膜泵（164），其具有管隔膜（168）和壳体（170），以便将处理溶液吸入管隔膜中并强制将溶液从管隔膜输送到喷嘴; 注射器部分（166）具有与管隔膜泵的致动流体室连通的气缸和装配到气缸中的柱塞，形成柱塞以按压致动流体，并将柱塞返回到其初始位置，以便绘制 从腔室中取出致动流体; 以及用于将致动流体供应到致动流体室的流体供给部和由气缸形成的致动流体密封部。
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公开(公告)号：KR101891349B1
公开(公告)日：2018-08-24
申请号：KR1020120116530
申请日：2012-10-19
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
Abstract: 처리동작의택트타임을단축할수 있고, 또한노즐의메인터넌스처리에기인하는피처리기판의오염을방지한다. 피처리기판(G)의폭방향으로연장되는토출구를갖고, 상기처리스테이지상의상기기판의상방을기판반송방향을따라이동되는동시에, 상기토출구로부터상기기판상에처리액을토출하는노즐(31)과, 상기노즐을승강이동가능하며, 상기노즐을기판반송방향상류측또는하류측을향해서이동가능한노즐이동수단(32)과, 기판반송로(4)의하방에설치되고, 상기노즐의토출구의상태를조정하는노즐메인터넌스수단(35)과, 상기기판반송로에있어서상기처리스테이지의상류측또는하류측에소정길이의빈 구간(d)을출몰가능하게형성가능한빈 구간형성수단(21, 22, 23A, 23B, 30)을구비한다.
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公开(公告)号：KR1020130039696A
公开(公告)日：2013-04-22
申请号：KR1020120112933
申请日：2012-10-11
Applicant: 도쿄엘렉트론가부시키가이샤
CPC classification number: Y02E10/50 , Y02P70/521 , H01L31/18 , H01L31/04
Abstract: PURPOSE: An apparatus and a method for forming a film are provided to reduce a footprint and the length of a process line at the same time and to improve productivity. CONSTITUTION: A coat process unit(6) horizontally transfers a substrate(G) and sprays a coating solution at the same time. The coating solution is discharged from a nozzle having a long outlet to the substrate. A first thermal unit(11) heats the substrate including a coating layer with a first heating temperature. A second thermal unit(12) heats the substrate with a second heating temperature. A drying buffer unit(7) sprays gas to the coating layer in order to evaporate a solvent formed on the coating film.
Abstract translation: 目的：提供一种用于形成薄膜的设备和方法，以同时缩短生产线的覆盖面和长度，并提高生产率。 构成：涂层处理单元（6）水平传送基板（G）并同时喷涂涂层溶液。 涂布溶液从具有长出口的喷嘴排出到基板。 第一热单元（11）加热包括具有第一加热温度的涂层的基板。 第二热单元（12）以第二加热温度加热基板。 干燥缓冲单元（7）将气体喷射到涂层以便蒸发涂膜上形成的溶剂。
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