도포막 형성장치 및 경화처리장치
    1.
    发明授权
    도포막 형성장치 및 경화처리장치 有权
    用于形成涂膜的装置和用于固化涂膜的装置

    公开(公告)号:KR100567493B1

    公开(公告)日:2006-04-03

    申请号:KR1019990044776

    申请日:1999-10-15

    CPC classification number: H01L21/67248 H01L21/67109

    Abstract: 도포막 형성장치는, 기판에 도포액을 도포하여 도포막을 형성하는 도포처리유니트와, 기판에 가열처리 및 냉각처리를 실시하여 도포막을 경화시키는 경화처리유니트를 구비하며, 경화처리유니트는, 도포액이 도포된 기판을 한매씩 가열하는 가열처리실과, 이 가열처리실에 연이어 통하고, 가열처리된 기판을 냉각하는 냉각처리실과, 가열처리실 및 냉각처리실에 불활성가스를 각각 공급하는 불활성가스공급기구와, 가열처리실 및 냉각처리실을 각각 배기하는 배기기구를 구비한다.

    세정 장치, 박리 시스템, 세정 방법, 및 기억 매체
    2.
    发明公开
    세정 장치, 박리 시스템, 세정 방법, 및 기억 매체 审中-实审
    清洁装置,分离系统,清洁方法和储存介质

    公开(公告)号:KR1020130054165A

    公开(公告)日:2013-05-24

    申请号:KR1020120127968

    申请日:2012-11-13

    CPC classification number: H01L21/67051 H01L21/67092 H01L21/6715

    Abstract: PURPOSE: A cleaning apparatus, a separation system, a cleaning method, and a storage medium are provided to appropriately wash the bonding surface of a wafer by using a cleaning solution. CONSTITUTION: A rotation maintenance part(130) rotates a substrate. A washing jig(140) includes a supply surface for covering the bonding surface of the substrate. The washing jig includes a cleaning solution supply part(150) and a cleaning solution suction part(170). The cleaning solution supply part supplies the cleaning solution between the bonding surface and the supply surface. The cleaning solution suction inhales the cleaning solution between the bonding surface and the supply surface.

    Abstract translation: 目的:提供一种清洁装置,分离系统,清洁方法和存储介质,以通过使用清洁溶液适当地清洗晶片的接合表面。 构成:旋转维持部(130)旋转基板。 洗涤夹具(140)包括用于覆盖基板的接合表面的供给表面。 洗涤夹具包括清洁溶液供给部(150)和清洗溶液吸引部(170)。 清洁溶液供应部分在接合表面和供给表面之间提供清洁溶液。 清洁溶液吸入吸附粘合表面和供给表面之间的清洁溶液。

    도포막 형성장치 및 경화처리장치
    3.
    发明公开
    도포막 형성장치 및 경화처리장치 有权
    电介质系统和电介质氧气密度控制固化和冷却单元

    公开(公告)号:KR1020000029107A

    公开(公告)日:2000-05-25

    申请号:KR1019990044776

    申请日:1999-10-15

    CPC classification number: H01L21/67248 H01L21/67109

    Abstract: PURPOSE: SOD(Spin on Dielectric) and DCC(Dielectric Oxygen controlled Cure and Cool-off Unit) are provided to prevent the spreading film from oxidizing and to manage each substrate. CONSTITUTION: A device for a coating film equips a spreading unit spreading a substrate with spread liquid, and a curing unit hardening the spreading film by heating and cooling the substrate. The curing unit contains a heating chamber(41) heating the spread substrate one by one, a cooling chamber(42) cooling the heated substrate, a non-activated gas supplier supplying non-activated gas to the heating chamber and the cooling chamber, and a ventilator ventilating the heating chamber and the cooling chamber. Therefore, the spreading film is prevented from oxidizing by continuously heating and cooling under the low air concentration atmosphere.

    Abstract translation: 目的:提供SOD(电介质旋转)和DCC(介电氧控制固化和冷却单元),以防止扩散膜氧化和管理每个基板。 构成:涂膜装置配有扩散装置,用扩散液扩散基板,固化装置通过加热和冷却基板来硬化铺展薄膜。 固化单元包括加热室(41)逐个加热扩散基板,冷却室(42)冷却加热的基板,非活化气体供应器向加热室和冷却室供应非活化气体,以及 通风机使加热室和冷却室通风。 因此,通过在低空气浓度气氛下连续加热和冷却来防止扩散膜氧化。

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