기판처리장치 및 기판처리방법
    2.
    发明公开
    기판처리장치 및 기판처리방법 有权
    基板处理装置和基板处理方法

    公开(公告)号:KR1020020006469A

    公开(公告)日:2002-01-19

    申请号:KR1020010041509

    申请日:2001-07-11

    Abstract: PURPOSE: A substrate processing apparatus is provided to make simple and easy works from the substrate processing to the inspection and to shorten the time by connecting an inspecting station to a processing station. CONSTITUTION: A cassette station(S1), a process station(S3) having an applying station and a developing unit(41), and an inspecting station having a film thickness inspector(31A) and a defect inspector(32A) are arranged approximately right angles to a cassette(22) array in the cassette station(S1), with the inspecting station(S2) being disposed between the cassette and the process stations(S1,S3). In such a constitution the inspecting station is connected to the process station and wafers(W) are transferred automatically between these stations(S2,S3) and this enables facilitating simple and easy works from the substrate processing to the inspection and shorten the time.

    Abstract translation: 目的:提供一种基板处理装置,用于从基板处理到检查进行简单且容易的工作,并且通过将检查站连接到处理站来缩短时间。 构成:具有施加站和显影单元(41)的盒式站(S1),处理站(S3)以及具有膜厚度检查器(31A)和缺陷检查器(32A)的检查站大致正确地布置 与盒式车站(S1)中的盒(22)阵列的角度,检查站(S2)设置在盒和处理站(S1,S3)之间。 在这种结构中,检查站连接到处理站,晶片(W)在这些站之间自动转移(S2,S3),这使得能够简化和简单地从基板处理到检查的工作,缩短时间。

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