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公开(公告)号：KR102232349B1
公开(公告)日：2021-03-26
申请号：KR1020130062449A
申请日：2013-05-31
Applicant: 롬엔드하스전자재료코리아유한회사
CPC classification number: G03F7/0757 , C08G77/16 , G03F7/004 , G03F7/0233 , G03F7/027 , G03F7/0382 , G03F7/085
Abstract: 본 발명은 고내열성 네거티브형 감광성 수지 조성물 및 이로부터 제조된 경화막에 관한 것으로, (a) (a-1) (메트)아크릴레이트기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; (a-2) 페닐기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; 및 (b) 광중합 개시제를 포함하고, 에틸렌성 불포화 이중결합을 갖는 아크릴레이트계 화합물을 포함하지 않는 본 발명의 감광성 수지 조성물로부터 제조된 경화막은 고온 경화조건에서 우수한 내열성을 가져 크랙 발생이 억제됨으로써 평탄막 구현이 가능하고 황변 등으로 인한 광 투과율 저하를 나타내지 않으므로, 전자부품의 보호막 등으로서 유용하게 사용될 수 있다.
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公开(公告)号：KR102232349B1
公开(公告)日：2021-03-26
申请号：KR1020130062449
申请日：2013-05-31
Applicant: 롬엔드하스전자재료코리아유한회사
Abstract: 본발명은고내열성네거티브형감광성수지조성물및 이로부터제조된경화막에관한것으로, (a) (a-1) (메트)아크릴레이트기를갖는실록산단위를포함하는유기실록산중합체; (a-2) 페닐기를갖는실록산단위를포함하는유기실록산중합체; 및 (b) 광중합개시제를포함하고, 에틸렌성불포화이중결합을갖는아크릴레이트계화합물을포함하지않는본 발명의감광성수지조성물로부터제조된경화막은고온경화조건에서우수한내열성을가져크랙발생이억제됨으로써평탄막구현이가능하고황변등으로인한광 투과율저하를나타내지않으므로, 전자부품의보호막등으로서유용하게사용될수 있다.
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公开(公告)号：KR1020110040640A
公开(公告)日：2011-04-20
申请号：KR1020100042835
申请日：2010-05-07
Applicant: 롬엔드하스전자재료코리아유한회사
IPC: G03F7/027 , G03F7/033 , G03F7/075 , H01L21/312
CPC classification number: G03F7/027 , C07D213/643 , C08F2/50 , G02B5/223 , G03F7/0007 , G03F7/0233 , G03F7/028 , G03F7/031
Abstract: PURPOSE: A photosensitive resin composition, an insulating film and an electronic component using the same are provided to reduce the deviation of a thickness generated in multi-stepped composition layer forming processes. CONSTITUTION: A photosensitive resin composition includes 100.0 parts by weight of a copolymer, 1 to 150 parts by weight of photo-polymerizable ethylenically unsaturated monomer, 0.5 to 30 parts by weight of a functional silane compound, and 1 to 20 parts by weight of one or more compound selected from a compound with chemical formula 1, a compound with chemical formula 2, and the mixture of the same. The copolymer is based on 5 to 40 mol% of unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, 5 to 70 mol% of aromatic unsaturated monomer, 1 to 10 mol% of an unsaturated compound with epoxy group, oxetane group, or the mixture of the same, and 5 to 50 mol% of methyl methacrylate.
Abstract translation: 目的：提供一种感光性树脂组合物，绝缘膜和使用其的电子部件，以减少在多阶段组成层形成工序中产生的厚度的偏差。 构成：感光性树脂组合物含有共聚物100.0重量份，光聚合性烯键式不饱和单体1〜150重量份，功能性硅烷化合物0.5〜30重量份，1重量份 或更多选自具有化学式1的化合物，化学式2的化合物及其混合物的化合物。 该共聚物为5〜40摩尔％的不饱和羧酸和/或不饱和羧酸酐，5〜70摩尔％的芳族不饱和单体，1〜10摩尔％的具有环氧基的不饱和化合物，氧杂环丁烷基或 的混合物和5〜50摩尔％的甲基丙烯酸甲酯。
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公开(公告)号：KR1020120056938A
公开(公告)日：2012-06-05
申请号：KR1020100112604
申请日：2010-11-12
Applicant: 롬엔드하스전자재료코리아유한회사
CPC classification number: C08F2/50 , C08L2312/06 , C09D135/00 , G03F7/031 , G03F7/033 , G03F7/0751 , G03F7/0755
Abstract: PURPOSE: A photo-sensitive resin composition, an insulating film using the same, and electronic parts thereof are provided to improve permeability and contrast while the thickness of a thermosetting film is kept. CONSTITUTION: A photo-sensitive resin composition includes 100 parts by weight of a copolymer, 0.1-10 parts by weight of a photo-polymerization initiator containing the compound represented by chemical formula 1, 1-150 parts by weight of polymerizable ethylenically unsaturated monomer compounds, 0.5-30 parts by weight of functional silane compounds, and 1-20 parts by weight of one or more compounds selected from the compound represented by chemical formula 2, the compound represented by chemical formula 3, or a mixture of the compounds. The copolymer includes unsaturated carbonic acid, unsaturated carboxylic acid anhydride, or a mixture of the same, an aromatic unsaturated monomer, unsaturated compounds with epoxy groups or oxetane groups or a mixture of the same, and methyl methacrylate. The epoxy groups or oxetane groups are selected from glycidyl methacrylate, 4-hydroxybutyl acrylate triglycidyl ether, and 3-ethyl-3-methylmethacrylate oxetane.
