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    기밀특성이 우수한 표면탄성파 소자 패키지 및 그 제조방법
    1.
    发明公开
    기밀특성이 우수한 표면탄성파 소자 패키지 및 그 제조방법 无效
    表面声波装置包装及其制造方法

    公开(公告)号：KR1020060115531A

    公开(公告)日：2006-11-09

    申请号：KR1020050038024

    申请日：2005-05-06

    Applicant: 삼성전기주식회사

    Inventor： 김남형 ,  이영진 ,  박두철 ,  이승희 ,  박주훈 ,  박상욱

    IPC: H03H3/08

    CPC classification number: H03H9/02874 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059

    Abstract: A surface acoustic wave device package with a high airtight property and a method for manufacturing the same are provided to maintain a bonding structure of encircling bumps stably by a bonding reinforcement member of an embossing unit and a rough unit formed at a metal coating layer of a wiring substrate. In a surface acoustic wave device package(1) with a high airtight property, a wiring substrate(10) consists of a package base including a connection wiring(12). An element chip(50) bonded to a surface of the wiring substrate(10) by a flip type includes an airtight unit(30) for an active area for maintaining an airtight state of the active area. And, a resin molding unit(70) covers the wiring substrate(10) and the element chip(50) and is sealed.

    Abstract translation: 提供了一种具有高气密性的表面声波器件封装及其制造方法，用于通过压印单元的接合加强件和形成在金属涂层上的粗糙单元来稳定地保持环绕凸块的接合结构 布线基板。 在具有高气密性的弹性表面波器件封装（1）中，布线基板（10）由包括连接布线（12）的封装基座构成。 通过翻转式结合到布线基板（10）的表面的元件芯片（50）包括用于有源区域的气密单元（30），用于保持有源区域的气密状态。 并且，树脂成型单元（70）覆盖布线基板（10）和元件芯片（50）并被密封。

    기밀특성이 우수한 표면탄성파 소자 패키지
    2.
    发明公开
    기밀특성이 우수한 표면탄성파 소자 패키지 无效
    表面声波设备包

    公开(公告)号：KR1020060115095A

    公开(公告)日：2006-11-08

    申请号：KR1020050037420

    申请日：2005-05-04

    Applicant: 삼성전기주식회사

    Inventor： 박두철 ,  이영진 ,  이승희 ,  박주훈 ,  박상욱 ,  김남형

    IPC: H03H3/08

    CPC classification number: H03H9/1085 ,  H03H9/059

    Abstract: A surface acoustic wave device package with a high airtight property is provided to prevent external moisture from permeating inside by including a wiring substrate with a precise and stepped interface. In a surface acoustic wave device package with a high airtight property, a wiring substrate(10) includes a bare chip adhering member provided as a package base including a connection wiring(12). A bare chip(50) closely adhered to the bare chip adhering member is boned to a surface of the wiring substrate(10) as a flip bonding type while maintaining an airtight of an active area. And. a resin molding unit(70) surrounds the wiring substrate(10) and the bare chip(50) and is sealed.

    Abstract translation: 提供具有高气密特性的表面声波器件封装，以通过包括具有精确和阶梯式界面的布线基板来防止外部湿气渗入内部。 在具有高气密特性的表面声波器件封装中，布线基板（10）包括设置为包括连接布线（12）的封装基座的裸芯片粘接部件。 将紧贴在裸芯片粘合部件上的裸芯片50作为翻转接合型被烧结到布线基板（10）的表面，同时保持有效区域的气密。 和。 树脂模制单元（70）围绕着布线基板（10）和裸芯片（50）并被密封。

