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公开(公告)号：KR101412951B1
公开(公告)日：2014-06-26
申请号：KR1020120090322
申请日：2012-08-17
Applicant: 삼성전기주식회사
CPC classification number: H01C7/00 , H01C7/003 , H01C17/006 , H01C17/065 , H01C17/06526 , Y10T29/49082
Abstract: 본 발명은 세라믹 기판, 상기 세라믹 기판의 일 면에 형성된 접합부, 접합부 상에 형성된 저항체를 포함하며, 상기 접합부는 구리(Cu), 니켈(Ni) 및 구리-니켈(Cu-Ni) 중 적어도 하나를 포함하는 칩 저항기에 관한 것이다.
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公开(公告)号：KR1020100106104A
公开(公告)日：2010-10-01
申请号：KR1020090024559
申请日：2009-03-23
Applicant: 삼성전기주식회사
IPC: H05K13/04 , H01L23/544 , H01L21/02 , H01L21/00
Abstract: PURPOSE: A method for manufacturing a semiconductor package is provided to easily obtain marked information through a scanner by making information stored in an integrated production control system on the surface of a semiconductor package in a barcode type. CONSTITUTION: A printed circuit board is prepared(S110). Basic information for indentifying a semiconductor package is marked on a tag(S120). The basic information is stored in a storage medium(S130). The mounting process history of a semiconductor chip is stored in the storage medium(S140). The packaging process history of a semiconductor package is stored in the storage medium(S150). The information stored in the storage medium is marked on the semiconductor package in a barcode type(S160).
Abstract translation: 目的：提供一种制造半导体封装的方法，通过在条形码类型的半导体封装的表面上存储在综合生产控制系统中的信息，通过扫描仪容易地获得标记信息。 规定：准备印刷电路板（S110）。 在标签上标记用于识别半导体封装的基本信息（S120）。 基本信息存储在存储介质中（S130）。 将半导体芯片的安装处理历史存储在存储介质中（S140）。 半导体封装的封装处理历史被存储在存储介质中（S150）。 存储在存储介质中的信息以条形码类型在半导体封装上标记（S160）。
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Patent Agency Ranking
公开(公告)号：KR1020140033991A
公开(公告)日：2014-03-19
申请号：KR1020120100656
申请日：2012-09-11
Applicant: 삼성전기주식회사
IPC: C23C2/00
Abstract: The present invention provides: a plating bath with which a plating solution for plating a substrate is filled; a plating solution container which is formed under the plating bath to contain plating solution released from the plating bath; and a backflow prevention part which is located in the upper part of the plating solution container to prevent a backflow of bubbles created in the plating solution container.
Abstract translation: 本发明提供：填充用于电镀基板的电镀液的电镀液; 电镀溶液容器，其形成在电镀液下以包含从电镀液中释放的镀液; 以及位于电镀液容器的上部的防回流部，以防止在电镀液容器中产生的气泡的回流。
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公开(公告)号：KR1020140023819A
公开(公告)日：2014-02-27
申请号：KR1020120090322
申请日：2012-08-17
Applicant: 삼성전기주식회사
CPC classification number: H01C7/00 , H01C7/003 , H01C17/006 , H01C17/065 , H01C17/06526 , Y10T29/49082
Abstract: The present invention relates to a chip resistor and a method for manufacturing the same. According to one embodiment of the present invention, the chip resistor includes a ceramic substrate; a bonding part formed on one side of the ceramic substrate; and a resistance formed on the bonding part. The bonding part includes at least one among Cu, Ni, and Cu-Ni.
Abstract translation: 芯片电阻及其制造方法技术领域本发明涉及片状电阻及其制造方法。 根据本发明的一个实施例，片式电阻器包括陶瓷衬底; 形成在所述陶瓷基板的一侧的接合部; 以及形成在所述接合部上的电阻。 结合部分包括Cu，Ni和Cu-Ni中的至少一种。
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公开(公告)号：KR1020130134233A
公开(公告)日：2013-12-10
申请号：KR1020120057614
申请日：2012-05-30
Applicant: 삼성전기주식회사
Abstract: Disclosed is a substrate plating apparatus and a method for controlling the substrate plating apparatus. According to an embodiment of the present invention, provided is the substrate plating apparatus comprising: a plating tank, which stores a plating solution; an anode, which is arranged in the plating tank, facing the substrate; and a shielding member, which is installed to move upwards and downwards in order to shield one side of the anode facing the substrate, corresponding to the size of the substrate.
Abstract translation: 公开了一种基板电镀装置及其控制方法。 根据本发明的实施例，提供了一种基板电镀装置，包括：镀槽，其存储电镀液; 布置在电镀槽中的面向基板的阳极; 以及屏蔽构件，其被安装成向上和向下移动，以便屏蔽面对衬底的阳极的一侧，对应于衬底的尺寸。
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公开(公告)号：KR1020140025071A
公开(公告)日：2014-03-04
申请号：KR1020120091187
申请日：2012-08-21
Applicant: 삼성전기주식회사
CPC classification number: B08B9/28 , B08B5/04 , B08B9/205 , B08B2209/08
Abstract: The present invention provides a container cleaning device which includes: a cover part with an open side providing accommodating inner space and of which the open side covers a container to enclose the inner space; a gas supplying part located on one surface of the cover part; a gas spraying device which is located in the inner space and is connected to a lower side of the gas supplying part; and at least one suction part which is located on one surface of the cover part and sucks gas and impurities in the inner space.
Abstract translation: 本发明提供了一种容器清洗装置，其特征在于，具有：盖部，其开口部设有容纳内部空间，所述开口侧覆盖容器以封闭所述内部空间; 位于所述盖部的一个表面上的气体供给部; 气体喷射装置，其位于所述内部空间中并且连接到所述气体供给部的下侧; 以及位于盖部的一个表面上的至少一个吸引部，吸附内部空间的气体和杂质。
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公开(公告)号：KR101060907B1
公开(公告)日：2011-08-30
申请号：KR1020090024559
申请日：2009-03-23
Applicant: 삼성전기주식회사
IPC: H05K13/04 , H01L23/544 , H01L21/02 , H01L21/00
Abstract: 본 발명은 반도체 패키지 제조 방법에 관한 것으로, 인쇄회로기판을 마련하는 단계; 제조 대상인 반도체 패키지를 식별할 수 있는 기초 정보를 바코드화하여 태그에 마킹하는 단계; 상기 태그에 마킹된 바코드를 스캔하여 상기 기초 정보를 저장매체에 저장하는 단계; 상기 인쇄회로기판에 반도체 칩을 실장한 후, 상기 저장매체에 실장 공정 이력을 저장하는 단계; 상기 반도체 칩을 패키징하여 반도체 패키지를 형성한 후, 상기 저장매체에 패키징 공정 이력을 저장하는 단계; 및 상기 저장매체에 저장된 상기 기초 정보, 상기 실장 공정 이력 및 상기 패키징 공정 이력에 대한 정보를 바코드화하여 상기 반도체 패키지에 마킹하는 단계;를 포함함으로서, 스캐너를 이용하여 마킹된 정보를 쉽게 확인할 수 있고, 이로 인해 각각의 반도체 패키지에 대한 제조 이력의 추적관리가 가능하다.
마킹, 바코드, 생산이력 추적, 반도체 패키지
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