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公开(公告)号：KR101119305B1
公开(公告)日：2012-03-16
申请号：KR1020100131624
申请日：2010-12-21
Applicant: 삼성전기주식회사
CPC classification number: H01L23/13 , H01L21/4814 , H01L23/14
Abstract: PURPOSE: A semiconductor package substrate including a dummy region is provided to prevent the warpage of the semiconductor package substrate by forming a first metal pattern and a second metal pattern on both sides of the dummy region. CONSTITUTION: A first metal pattern(11) and a second metal pattern(12) are formed on a dummy region(10) of a substrate. The thickness of the first metal pattern is equal to the thickness of the second metal pattern. The first and second metal patterns prevent the warpage of the semiconductor package substrate and have a lattice shape. The first metal pattern and the second metal pattern are formed with a copper pattern.
Abstract translation: 目的：提供一种包括虚拟区域的半导体封装基板，以通过在虚拟区域的两侧形成第一金属图案和第二金属图案来防止半导体封装基板的翘曲。 构成：在基板的虚拟区域（10）上形成第一金属图案（11）和第二金属图案（12）。 第一金属图案的厚度等于第二金属图案的厚度。 第一和第二金属图案防止半导体封装基板的翘曲并且具有格子形状。 第一金属图案和第二金属图案形成有铜图案。
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公开(公告)号：KR100887068B1
公开(公告)日：2009-03-04
申请号：KR1020060073769
申请日：2006-08-04
Applicant: 삼성전기주식회사
CPC classification number: H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: 발광 다이오드 모듈 및 이의 제조방법이 개시된다. 개시된 발광 다이오드 모듈은 발광칩과; 상기 발광칩이 안착되는 내부 공간을 갖는 패키지 하우징과; 상기 발광칩에서 방출된 광을 상기 광의 파장보다 긴 파장의 광으로 변환시키는 형광물질들을 가지는 형광층;을 포함하며, 상기 형광층의 농도나 두께는 상기 형광층의 위치에 따라 다른 것을 특징으로 한다.
개시된 발광 다이오드 모듈의 제조방법은, 발광칩을 형성하는 단계와; 상기 발광칩이 안착될 내부공간을 갖는 패키지 하우징을 마련하는 단계와; 상기 발광칩을 상기 패키지 하우징의 내부에 안착시키는 단계와; 상기 패키지 하우징의 내부에 안착된 발광칩에서 방출되는 광의 방사패턴을 측정하는 단계와; 상기 방사패턴으로부터 형광층의 농도분포 또는 두께를 결정하는 단계와; 상기 발광칩의 상부에 형광층을 상기 결정된 농도분포 또는 두께로 형성하는 단계;를 포함하는 것을 특징으로 한다.-
公开(公告)号：KR100780186B1
公开(公告)日：2007-11-27
申请号：KR1020060026476
申请日：2006-03-23
Applicant: 삼성전기주식회사
IPC: G02F1/1335 , H01L33/50 , H01L33/48
Abstract: 본발명은발광다이오드를이용한 LCD 백라이트유니트에관하여개시한다. 개시된 LCD 백라이트유니트는: 청색광원, 적색광원및 녹색광원을구비하며, 상기녹색광원은, UV 발광다이오드; 상기 UV 발광다이오드로부터의광으로여기되는녹색형광체;를구비하는것을특징으로한다.
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公开(公告)号：KR1020060076596A
公开(公告)日：2006-07-04
申请号：KR1020040115070
申请日：2004-12-29
Applicant: 삼성전기주식회사
IPC: H01L33/48
CPC classification number: H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/48091 , H01S5/02236 , H01S5/0224 , H01S5/02256 , H01S5/02272 , H01S5/02476 , H01S5/0425 , H01L2924/00014
Abstract: 본 발명은 솔더 범프(solder bump) 대신에 열전도도가 높은 금속컬럼을 이용함으로써 열방출 효율을 향상시킨 발광소자의 플립칩 본딩 구조체를 개시한다. 본 발명에 따른 발광소자의 플립칩 본딩 구조체는, 발광소자; 서브마운트; 및 상기 발광소자와 서브마운트 사이를 전기적 및 열적으로 결합시키기 위한 금속컬럼;을 포함하는 것을 특징으로 한다.
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公开(公告)号：KR1020060062716A
公开(公告)日：2006-06-12
申请号：KR1020040101653
申请日：2004-12-06
Applicant: 삼성전기주식회사
Inventor： 김형근
CPC classification number: H01L33/647 , H01L33/486 , H01L33/62 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2224/0401
Abstract: A light emitting device package is provided. The light emitting device package includes: a light emitting device; and first and second electrodes disposed a predetermined distance from each other and respectively adhered to the light emitting device so as to be electrically connected to the light emitting device, the first and second electrodes applying a current or voltage to the light emitting device and emitting heat generated by the light emitting device.
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Patent Agency Ranking
公开(公告)号：KR100891800B1
公开(公告)日：2009-04-07
申请号：KR1020070120472
申请日：2007-11-23
Applicant: 삼성전기주식회사
Abstract: A manufacturing method of light emitting diode array and a light emitting diode array are provided to improve the productivity of manufacturing process by suppressing the reliability deterioration of the emitting device. A plurality of grooves are formed on the one side of substrate(100). An insulating layer(120) is formed on the substrate where is exposed to the lateral side of groove and the gap between the grooves. The insulating layer comprises the insulating material in order to electrically separate the discrete emitting device. The first conductivity type semiconductor layer(130), an active layer(140), and the second electrical conduction semiconductor layer(150) are laminated in each groove portion.