    쏘 발란스 필터
    6.
    发明公开
    쏘 발란스 필터 无效
    SAW平衡滤波器

    公开(公告)号：KR1020050092174A

    公开(公告)日：2005-09-21

    申请号：KR1020040017266

    申请日：2004-03-15

    Applicant: 삼성전기주식회사

    Inventor： 이용신 ,  박상욱 ,  김남형

    IPC: H03H9/64

    CPC classification number: H03H9/14588 ,  H03H9/0038 ,  H03H9/0057 ,  H03H9/25

    Abstract: 본 발명은 단순한 전극 구조의 변경을 통하여 불평형 신호의 특성을 개선시킨 쏘 발란스 필터에 관한 것으로서, 상기 쏘 발란스 필터는 필터링할 불평형 전기신호가 인가되는 입력단자; 필터링된 평형 전기신호가 인출되는 제1,2출력단자; 상기 입력단자에 동시에 연결되며 서로 소정 간격을 가지고 대략 평행하게 배치되어 인가된 전기신호를 물리적인 파장으로 변환하는 제1,2 입력 IDT전극; 상기 제1,2 입력 IDT 전극과 평행하도록 그 사이에 배치되며 서로의 전극지가 교차되도록 형성된 제1,2 출력 IDT전극; 상기 제1,2입력IDT전극과 전극지가 교차되도록 형성되어 대역외 잡음을 제거하기 위해 접지되는 제1,2접지전극; 및 상기 제1,2입력IDT전극의 양측에 형성되는 제1,2반사전극을 구비하고, 상기 제1,2접지전극이 각각 인접한 제1,2반사전극과 전기적으로 연결되는데 특징이 있다.

    표면탄성파 필터 패키지 및 그 제조방법
    7.
    发明授权
    표면탄성파 필터 패키지 및 그 제조방법 有权
    표면탄성파필터패키지및그제조방법

    公开(公告)号：KR100631990B1

    公开(公告)日：2006-10-09

    申请号：KR1020050060385

    申请日：2005-07-05

    Applicant: 삼성전기주식회사

    Inventor： 이승희 ,  김철호 ,  이영진 ,  박두철 ,  박상욱 ,  김남형

    IPC: H03H3/08

    Abstract: A surface acoustic wave(SAW) filter package and a method for manufacturing the same are provided to improve the reliability of operation by preventing the penetration of water and the pollution of operation surface of a SAW filter chip. A surface acoustic wave(SAW) filter package(300) comprises a circuit board(110), a metal dam(120), a metal bump(130), a SAW filter chip(210) and a metal layer(220). The circuit board(110) includes a mounting unit(101) having an electrode(111) connected to an exterior electrode terminal electrically. The metal dam(120) is composed of a closed curve to surround the mounting unit(101) of the circuit board(110). The metal bump(130) is connected to the electrode(111) of the circuit board(110). The SAW filter chip(210) is connected to the metal bump(130) and is mounted to the metal dam(120) and the metal bump(130) to form a sealed space. The metal layer(220) has a constant thickness and covers the metal bump(130) and an exposed exterior surface of the SAW filter chip(210).

    Abstract translation: 提供一种表面声波（SAW）滤波器组件及其制造方法，以通过防止水的渗透和SAW滤波器芯片的操作表面的污染来提高操作的可靠性。 表面声波（SAW）滤波器封装300包括电路板110，金属坝120，金属凸块130，SAW滤波器芯片210和金属层220。 电路板（110）包括具有电连接到外部电极端子的电极（111）的安装单元（101）。 金属坝（120）由闭合曲线构成，以围绕电路板（110）的安装单元（101）。 金属凸块（130）连接到电路板（110）的电极（111）。 SAW滤波器芯片（210）连接到金属凸块（130）并且安装到金属坝（120）和金属凸块（130）以形成密封空间。 金属层（220）具有恒定的厚度并且覆盖金属凸块（130）和SAW滤波器芯片（210）的暴露的外表面。

    직렬 2트랙 구조를 갖는 이중모드 표면탄성파 필터
    8.
    发明授权
    직렬 2트랙 구조를 갖는 이중모드 표면탄성파 필터 有权
    직렬2트랙구조를갖는이중모드표면탄성파필터

