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公开(公告)号:KR1020100120975A
公开(公告)日:2010-11-17
申请号:KR1020090039887
申请日:2009-05-07
Applicant: 삼성모바일디스플레이주식회사
CPC classification number: H01L51/0029 , H01J37/20 , H01J37/32091 , H01J37/32568 , H01J2237/024 , H01J2237/032 , H01J2237/038 , H01J2237/20235
Abstract: PURPOSE: An apparatus for processing plasma is provided to constantly etch the surface of a substrate by maintaining the uniformity of plasma in a chamber. CONSTITUTION: A substrate is arranged in a chamber. A first electrode(104) is arranged in the chamber and is spaced apart from the lower side of the substrate. A second electrode(105) is arranged in the chamber and is spaced apart from the upper side of the substrate. A gap regulating unit(102) regulates a gap between the first electrode and the substrate or a gap between the second electrode and the substrate.
Abstract translation: 目的:提供一种用于处理等离子体的装置,以通过维持室中的等离子体的均匀性来恒定地蚀刻基板的表面。 构成:衬底布置在腔室中。 第一电极(104)布置在腔室中并与衬底的下侧隔开。 第二电极(105)布置在腔室中并与衬底的上侧隔开。 间隙调节单元(102)调节第一电极和衬底之间的间隙或第二电极和衬底之间的间隙。
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公开(公告)号:KR101050463B1
公开(公告)日:2011-07-20
申请号:KR1020090039887
申请日:2009-05-07
Applicant: 삼성모바일디스플레이주식회사
CPC classification number: H01L51/0029 , H01J37/20 , H01J37/32091 , H01J37/32568 , H01J2237/024 , H01J2237/032 , H01J2237/038 , H01J2237/20235
Abstract: A substrate plasma-processing apparatus for plasma-processing a surface of an electrode of an organic light emitting device. The substrate plasma-processing apparatus may adjust the distance between a first electrode and a substrate and adjust the distance between a second electrode and the substrate.
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