公开(公告)号：KR100961560B1

公开(公告)日：2010-06-07

申请号：KR1020090033161

申请日：2009-04-16

Applicant: 롬엔드하스전자재료코리아유한회사

Inventor： 김태영 ,  김승근 ,  정주영 ,  안상왕 ,  이무영 ,  강희경 ,  장래선 ,  박춘근

IPC: C08L33/00 ,  C08F220/00 ,  C08K5/00 ,  H01L21/31

Abstract: PURPOSE: A photo-crosslinking resin composition, a dielectric insulating film using thereof, and an electronic device using thereof are provided to improve resolution, light-proof and photosensitivity properties of the dielectric insulating film. CONSTITUTION: A dielectric insulating film is formed by curing a photo-crosslinking resin composition. The photo-crosslinking resin composition contains the following: 100 parts of copolymer by weight polymerized with 5~40mol% of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride or their mixture, 5~70mol% of aromatic unsaturated monomer, 1~10mol % of unsaturated compound including an epoxy group or an oxetane group, and 5~50mol% of methyl methacrylate; 1~150 parts of photo-polymerizable ethylenic unsaturated monomeric compound by weight; 0.5~10 parts of photo initiator by weight; and 0.5~30 parts of functionalized silane compound by weight.

Abstract translation: 目的：提供光交联树脂组合物，其使用的介电绝缘膜及其使用的电子器件，以提高介电绝缘膜的分辨率，耐光性和光敏性。 构成：通过固化光交联树脂组合物形成介电绝缘膜。 光交联树脂组合物含有以下重量份：100重量份的共聚物与5〜40摩尔％的不饱和羧酸，不饱和羧酸酐或它们的混合物聚合，5〜70摩尔％的芳族不饱和单体，1〜10摩尔％的不饱和羧酸 包括环氧基或氧杂环丁烷基的化合物和5〜50mol％的甲基丙烯酸甲酯; 1〜150份可光聚合烯键式不饱和单体化合物; 0.5〜10份重量的光引发剂; 和0.5〜30份官能化硅烷化合物。

公开(公告)号：KR1020110040640A

公开(公告)日：2011-04-20

申请号：KR1020100042835

申请日：2010-05-07

Applicant: 롬엔드하스전자재료코리아유한회사

Inventor： 김태영 ,  한석 ,  김승근 ,  정주영 ,  성인경 ,  이무영 ,  안상왕 ,  장래선 ,  이학주

IPC: G03F7/027 ,  G03F7/033 ,  G03F7/075 ,  H01L21/312

CPC classification number: G03F7/027 ,  C07D213/643 ,  C08F2/50 ,  G02B5/223 ,  G03F7/0007 ,  G03F7/0233 ,  G03F7/028 ,  G03F7/031

Abstract: PURPOSE: A photosensitive resin composition, an insulating film and an electronic component using the same are provided to reduce the deviation of a thickness generated in multi-stepped composition layer forming processes. CONSTITUTION: A photosensitive resin composition includes 100.0 parts by weight of a copolymer, 1 to 150 parts by weight of photo-polymerizable ethylenically unsaturated monomer, 0.5 to 30 parts by weight of a functional silane compound, and 1 to 20 parts by weight of one or more compound selected from a compound with chemical formula 1, a compound with chemical formula 2, and the mixture of the same. The copolymer is based on 5 to 40 mol% of unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, 5 to 70 mol% of aromatic unsaturated monomer, 1 to 10 mol% of an unsaturated compound with epoxy group, oxetane group, or the mixture of the same, and 5 to 50 mol% of methyl methacrylate.

Abstract translation: 目的：提供一种感光性树脂组合物，绝缘膜和使用其的电子部件，以减少在多阶段组成层形成工序中产生的厚度的偏差。 构成：感光性树脂组合物含有共聚物100.0重量份，光聚合性烯键式不饱和单体1〜150重量份，功能性硅烷化合物0.5〜30重量份，1重量份 或更多选自具有化学式1的化合物，化学式2的化合物及其混合物的化合物。 该共聚物为5〜40摩尔％的不饱和羧酸和/或不饱和羧酸酐，5〜70摩尔％的芳族不饱和单体，1〜10摩尔％的具有环氧基的不饱和化合物，氧杂环丁烷基或 的混合物和5〜50摩尔％的甲基丙烯酸甲酯。