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公开(公告)号：KR1020210055651A
公开(公告)日：2021-05-17
申请号：KR1020210058992
申请日：2021-05-07
Applicant: 삼성전기주식회사
Abstract: 본발명은인쇄회로기판의제조방법에관한것이다. 본발명에따른인쇄회로기판의제조방법은, 코어양면에이원동박을가지는한 쌍의동박적층판을준비하는단계; 상기한 쌍의동박적층판을접합층에의하여상호대칭을이루도록접합하는단계; 상기접착층에상호대칭되게접합된상기동박적층판을레이저가공하여비아홀을형성하는단계; 상기비아홀내부에도금을충진함과동시에상기코어상에도금층을형성하는단계; 상기도금층이형성된상기동박적층판을건조기에서고온건조하여상기접착층의접착력을제거함에의해서상기동박적층판을두 개의적층판으로분리하는단계; 및상기분리된동박적층판에각각회로를형성하는단계;를포함한다.
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公开(公告)号：KR1020130046106A
公开(公告)日：2013-05-07
申请号：KR1020110110470
申请日：2011-10-27
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A substrate plating apparatus and a substrate plating method thereof are provided to clamp substrates to remove gaps among the substrates which are placed on the same plane during a plating process, thereby minimizing the thickness deviation of a plating film which is generated by the gaps among the substrates. CONSTITUTION: A substrate plating apparatus includes a dipping unit(120). The dipping unit supports multiple substrates(10) to be placed on the same plane and dips the substrates into a plating bath(110). The dipping unit clamps the substrates to remove gaps among the substrates. The dipping unit comprises a clamping member(122) and a drive unit(124). The clamping member makes supportably the substrates to stand vertically and clamps respectively the upper and lower parts of the substrates altogether. The drive unit drives the clamping member.
Abstract translation: 目的：提供一种基板电镀装置及其基板镀覆方法，以夹持基板以去除在镀覆工艺期间放置在同一平面上的基板之间的间隙，从而最小化由间隙产生的镀膜的厚度偏差 在基板之间。 构成：基板电镀装置包括浸渍单元（120）。 浸渍单元支撑要放置在同一平面上的多个基底（10）并将基底浸入镀浴（110）中。 浸渍单元夹持基板以去除基板之间的间隙。 浸渍单元包括夹紧构件（122）和驱动单元（124）。 夹持构件可支撑地使基板竖直地竖立并且分别夹紧基板的上部和下部。 驱动单元驱动夹紧构件。
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公开(公告)号：KR1020130053289A
公开(公告)日：2013-05-23
申请号：KR1020110119024
申请日：2011-11-15
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A manufacturing method of a printed circuit board is provided to improve packing efficiency of a plating layer by forming a via hole in the shape of a sandglass. CONSTITUTION: A base layer is exposed by removing a part of a copper foil. A through-hole is formed in the exposed region of the base layer. A via hole(140) is formed by applying desmear treatment to the through-hole. A plating layer(150) is formed at the inside of the via hole. A circuit pattern(170) is formed by the plating layer.
Abstract translation: 目的：提供一种印刷电路板的制造方法，通过形成沙漏形状的通孔来提高镀层的包装效率。 构成：通过去除一部分铜箔而露出基层。 在基层的露出区域形成有通孔。 通孔（140）通过对通孔进行去污处理而形成。 在通孔的内侧形成镀层（150）。 电镀图案（170）由镀层形成。
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Patent Agency Ranking
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公开(公告)号：KR1020140033991A
公开(公告)日：2014-03-19
申请号：KR1020120100656
申请日：2012-09-11
Applicant: 삼성전기주식회사
IPC: C23C2/00
Abstract: The present invention provides: a plating bath with which a plating solution for plating a substrate is filled; a plating solution container which is formed under the plating bath to contain plating solution released from the plating bath; and a backflow prevention part which is located in the upper part of the plating solution container to prevent a backflow of bubbles created in the plating solution container.
Abstract translation: 本发明提供：填充用于电镀基板的电镀液的电镀液; 电镀溶液容器，其形成在电镀液下以包含从电镀液中释放的镀液; 以及位于电镀液容器的上部的防回流部，以防止在电镀液容器中产生的气泡的回流。
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公开(公告)号：KR1020140008184A
公开(公告)日：2014-01-21
申请号：KR1020120075604
申请日：2012-07-11
Applicant: 삼성전기주식회사
Abstract: The present invention relates to a method for manufacturing a printed circuit board. The method according to the present invention comprises the steps of: preparing a pair of copper clad laminates having a dual copper foil provided on both sides of a core; bonding the pair of copper clad laminates with a bonding layer to be symmetrical to each other; processing, by laser, the copper clad laminates bonded with the bonding layer to be symmetrical to each other to form via holes; forming a plating layer on the core while filling the via holes with gold; drying the copper clad laminates having the plating layer thereon at high temperatures by a dryer to remove the adhesion of the bonding layer, dividing the copper clad laminates into two laminates; and forming circuitry on the divided two laminates, respectively.
Abstract translation: 本发明涉及印刷电路板的制造方法。 根据本发明的方法包括以下步骤：制备一对铜箔层压板，其具有设置在芯体两侧的双铜箔; 将所述一对覆铜层压板与粘合层接合以使其彼此对称; 通过激光处理与接合层结合的覆铜层压板彼此对称以形成通孔; 在用金填充通孔的同时在芯上形成镀层; 通过干燥器在高温下干燥其上具有镀层的铜箔层压板，以除去粘合层的粘附，将覆铜层压板分成两层; 并分别在分开的两个层压板上形成电路。
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公开(公告)号：KR1020130134233A
公开(公告)日：2013-12-10
申请号：KR1020120057614
申请日：2012-05-30
Applicant: 삼성전기주식회사
Abstract: Disclosed is a substrate plating apparatus and a method for controlling the substrate plating apparatus. According to an embodiment of the present invention, provided is the substrate plating apparatus comprising: a plating tank, which stores a plating solution; an anode, which is arranged in the plating tank, facing the substrate; and a shielding member, which is installed to move upwards and downwards in order to shield one side of the anode facing the substrate, corresponding to the size of the substrate.
Abstract translation: 公开了一种基板电镀装置及其控制方法。 根据本发明的实施例，提供了一种基板电镀装置，包括：镀槽，其存储电镀液; 布置在电镀槽中的面向基板的阳极; 以及屏蔽构件，其被安装成向上和向下移动，以便屏蔽面对衬底的阳极的一侧，对应于衬底的尺寸。
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