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公开(公告)号：KR1020140020504A
公开(公告)日：2014-02-19
申请号：KR1020120087033
申请日：2012-08-09
Applicant: 삼성전기주식회사
Abstract: The present invention relates to a method for manufacturing a rigid-flexible printed circuit board (PCB). The method includes the steps of: forming other circuits except for a flex terminal circuit on a flexible copper clad laminate (FCCL); inserting an insulator in the laminate on which the circuits are formed and adding a circuit pattern layer on the top surface and the bottom surface of the laminate to form a first lamination; forming an N^th lamination by repeating, several times, a procedure of adding a circuit pattern layer on the top surface and the bottom surface of the first lamination after inserting an insulator from the top and the bottom of the first lamination; and forming, if it is completed to form the N^th lamination, a flex terminal circuit after opening a flex portion. According to the present invention, it is possible to remarkably reduce errors in size resulting from a size change by expansion/contraction of a substrate by forming the flex terminal circuit in an outer layer later not forming the flex terminal circuit in an inner layer first. [Reference numerals] (AA) START; (BB) END; (S301) Forming the other circuits except for a flex terminal circuit on a flexible copper clad laminate (FCCL); (S302) Inserting an insulator in the laminate on which the circuits are formed and forming a first lamination by adding a circuit pattern layer on the top surface and the bottom surface of the laminate; (S303) Forming an N^th lamination by repeating, several times, a procedure of adding a circuit pattern layer on the top surface and the bottom surface of the first lamination after inserting an insulator from the top and the bottom of the first lamination; (S304) Forming a flex terminal circuit after opening a flex portion when it is completed to form the N^th lamination
Abstract translation: 本发明涉及一种刚性柔性印刷电路板（PCB）的制造方法。 该方法包括以下步骤：在柔性覆铜层压板（FCCL）上形成除柔性端子电路之外的其它电路; 在其上形成有电路的层叠体中插入绝缘体，并且在层叠体的顶表面和底表面上添加电路图案层以形成第一层压体; 在从第一层压体的顶部和底部插入绝缘体之后，重复多次重复第一叠层的顶表面和底表面上的电路图案层的步骤，形成第N层叠; 并且如果完成形成第N层叠，则在打开柔性部分之后形成柔性端子电路。 根据本发明，可以通过在外层中形成柔性端子电路，而不是首先在内层中形成柔性端子电路，从而可以显着地减小由于基板的膨胀/收缩引起的尺寸变化引起的尺寸误差。 （附图标记）（AA）START; （BB）END; （S301）在柔性覆铜层压板（FCCL）上形成除柔性端子电路之外的其它电路; （S302）在形成有电路的层叠体中插入绝缘体，并通过在层叠体的上表面和底面上添加电路图案层而形成第一层叠体; （S303）通过重复几次，从第一层压体的顶部和底部插入绝缘体之后，再次重复在第一层压体的顶表面和底表面上添加电路图案层的步骤，形成N层叠; （S304）在完成柔性部分之后形成柔性端子电路以形成第N层叠
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公开(公告)号：KR101022965B1
公开(公告)日：2011-03-16
申请号：KR1020080105356
申请日：2008-10-27
Applicant: 삼성전기주식회사
Abstract: 본 발명은 다층 인쇄회로기판 및 그 제조방법에 관한 것으로, 다수의 절연층, 및 상기 절연층에 형성된 층간 연결을 위한 범프 및 회로층을 포함하고, 상기 범프는 페이스트 범프 및 필도금 범프가 각 층별로 교대로 형성되어 있는 것을 특징으로 하며, 제조시간 및 제조비용이 절약되고 제조공정이 간단한 다층 인쇄회로기판 및 그 제조방법을 제공한다.
페이스트 범프, 필도금 범프, 가압, 일괄적층-
公开(公告)号：KR1020110001030A
公开(公告)日：2011-01-06
申请号：KR1020090058414
申请日：2009-06-29
Applicant: 삼성전기주식회사
IPC: H01L23/34
CPC classification number: H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L23/3735 , H01L23/3736 , H01L23/481 , H01L25/0753
Abstract: PURPOSE: A heat dissipation package and a manufacturing method thereof are provided to effectively discharge heat generated in an electronic part to a metal core layer by including a heat dissipation via formed in the vicinity of the metal by passing a part of an insulating layer. CONSTITUTION: An insulating layer(130) and a metal layer are formed in one side of a metal core(110). A circuit layer(150) is formed in the other side of the insulating layer. A heat dissipation via(170) is extended from the circuit layer in order to pass through a part of the insulating layer in a thicker direction. An electronic part(300) is mounted on the circuit layer. A via hole passes through a part of the insulating layer and the metal layer.
