公开(公告)号：KR1020140106417A

公开(公告)日：2014-09-03

申请号：KR1020140020308

申请日：2014-02-21

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 노자와도시히사 ,  요시카와준 ,  아이타미치타카 ,  야마자키마사히로 ,  사이토다케히사 ,  가지후미히코 ,  야마기시고지

IPC: H01L21/205 ,  H01L21/3065

CPC classification number: H01J37/32192 ,  H01J37/32229 ,  H01J37/3244

Abstract: The present invention is to reduce the electric intensity of a path to supply processing gas to be plasmatized. A plasma processing apparatus comprises a processing container, a microwave generator, a dielectric member, an injector, and a dielectric waveguide plate. The processing container is divided for a processing room, and the microwave generator generates microwave for plasma excitation. The dielectric member introduces the microwave generated by the microwave generator into the processing room, as installed in the processing container to seal the processing room. The injector supplies a processing gas plasmatized by the microwave to the processing room through a penetrating hole formed on the dielectric member, as installed inside the dielectric member. And the dielectric waveguide plate guides the microwave diffused inside the dielectric member through the penetrating hole to the inner side of the injector, as arranged inside the injector to cover the penetrating hole of the dielectric member.

Abstract translation: 本发明是为了降低供给等离子体化处理气体的路径的电气强度。 等离子体处理装置包括处理容器，微波发生器，电介质构件，注射器和电介质波导板。 处理容器分为处理室，微波发生器产生用于等离子体激发的微波。 介电部件将由微波发生器产生的微波引入加工室内，安装在处理容器中以密封处理室。 喷射器通过形成在电介质构件上的贯穿孔将微波等离子体的处理气体提供给处理室，安装在电介质构件的内部。 并且电介质波导板将布置在电介质构件内部的微波通过穿透孔引导到喷射器的内侧，布置在喷射器内部以覆盖电介质构件的穿透孔。

公开(公告)号：KR101541642B1

公开(公告)日：2015-08-03

申请号：KR1020140020308

申请日：2014-02-21

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 노자와도시히사 ,  요시카와준 ,  아이타미치타카 ,  야마자키마사히로 ,  사이토다케히사 ,  가지후미히코 ,  야마기시고지

IPC: H01L21/205 ,  H01L21/3065

CPC classification number: H01J37/32192 ,  H01J37/32229 ,  H01J37/3244

Abstract: 본발명은플라즈마화되는처리가스를공급하기위한경로의전계강도를저감시키는것을목적으로한다. 플라즈마처리장치는, 처리공간을구획하는처리용기와, 플라즈마여기용마이크로파를발생하는마이크로파발생기를구비한다. 또한, 플라즈마처리장치는, 처리공간을밀폐하도록처리용기에장착되어, 마이크로파발생기에의해발생되는마이크로파를처리공간으로도입하는유전체부재를구비한다. 또한, 플라즈마처리장치는, 유전체부재의내부에설치되어, 마이크로파에의해플라즈마화되는처리가스를유전체부재에형성된관통구멍을통해처리공간에공급하는인젝터를구비한다. 또한, 플라즈마처리장치는, 유전체부재의관통구멍을둘러싸도록인젝터의내부에배치되어, 관통구멍을향해유전체부재의내부를전파하는마이크로파를인젝터의내부측에도파하는유전체제(製)의도파판을구비한다.