Abstract translation: 提供了发光二极管阵列和发光二极管阵列的制造方法，以通过抑制发光装置的可靠性劣化来提高制造工艺的生产率。 在基板（100）的一侧形成有多个槽。 绝缘层（120）形成在基板上，暴露于槽的侧面和槽之间的间隙。 绝缘层包括绝缘材料以便电离分离发射器件。 第一导电类型半导体层（130），有源层（140）和第二导电半导体层（150）层叠在每个沟槽部分中。
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公开(公告)号：KR1020080012631A
公开(公告)日：2008-02-12
申请号：KR1020060073769
申请日：2006-08-04
Applicant: 삼성전기주식회사
CPC classification number: H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: An LED(light emitting diode) module is provided to form an LED diode with high illumination efficiency by determining the thickness or density of a phosphor layer in consideration of a radiation pattern of light emitted from a light emitting chip. A package housing has an inner space where a light emitting chip is placed. A phosphor layer(180) has phosphor materials that convert the light emitted from the light emitting chip into light with a wavelength greater than that of the light emitted from the light emitting chip. The phosphor layer has a different density distribution in each position. The density distribution of the phosphor layer is determined in consideration of a radiation pattern of the light emitted from the light emitting chip.
Abstract translation: 考虑到从发光芯片发射的光的辐射图案，通过确定荧光体层的厚度或密度来提供LED（发光二极管）模块以形成具有高照明效率的LED二极管。 封装壳体具有放置发光芯片的内部空间。 荧光体层（180）具有将从发光芯片发射的光转换成波长大于从发光芯片发出的光的波长的光的荧光体材料。 磷光体层在每个位置具有不同的密度分布。 考虑到从发光芯片发射的光的辐射图来确定荧光体层的密度分布。
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公开(公告)号：KR1020070079476A
公开(公告)日：2007-08-07
申请号：KR1020060010179
申请日：2006-02-02
Applicant: 삼성전기주식회사
Abstract: A light emitting diode module is provided to reflect light of a phosphor layer and to improve illumination efficiency by forming a reflecting plate between the phosphor layer and a light emitting chip. A light emitting diode module includes a light emitting chip(22), a phosphor layer(25) formed with a phosphor for exciting the light of the light emitting chip to lengthen a wavelength of the light, and a reflecting plate(28) arranged between the light emitting chip and the phosphor layer to reflect the light excited by the phosphor layer. The light emitting chip is used for radiating ultraviolet light. The phosphor layer is used for radiating visible rays. The phosphor layer is formed with a mixture of red, green, and blue phosphors. The light emitting chip emits blue light. The phosphor layer is formed with a yellow phosphor.
Abstract translation: 提供发光二极管模块以反射荧光体层的光并通过在荧光体层和发光芯片之间形成反射板来提高照明效率。 发光二极管模块包括发光芯片（22），形成有荧光体的荧光体层（25），用于激发发光芯片的光以延长光的波长;以及反射板（28），布置在 发光芯片和荧光体层，以反射由荧光体层激发的光。 发光芯片用于辐射紫外线。 荧光层用于辐射可见光。 荧光体层由红色，绿色和蓝色荧光体的混合物形成。 发光芯片发出蓝光。 荧光体层由黄色荧光体形成。
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公开(公告)号：KR1020070034251A
公开(公告)日：2007-03-28
申请号：KR1020050088715
申请日：2005-09-23
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
Abstract: 발광소자 패키지가 개시된다. 개시된 발광소자 패키지는, 발광소자; 상부에 소정 형상의 캐비티가 형성되어 있으며, 캐비티의 바닥면에는 발광소자가 적재되고, 상기 캐비티의 측면은 오목한 라운드 형상을 가지는 패키지 몸체; 패키지 몸체에 일체로 형성되는 제1 전극; 및 패키지 몸체에 삽입되는 제2 전극;을 구비한다.
Abstract translation: 公开了一种发光器件封装。 一种发光器件封装，包括：发光元件; 具有预定形状的空腔形成在空腔的顶表面上，发光器件安装在空腔的底表面上，并且空腔的侧表面是凹入的圆形; 与封装体一体形成的第一电极; 并且将第二电极插入包装体中。
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公开(公告)号：KR1020070005843A
公开(公告)日：2007-01-10
申请号：KR1020050060879
申请日：2005-07-06
Applicant: 삼성전기주식회사
CPC classification number: C09K11/7738 , H01L33/502 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H05B33/14 , Y02B20/181 , H01L2924/00
Abstract: Provided is a silicophosphate-based phosphor, which shows excellent light emitting efficiency to a UV light source and has excellent color rendering characteristics. The silicophosphate-based phosphor is represented by the formula of (Sr(1-x-y-a-b-c)BaaCabMgcEuxMny)4Si(PO4)4, wherein each of x, y and a is greater than 0 and equal to or less than 0.2, and each of b and c is greater than 0 and equal to or less than 0.5. Particularly, the silicophosphate-based phosphor is represented by the formula of (Sr(1-x-y) EuxMny)4Si(PO4)4 or (Sr(1-x-y-b)CabEuxMny)4Si(PO4)4. The silicophosphate-based phosphor is used in a white light emitting device.
Abstract translation: 提供了一种对于UV光源显示出优异的发光效率且具有优异的显色特性的磷酸磷系荧光体。 基于硅磷酸盐的荧光体由式（Sr（1-xyabc）BaaCabMgcEuxMny）4 Si（PO4）4表示，其中x，y和a各自大于0且等于或小于0.2，并且每个b 且c大于0且等于或小于0.5。 特别地，由（Sr（1-x-y）EuxMny）4 Si（PO4）4或（Sr（1-x-y-b）CabEuxMny）4Si（PO4）4的式表示硅磷酸盐系荧光体。 基于硅磷酸盐的磷光体用于白色发光器件中。
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