Abstract translation: 目的：提供一种散热封装及其制造方法，通过使绝缘层的一部分通过包含形成在金属附近的散热通孔，来有效地将电子部件产生的热量排出到金属芯层。 构成：在金属芯（110）的一侧形成绝缘层（130）和金属层。 电路层（150）形成在绝缘层的另一侧。 散热通孔（170）从电路层延伸，以便在更厚的方向穿过绝缘层的一部分。 电子部件（300）安装在电路层上。 通孔穿过绝缘层和金属层的一部分。
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公开(公告)号：KR1020100079336A
公开(公告)日：2010-07-08
申请号：KR1020080137776
申请日：2008-12-31
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A rigid flexible PCB and manufacturing method thereof reduce the fabrication time by being at the same time proceed the concurrent tack and molding of the in advance manufactured radio frequency shielding film. CONSTITUTION: The rigid part comprises the ductility insulating layer(110) and the stiffness insulating layer(400) having the circuit layer(130). By extending the ductility insulating layer included in the rigid part in the outside of the rigid part the flexible part is formed. The radio frequency shielding film(300) is laminated in single-side or both sides of the flexible part. The both ends is first of all in other words buried of the radio frequency shielding film to the rigid part. The radio frequency shielding film comprises the bonding layer, and the metal layer and insulating film(350).
Abstract translation: 目的：刚性柔性PCB及其制造方法通过同时进行预先制造的射频屏蔽膜的同时粘合和模制来缩短制造时间。 构成：刚性部分包括具有电路层（130）的延性绝缘层（110）和刚度绝缘层（400）。 通过将包含在刚性部分中的刚性部分的延展性绝缘层延伸到刚性部分的外部，形成柔性部分。 射频屏蔽膜（300）层压在柔性部件的单侧或两侧。 首先将射频屏蔽膜埋入刚性部分。 射频屏蔽膜包括接合层，以及金属层和绝缘膜（350）。
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公开(公告)号：KR1020100062004A
公开(公告)日：2010-06-10
申请号：KR1020080120399
申请日：2008-12-01
Applicant: 삼성전기주식회사
IPC: H05K3/04
CPC classification number: H05K3/0044 , H05K2203/02
Abstract: PURPOSE: A method for processing the outer appearance of a printed circuit board is provided to reduce process time and costs by removing a sheet process stage. CONSTITUTION: A processing member for processing the outer appearance of a printed circuit board is prepared(S110). The processing member is connected to an ultrasonic generator(S120). The outer appearance of the printed circuit board is processed by applying an ultrasonic wave to the process member from the ultrasonic generator(S130). The processing member is a panel process member or cylinder processing member. The processing member includes an ultrasonic transmission unit and an acute angel unit. The ultrasonic transmission unit transmits the ultrasonic wave from the ultrasonic generator to the acute angle unit.
Abstract translation: 目的：提供一种处理印刷电路板外观的方法，通过去除片材加工阶段来缩短加工时间和成本。 规定：准备用于处理印刷电路板的外观的处理部件（S110）。 处理构件连接到超声波发生器（S120）。 通过从超声波发生器向处理构件施加超声波来处理印刷电路板的外观（S130）。 处理构件是面板处理构件或气缸处理构件。 处理构件包括超声波传输单元和锐角单元。 超声波发送单元将超声波从超声波发生器发送到锐角单位。
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Patent Agency Ranking
公开(公告)号：KR1020090053198A
公开(公告)日：2009-05-27
申请号：KR1020070119900
申请日：2007-11-22
Applicant: 삼성전기주식회사
IPC: H05K3/40
CPC classification number: H05K3/4007 , H05K3/3484 , H05K2203/0139
Abstract: 인쇄회로기판 및 그 제조방법이 개시된다. 제1 도체층의 일면에 제1 도전성 범프를 형성하는 단계, 제2 도체층의 제1 도전성 범프와 상응하는 위치에 제2 도전성 범프를 형성하는 단계, 제1 도전성 범프가 제1 절연재의 일면을 향하도록 제1 절연재에 제1 도체층을 적층하는 단계, 제2 도전성 범프가 제1 절연재의 타면을 향하도록 제1 절연재에 제2 도체층을 적층하는 단계 및 제1 도체층 및 제2 도체층을 압착하는 단계를 포함하는 인쇄회로기판 제조방법은, 절연재의 양면에서 도전성 범프가 각각 압입되도록 하여 절연재의 두께를 증가시킬 수 있으며, 이를 통해 고객의 요구에 맞는 후판 인쇄회로기판을 제조할 수 있다.
