주연부 도포 장치, 주연부 도포 방법 및 주연부 도포용 기록 매체
    1.
    发明公开
    주연부 도포 장치, 주연부 도포 방법 및 주연부 도포용 기록 매체 审中-实审
    外围涂层设备,周边涂层方法及其储存介质

    公开(公告)号:KR1020140071916A

    公开(公告)日:2014-06-12

    申请号:KR1020130148269

    申请日:2013-12-02

    CPC classification number: H01L21/02282 H01L21/6715 H01L21/0273

    Abstract: Provided are a periphery coating apparatus which can efficiently form a coating layer with sufficiently uniform thickness, on only the periphery of a substrate, a periphery coating method and a storage medium for the same. A periphery coating unit performs a scan in control which rotates a wafer (W) and moves a resist solution nozzle (27) from the outside of the periphery (Wb) of the wafer (W) to the periphery (Wc) of the wafer (W) while discharging a resist solution from the resist solution nozzle (27), and a scan out control which rotates the wafer (W) and moves the resist solution nozzle (27) from the periphery (Wc) of the wafer (W) to the outside of the periphery (Wb) of the wafer (W) while discharging the resist solution from the resist solution nozzle (27). When the scan out control is carried out, the resist solution nozzle (27) is moved at a velocity (V2) which is lower than a velocity (V3) at which the resist solution moves to the periphery (Wc) of the wafer (W).

    Abstract translation: 本发明提供一种能够有效地形成具有足够均匀厚度的涂层的外围涂布装置,仅在基板的周围,周边涂布方法和用于其的存储介质。 周边涂布单元执行扫描,其使晶片(W)旋转并使抗蚀剂溶液喷嘴(27)从晶片(W)的周边(Wb)的外侧移动到晶片的周边(Wc)(Wc) 在从抗蚀剂溶液喷嘴(27)排出抗蚀剂溶液的同时,将晶片(W)旋转并将抗蚀剂溶液喷嘴(27)从晶片(W)的周边(Wc)移动到所述扫描输出控制器 在从抗蚀剂溶液喷嘴(27)排出抗蚀剂溶液的同时,在晶片(W)的外周(Wb)的外侧。 当执行扫描输出控制时,抗蚀剂溶液喷嘴(27)以比抗蚀剂溶液移动到晶片(W)的周边(Wc)的速度(V3)低的速度(V2)移动 )。

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