公开(公告)号：KR1020130054165A

公开(公告)日：2013-05-24

申请号：KR1020120127968

申请日：2012-11-13

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 고메다히로시 ,  마나베에이지 ,  고가신지 ,  사카이다카히데

IPC: H01L21/302

CPC classification number: H01L21/67051 ,  H01L21/67092 ,  H01L21/6715

Abstract: PURPOSE: A cleaning apparatus, a separation system, a cleaning method, and a storage medium are provided to appropriately wash the bonding surface of a wafer by using a cleaning solution. CONSTITUTION: A rotation maintenance part(130) rotates a substrate. A washing jig(140) includes a supply surface for covering the bonding surface of the substrate. The washing jig includes a cleaning solution supply part(150) and a cleaning solution suction part(170). The cleaning solution supply part supplies the cleaning solution between the bonding surface and the supply surface. The cleaning solution suction inhales the cleaning solution between the bonding surface and the supply surface.

Abstract translation: 目的：提供一种清洁装置，分离系统，清洁方法和存储介质，以通过使用清洁溶液适当地清洗晶片的接合表面。 构成：旋转维持部（130）旋转基板。 洗涤夹具（140）包括用于覆盖基板的接合表面的供给表面。 洗涤夹具包括清洁溶液供给部（150）和清洗溶液吸引部（170）。 清洁溶液供应部分在接合表面和供给表面之间提供清洁溶液。 清洁溶液吸入吸附粘合表面和供给表面之间的清洁溶液。