Abstract:
A manufacturing method of light emitting diode array and a light emitting diode array are provided to improve the productivity of manufacturing process by suppressing the reliability deterioration of the emitting device. A plurality of grooves are formed on the one side of substrate(100). An insulating layer(120) is formed on the substrate where is exposed to the lateral side of groove and the gap between the grooves. The insulating layer comprises the insulating material in order to electrically separate the discrete emitting device. The first conductivity type semiconductor layer(130), an active layer(140), and the second electrical conduction semiconductor layer(150) are laminated in each groove portion.
Abstract:
A nitride semiconductor light emitting device and a manufacturing method thereof are provided to increase a light extraction efficiency of the light emitted from the top surface of a nitride semiconductor. An active layer(13) is formed on a first conductive nitride semiconductor layer(12), and a second conductive nitride semiconductor layer(14) is formed on the active layer. Plural hexagonal nitride crystals(16) are formed on the second conductive nitride semiconductor layer, and have an inclined crystalline surface to the top surface of the second nitride semiconductor layer. A mask(15) is formed on the second conductive nitride semiconductor layer, and has plural windows at a center region of each nitride crystal.
Abstract:
A light emitting diode package capable of obtaining desired light emitting color by converting wavelength with phosphor powder is provided to prevent direct contact of a LED chip and a phosphor powder by forming a micro lens between molding material including the LED chip and the phosphor powder. A lead frame(150) includes a pair of lead terminals. A part of the lead frame is loaded in an inner side of a package(110). The package includes an opened radiation window in order to radiate a light. A LED chip(130) is mounted on the lead frame inside the package. A micro lens surrounds the LED chip. An electrode connection part(140) is made of a conductive adhesive or a bump ball in order to conduct the LED chip and the lead frame. Molding material(200) is filled between an outer part of the micro lens and an inner part of the package, and contains a phosphor powder.
Abstract:
A nitride semiconductor light emitting device is provided to enable the plural active layers having the different wavelength light respectively to realize the different wavelength light without deterioration of a boundary and film quality. A nitride semiconductor light emitting device comprises a first conductive and a second conductive nitride semiconductor layers(12,17) and a plurality of active regions. Wherein, the active regions are formed between the first and the second nitride semiconductor layers, and emits different wavelength light respectively. The active regions comprises a first active layer, which emits a first wavelength light, and a second active layer which emits a second wavelength light which is longer than the first wavelength light. The first and the second active layers are made up of at least one quantum well layer and a quantum barrier layer which are formed alternately.
Abstract:
A light emitting diode package is provided to obtain high optical extraction efficiency by using an electrical insulating transparent fluid instead of a refractive index matching medium. A package substrate(41) includes a mounting area and a first and second wiring structures having exposed parts. The first and second wiring structures are formed in the mounting region. A light emitting diode(45) includes a first and second electrodes and is loaded in the mounting region so that the first and second electrodes are connected to a first and second bonding pads. A transparent member for cover is loaded in the mounting region of the package substrate. An electrical insulating transparent fluid(47) is used for filling a mounting space of the sealed light emitting diode. The electrical insulating transparent fluid has a refractive index smaller than a refractive index of a component of the light emitting diode.
Abstract:
A method for forming a III group nitride semiconductor thin film and a manufacturing a nitride semiconductor device using the same are provided to ensure a continuous nitride growing process by performing a process of inducing a lateral growing mode in a chamber in which nitride is grown. A first nitride single crystal layer is grown on a substrate(21), and then an etching gas is applied on the upper surface(22a) of the first nitride single crystal layer so that plural pits(P) with an inclined surface of nonpolar crystal are formed in a high potential density region. A second nitride single crystal layer is formed on the first nitride single crystal layer by in-situ so that the pits are maintained as voids(V). The step of forming the second nitride single crystal layer includes growing an intermediate layer on the first nitride single crystal layer, and growing the second nitride single crystal layer on the intermediate layer.
Abstract:
A nitride semiconductor light emitting device is provided to prevent dopant atoms from being transferred to an active layer and enable a heat treatment at a high temperature not lower than 950 °C by growing a p-type nitride semiconductor layer before the active layer is formed. A p-type nitride semiconductor layer(22) is formed on a nitride single crystal growing substrate(21) of an electrical conductivity type. An active layer(23) is formed on the p-type nitride semiconductor layer wherein a plurality of quantum barrier layers and a plurality of quantum well layers are alternately stacked in the active layer. An n-type nitride semiconductor layer(24) is formed on the active layer. A p-side electrode and an n-side electrode are respectively formed on the lower surface of the nitride single crystal growing substrate and the upper surface of the n-type nitride semiconductor layer. The p-type nitride semiconductor layer can include a p-type AlGaN layer that is formed on the substrate to have an interface in contact with the active layer.
Abstract:
A nitride semiconductor light emitting device is provided to prevent the low light emitting efficiency and nonuniform light distribution of a part of a plurality of active layers by making at least a part of a plurality of active layers have a super lattice structure having a thickness that holes can tunnel. A plurality of active layers include p-type and n-type nitride semiconductor layers(27,22), at least one quantum barrier layer(25) and at least one quantum well layer wherein the quantum barrier layer and the quantum well layer are sequentially and alternately formed between the p-type and n-type nitride semiconductor layers and have mutually different light emitting wavelengths. The plurality of active layers include a first active layer(26) emitting at least a first wavelength light and a second active layer(24) emitting a second wavelength light having a longer wavelength than that of the first wavelength light. The quantum barrier layer and the quantum well layer are made of a super lattice structure having a thickness that injected holes can tunnel. The second active layer can be disposed nearer to the n-type nitride semiconductor layer than the first active layer.