公开(公告)号：KR1020130007480A

公开(公告)日：2013-01-18

申请号：KR1020120070940

申请日：2012-06-29

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 소마야스타카 ,  요시타카나오토 ,  고메다히로시 ,  마나베에이지 ,  히라카와오사무 ,  데구치마사토시 ,  다무라다케시

IPC: H01L21/302

CPC classification number: B32B43/006 ,  B32B38/10 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/67346 ,  H01L2221/683 ,  H01L2221/68304 ,  H01L2221/68318 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1978 ,  Y10T156/1994

Abstract: PURPOSE: A cleaning method, a computer storage medium, a cleaning device, and a detaching system are provided to properly clean a contact surface of a target substrate by arranging the target substrate detached from laminated substrates in an annular frame. CONSTITUTION: A cleaning device comprises a wafer maintaining part(130) and a cleaning jig(140). The cleaning jig comprises a supply surface(141) covering a contact surface(WJ) of a target wafer. The cleaning jig comprises a solvent supply part(150), rinse supply part, and an inner gas supply part(152). The solvent supply part supplies the solvent of adhesives in a gap between the supply surface and the contact surface.

Abstract translation: 目的：提供一种清洁方法，计算机存储介质，清洁装置和分离系统，以通过将目标基板从叠层基板分离成环形框架来适当地清洁目标基板的接触表面。 构成：清洁装置包括晶片保持部分（130）和清洁夹具（140）。 清洁夹具包括覆盖目标晶片的接触表面（WJ）的供给表面（141）。 清洁夹具包括溶剂供应部分（150），冲洗供应部分和内部气体供应部分（152）。 溶剂供应部分在供给表面和接触表面之间的间隙中提供粘合剂的溶剂。

公开(公告)号：KR1020130054165A

公开(公告)日：2013-05-24

申请号：KR1020120127968

申请日：2012-11-13

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 고메다히로시 ,  마나베에이지 ,  고가신지 ,  사카이다카히데

IPC: H01L21/302

CPC classification number: H01L21/67051 ,  H01L21/67092 ,  H01L21/6715

Abstract: PURPOSE: A cleaning apparatus, a separation system, a cleaning method, and a storage medium are provided to appropriately wash the bonding surface of a wafer by using a cleaning solution. CONSTITUTION: A rotation maintenance part(130) rotates a substrate. A washing jig(140) includes a supply surface for covering the bonding surface of the substrate. The washing jig includes a cleaning solution supply part(150) and a cleaning solution suction part(170). The cleaning solution supply part supplies the cleaning solution between the bonding surface and the supply surface. The cleaning solution suction inhales the cleaning solution between the bonding surface and the supply surface.

Abstract translation: 目的：提供一种清洁装置，分离系统，清洁方法和存储介质，以通过使用清洁溶液适当地清洗晶片的接合表面。 构成：旋转维持部（130）旋转基板。 洗涤夹具（140）包括用于覆盖基板的接合表面的供给表面。 洗涤夹具包括清洁溶液供给部（150）和清洗溶液吸引部（170）。 清洁溶液供应部分在接合表面和供给表面之间提供清洁溶液。 清洁溶液吸入吸附粘合表面和供给表面之间的清洁溶液。

公开(公告)号：KR1020140083961A

公开(公告)日：2014-07-04

申请号：KR1020140072780

申请日：2014-06-16

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 소마야스타카 ,  요시타카나오토 ,  고메다히로시 ,  마나베에이지 ,  히라카와오사무 ,  데구치마사토시 ,  다무라다케시

IPC: H01L21/302 ,  H01L21/78 ,  H01L21/677

CPC classification number: B32B43/006 ,  B32B38/10 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/67346 ,  H01L2221/683 ,  H01L2221/68304 ,  H01L2221/68318 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1978 ,  Y10T156/1994

Abstract: The present invention properly cleans a joining surface of a processed substrate disposed at the inner side of an annular frame and held by the frame and a tape. A cleaning device comprises a wafer holding part (130) holding a processed wafer (W); and a cleaning jig (140) including a supply surface (141) covering a joining surface (Wj) of the processed wafer (W). The cleaning jig (140) is provided with a solvent supply part (150) supplying a solvent to a clearance (142); a rinse liquid supply part (151) supplying a rinse liquid to the clearance (142); and an inactive gas supply part (152) supplying the inactive gas to the clearance (142). The solvent from the solvent supply part (150) is diffused on the joining surface (Wj) due to surface tension and centrifugal force. The rinse liquid from the rinse liquid supply part (151) is diffused on the joining surface (Wj) due to surface tension and centrifugal force while being mixed with the solvent. The joining surface (Wj) is dried by an inactive gas from the inactive gas supply part (152) and the joining surface (Wj) is cleaned.

Abstract translation: 本发明适当地清洁设置在环形框架的内侧并被框架和带子保持的处理基板的接合表面。 清洁装置包括保持处理过的晶片（W）的晶片保持部（130）。 以及包括覆盖处理过的晶片（W）的接合面（Wj）的供给面（141）的清洁夹具（140）。 清洁夹具（140）设有向间隙（142）供应溶剂的溶剂供应部件（150）。 向所述间隙（142）提供冲洗液体的冲洗液供给部（151）; 以及将惰性气体供给到间隙（142）的惰性气体供给部（152）。 来自溶剂供给部（150）的溶剂由于表面张力和离心力而扩散在接合面（Wj）上。 在与溶剂混合的同时，由于表面张力和离心力，来自冲洗液供给部（151）的冲洗液在接合面（Wj）上扩散。 接合面（Wj）由来自惰性气体供给部（152）的惰性气体干燥，并且清洁接合面（Wj）。

公开(公告)号：KR1020080068581A

公开(公告)日：2008-07-23

申请号：KR1020080005483

申请日：2008-01-18

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사까이미쯔히로 ,  미야자끼가즈히또 ,  시오자끼겐지 ,  고메다히로시

IPC: H01L21/677

CPC classification number: H01L21/67706 ,  B65G39/02 ,  B65G49/063 ,  H01L21/67736 ,  H01L21/68714 ,  H01L21/68742

Abstract: A substrate conveying apparatus is provided to improve through-put of substrate processing by using a small substrate conveyer. A substrate conveyer receives a substrate from an arm supporting the substrate, and conveys the substrate to a processing device. The substrate conveyer includes roller conveyers(120) and an elevator(118). The roller conveyers convey a substrate in a horizontal direction, and are disposed in two stages. The elevator elevates the roller conveyers of the two stages. A vessel(110) receives the roller conveyers of the two stages and the elevator. Carry holes(111,115) are formed in a side surface of the vessel, and carries the substrate. Discharge hole(112,116) discharge the substrate. An inner temperature of the processing device is greater than that of the vessel. An exhaust hole(113) is formed in a lower side of the vessel, and exhausts atmosphere in the vessel.

Abstract translation: 提供基板输送装置，以通过使用小的基板输送器来改善基板处理的通过。 基板输送机从支撑基板的臂接收基板，并将基板输送到处理装置。 基板输送机包括辊式输送机（120）和电梯（118）。 辊式输送机在水平方向上输送基板，分两个阶段布置。 电梯提升了两级的辊式输送机。 容器（110）容纳两级的辊式输送机和电梯。 携带孔（111,115）形成在容器的侧面，并承载基板。 放电孔（112,116）放电衬底。 处理装置的内部温度大于容器的内部温度。 在容器的下侧形成排气孔（113），排出容器内的气氛。