Abstract translation: 目的：提供光敏树脂组合物，使用该树脂组合物的绝缘膜及其电子部件，以在保持热固性膜的厚度的同时提高渗透性和对比度。 构成：光敏树脂组合物包含100重量份共聚物，0.1-10重量份含有由化学式1表示的化合物的光聚合引发剂，1-150重量份可聚合的烯属不饱和单体化合物 ，0.5-30重量份的官能硅烷化合物和1-20重量份的选自化学式2表示的化合物，化学式3表示的化合物或化合物的混合物的一种或多种化合物。 共聚物包括不饱和碳酸，不饱和羧酸酐或其混合物，芳族不饱和单体，不饱和化合物与环氧基或氧杂环丁烷基团或其混合物，和甲基丙烯酸甲酯。 环氧基或氧杂环丁烷基选自甲基丙烯酸缩水甘油酯，丙烯酸4-羟基丁酯三缩水甘油醚和3-乙基-3-甲基甲基丙烯酸酯氧杂环丁烷。
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Patent Agency Ranking
公开(公告)号：KR1020140141115A
公开(公告)日：2014-12-10
申请号：KR1020130062449
申请日：2013-05-31
Applicant: 롬엔드하스전자재료코리아유한회사
CPC classification number: G03F7/0757 , C08G77/16 , G03F7/004 , G03F7/0233 , G03F7/027 , G03F7/0382 , G03F7/085
Abstract: 본 발명은 고내열성 네거티브형 감광성 수지 조성물 및 이로부터 제조된 경화막에 관한 것으로, (a) (a-1) (메트)아크릴레이트기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; (a-2) 페닐기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; 및 (b) 광중합 개시제를 포함하고, 에틸렌성 불포화 이중결합을 갖는 아크릴레이트계 화합물을 포함하지 않는 본 발명의 감광성 수지 조성물로부터 제조된 경화막은 고온 경화조건에서 우수한 내열성을 가져 크랙 발생이 억제됨으로써 평탄막 구현이 가능하고 황변 등으로 인한 광 투과율 저하를 나타내지 않으므로, 전자부품의 보호막 등으로서 유용하게 사용될 수 있다.
Abstract translation: 本发明涉及具有高耐热性的负型感光性树脂组合物和由其制备的硬化外涂层。 由（a）（a-1）含有具有（甲基）丙烯酸酯基团的硅氧烷单元的有机硅氧烷聚合物的本发明的感光性树脂组合物制备的硬化外涂层; （a-2）包含具有苯基的硅氧烷单元的有机硅氧烷聚合物; （b）光聚合引发剂，不含有具有乙烯不饱和双键的丙烯酸酯类化合物在高温固化条件下具有优异的耐热性，以控制裂纹形成平膜，并且不会由于黄变至 可用作电子部件的这种保护膜。
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公开(公告)号：KR1020140049717A
公开(公告)日：2014-04-28
申请号：KR1020120115860
申请日：2012-10-18
Applicant: 롬엔드하스전자재료코리아유한회사
CPC classification number: G03F7/0755 , G03F7/004 , G03F7/0043 , G03F7/0045 , G03F7/028 , G03F7/075 , G03F7/11
Abstract: The present invention relates to a negative photosensitive resin composition including an organosiloxane polymer and a hardened film prepared therefrom. The negative photosensitive resin composition includes: an rganosiloxane polymer; an allyl-based compound having at least one ethylenically unsaturated double bond, a vinyl-based compound, or a mixture thereof; and a photopolymerization initiator. The hardened film prepared using the negative photosensitive resin composition has improved physical properties like pattern developing properties, surface hardness, heat resistance, light transmittance, acid resistance, alkali resistance, and solvent resistance, thereby being able to be used as a protective film for electronic parts.