    公开(公告)号：KR100631412B1

    公开(公告)日：2006-10-04

    申请号：KR1020050037843

    申请日：2005-05-06

    Applicant: 삼성전기주식회사

    Inventor： 박상욱 ,  박주훈 ,  김남형 ,  이영진 ,  박두철 ,  이승희

    IPC: H03H9/64

    Abstract: A double mode surface acoustic wave(DMS) filter having a serial two track structure is provided to reduce the size by minimizing the number of reflectors and decreasing the width of an aperture. A double mode surface acoustic wave(DMS) filter(100) having serial two track structure comprises a first double mode DMS track(120) and a second double mode DMS track(130). The first double mode DMS track(120) includes at least one inter digital transducer(IDT) electrode which filters an input signal in a constant band between a first reflector electrode(124) and a second reflector electrode(125). The second double mode DMS track(130) comprises a first parallel two track(151), a second parallel two track(152), first and second reflector electrodes(137,138) and third reflector electrode(139). The first parallel two track(151) includes IDT electrode composed of serial two track which receives the signal from the IDT electrode of the first double mode DMS track(120) and outputs the signal filtered in the constant band to a first output terminal. The second parallel two track(152) includes IDT electrode composed of serial two track which receives the signal from the IDT electrode of the first double mode DMS track(120) and outputs the signal filtered in the constant band to a second output terminal. The first and second reflector electrodes(137,138) are configured at one end of the first parallel two track(151) and the other end of the second parallel two track(152). The third reflector electrode(139) is formed between the first parallel two track(151) and the second parallel two track(152).

    Abstract translation: 提供具有串行双轨道结构的双模式表面声波（DMS）滤波器，以通过最小化反射器的数量和减小孔径的宽度来减小尺寸。 具有串行双轨道结构的双模式表面声波（DMS）滤波器（100）包括第一双模DMS轨道（120）和第二双模DMS轨道（130）。 第一双模式DMS轨道（120）包括至少一个互连数字换能器（IDT）电极，其对第一反射器电极（124）和第二反射器电极（125）之间的恒定频带中的输入信号进行滤波。 第二双模DMS轨道（130）包括第一平行双轨道（151），第二平行双轨道（152），第一和第二反射器电极（137,138）以及第三反射器电极（139）。 第一平行双轨道（151）包括由串行两条轨道组成的IDT电极，该轨道接收来自第一双模DMS轨道（120）的IDT电极的信号，并将在恒定频带中滤波的信号输出到第一输出端。 第二平行双轨道（152）包括由串行两条轨道组成的IDT电极，该轨道接收来自第一双模DMS轨道（120）的IDT电极的信号，并将在恒定频带中滤波的信号输出到第二输出端子。 第一和第二反射器电极（137,138）配置在第一平行两轨道（151）的一端和第二平行两轨道（152）的另一端。 第三反射器电极（139）形成在第一平行的两个轨道（151）和第二平行的两个轨道（152）之间。

    표면 탄성파 디바이스 패키지 및 그 제조 방법
    9.
    发明公开
    표면 탄성파 디바이스 패키지 및 그 제조 방법 无效
    表面声波装置包及其制造方法

    公开(公告)号：KR1020060116894A

    公开(公告)日：2006-11-16

    申请号：KR1020050039416

    申请日：2005-05-11

    Applicant: 삼성전기주식회사

    Inventor： 박주훈 ,  박상욱 ,  김남형 ,  이영진 ,  박두철 ,  이승희

    IPC: H03H9/64 ,  H03H3/08

    CPC classification number: H03H3/08 ,  H03H9/02574 ,  H03H9/0561 ,  H03H9/059 ,  H03H9/25

    Abstract: A surface acoustic wave device package and a method for manufacturing the same are provided to prevent moisture from being infiltrated into an airtight space by protecting the SAW device package through a ring-shape metal plated layer and a metal shield layer. In a surface acoustic wave device package(100), a via substructure is formed inside a multi-layer wiring substrate(101). A SAW(Surface Acoustic Wave) chip(107) is bonded at a surface of the multi-layer wiring substrate(101) as a flip chip type. A ring-shape metal plated layer(104) is formed at the surface of the multi-layer wiring substrate(101), along an outline of the SAW chip(107). A protective film(106) forms an airtight space by surrounding the SAW chip(107). A metal shield layer(116) formed at a surface of the protective film(106) is connected with the ring-shape metal plated layer(104).

    Abstract translation: 提供一种弹性表面波器件封装及其制造方法，以通过环形金属镀层和金属屏蔽层来保护SAW器件封装，防止水分渗入气密空间。 在声表面波器件封装（100）中，在多层布线基板（101）的内部形成通孔子结构。 SAW（表面声波）芯片（107）作为倒装芯片型接合在多层布线基板（101）的表面。 沿着SAW芯片（107）的轮廓，在多层布线基板（101）的表面形成环状金属镀层（104）。 保护膜（106）通过围绕SAW芯片（107）形成气密空间。 形成在保护膜（106）表面的金属屏蔽层（116）与环形金属镀层（104）连接。

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