Abstract translation: 本发明涉及包含有机硅氧烷聚合物和由其制备的硬化膜的负型感光性树脂组合物。 负型感光性树脂组合物包括：粗硅氧烷聚合物; 具有至少一个烯键式不饱和双键的烯丙基类化合物，乙烯基类化合物或其混合物; 和光聚合引发剂。 使用负型感光性树脂组合物制备的硬化膜具有如图案显影性能，表面硬度，耐热性，透光性，耐酸性，耐碱性和耐溶剂性等改善的物理性能，因此能够用作电子保护膜 部分。
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公开(公告)号：KR1020140042163A
公开(公告)日：2014-04-07
申请号：KR1020120108534
申请日：2012-09-28
Applicant: 롬엔드하스전자재료코리아유한회사
CPC classification number: G03F7/027 , G03F7/0007 , G03F7/0045 , G03F7/0226 , G03F7/0233 , G03F7/0382 , G03F7/0757
Abstract: The present invention relates to a negative-type photosensitive resin composition having high thermal resistance and high resolution containing an organic siloxane polymer and an acryl copolymer at the same time, and a hardened layer prepared therefrom. The negative-type photosensitive resin composition contains: (1) the organic siloxane polymer; (2) a random copolymer including (2-1) a structure unit induced from ethylene unsaturated carboxylic acid, ethylene unsaturated carboxylic acid anhydride, or a mixture thereof, and (2-2) a structure unit induced from an ethylene unsaturated compound with an aromatic ring; (3) an acrylate based compound with one or more ethylene unsaturated double bond; and (4) a photopolymerization initiator. The organic siloxane polymer includes: a siloxane unit (a) with a (meth)acrylate group as a polymerization unit; and a siloxane unit (b) with one or more functional groups selected from an epoxy group, an oxetane group, a hydroxy group, and a thiol group.
Abstract translation: 本发明涉及同时具有有机硅氧烷聚合物和丙烯酸共聚物的耐热性和高分辨率的负型感光性树脂组合物及其制备的硬化层。 负型感光性树脂组合物含有：（1）有机硅氧烷聚合物; （2）包含（2-1）由乙烯不饱和羧酸，乙烯不饱和羧酸酐或其混合物引发的结构单元的无规共聚物，（2-2）由乙烯不饱和化合物诱导的结构单元， 芳香环 （3）具有一个或多个乙烯不饱和双键的丙烯酸酯类化合物; 和（4）光聚合引发剂。 有机硅氧烷聚合物包括：具有（甲基）丙烯酸酯基的硅氧烷单元（a）作为聚合单元; 和具有一个或多个选自环氧基，氧杂环丁烷基，羟基和硫醇基的官能团的硅氧烷单元（b）。
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公开(公告)号：KR101267674B1
公开(公告)日：2013-05-24
申请号：KR1020100112604
申请日：2010-11-12
Applicant: 롬엔드하스전자재료코리아유한회사
CPC classification number: C08F2/50 , C08L2312/06 , C09D135/00 , G03F7/031 , G03F7/033 , G03F7/0751 , G03F7/0755
Abstract: 본발명은해상도및 잔막률등의감광성특성, 낮은노광영역에서기판과의밀착성, UV 영역에대한내광성및 가시광영역에서의광투과율이양호한감광성수지조성물에관한것으로, 식각공정마진과노광마진그리고내광성이요구되는 TFT-LCD용층간유기절연막용감광성수지조성물에관한것이다.
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公开(公告)号：KR100961560B1
公开(公告)日：2010-06-07
申请号：KR1020090033161
申请日：2009-04-16
Applicant: 롬엔드하스전자재료코리아유한회사
IPC: C08L33/00 , C08F220/00 , C08K5/00 , H01L21/31
Abstract: PURPOSE: A photo-crosslinking resin composition, a dielectric insulating film using thereof, and an electronic device using thereof are provided to improve resolution, light-proof and photosensitivity properties of the dielectric insulating film. CONSTITUTION: A dielectric insulating film is formed by curing a photo-crosslinking resin composition. The photo-crosslinking resin composition contains the following: 100 parts of copolymer by weight polymerized with 5~40mol% of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride or their mixture, 5~70mol% of aromatic unsaturated monomer, 1~10mol % of unsaturated compound including an epoxy group or an oxetane group, and 5~50mol% of methyl methacrylate; 1~150 parts of photo-polymerizable ethylenic unsaturated monomeric compound by weight; 0.5~10 parts of photo initiator by weight; and 0.5~30 parts of functionalized silane compound by weight.
Abstract translation: 目的：提供光交联树脂组合物，其使用的介电绝缘膜及其使用的电子器件，以提高介电绝缘膜的分辨率，耐光性和光敏性。 构成：通过固化光交联树脂组合物形成介电绝缘膜。 光交联树脂组合物含有以下重量份：100重量份的共聚物与5〜40摩尔％的不饱和羧酸，不饱和羧酸酐或它们的混合物聚合，5〜70摩尔％的芳族不饱和单体，1〜10摩尔％的不饱和羧酸 包括环氧基或氧杂环丁烷基的化合物和5〜50mol％的甲基丙烯酸甲酯; 1〜150份可光聚合烯键式不饱和单体化合物; 0.5〜10份重量的光引发剂; 和0.5〜30份官能化硅烷化合物。
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