도전성 범프, 후판, 도체층, 인쇄회로기판-
公开(公告)号：KR1020070025493A
公开(公告)日：2007-03-08
申请号：KR1020050081731
申请日：2005-09-02
Applicant: 삼성전기주식회사
CPC classification number: H05K3/421 , H05K3/4644 , H05K2201/09563
Abstract: A manufacturing method of an all layer inner via hole printed circuit board is provided to is provided to enhance connection between upper and lower portions in layers by filling a via hole through the fill plating. Each of plural circuit substrates(260) has a circuit at a both sides and at least one or more via holes processed by a fill plating. Each of plural unclad substrates(270) has at least one or more via holes processed by the fill plating. The plural circuit substrates and the plural unclad substrates are sequentially laminated. A multi-layer with an all layer inner via hole is formed by attaching the plural circuit substrates to the plural unclad substrates. An adhesive is coated on both sides of the plural unclad substrates after the plural unclad substrates are provided.
Abstract translation: 提供全层内通孔印刷电路板的制造方法，以通过填充通孔填充电镀来增强层中的上部和下部之间的连接。 多个电路基板（260）中的每一个具有在两侧的电路和至少一个或多个通过填充电镀处理的通孔。 多个未包覆基板（270）中的每一个具有由填充电镀处理的至少一个或多个通孔。 顺序层叠多个电路基板和多个未包覆基板。 通过将多个电路基板附接到多个未包覆基板来形成具有全层内通孔的多层。 在设置多个未包覆基板之后，在多个未包覆基板的两侧上涂布粘合剂。
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公开(公告)号：KR1020100046497A
公开(公告)日：2010-05-07
申请号：KR1020080105356
申请日：2008-10-27
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4007 , H05K1/115 , H05K3/4644
Abstract: PURPOSE: A multilayer printed circuit board and a manufacturing method thereof are provided to improve an interlayer signal connection by alternatively forming a paste bump and a fill-plated bump. CONSTITUTION: A multilayer printed circuit board comprises a first insulation layer(105) and a second insulation layer(117a-117d). First and second insulation layers are alternatively stacked. A paste bump(103) is formed on the first insulation layer. A fill-plated bump(113) is formed on the second insulation layer. A circuit layer is formed on the outermost second insulation layer. The paste bump is an Ag paste bump. The fill-plated bump is made of copper.
Abstract translation: 目的：提供一种多层印刷电路板及其制造方法，以通过交替地形成糊状凸起和填充凸块来改善层间信号连接。 构成：多层印刷电路板包括第一绝缘层（105）和第二绝缘层（117a-117d）。 交替堆叠第一和第二绝缘层。 在第一绝缘层上形成膏状凸起（103）。 在第二绝缘层上形成有填充凸块（113）。 电路层形成在最外层的第二绝缘层上。 糊状凸块是Ag膏凸块。 镀敷凸块由铜制成。
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公开(公告)号：KR1020070113404A
公开(公告)日：2007-11-29
申请号：KR1020060046208
申请日：2006-05-23
Applicant: 삼성전기주식회사
CPC classification number: H05K3/0044 , H05K1/115 , H05K3/108 , H05K3/42
Abstract: A printed circuit board and a manufacturing method thereof are provided to improve the flexural rigidity of the printed circuit board by using a reinforcing material in a core layer of the printed circuit board. A manufacturing method of a printed circuit board includes the steps of: forming a through hole by perforating a reinforcing substrate(S11) with a mechanical method; filling the through hole with an insulating material by laminating the insulating material on both sides of the reinforcing substrate(S12); perforating a via hole which penetrates the insulating material and the through hole in correspondence to the corresponding location to the through hole(S13); and plating the inner peripheral surface of the via hole, and forming a circuit pattern on the surface of the insulating material(S14).
Abstract translation: 提供一种印刷电路板及其制造方法，以通过在印刷电路板的芯层中使用增强材料来提高印刷电路板的抗弯刚度。 印刷电路板的制造方法包括以下机械方法对增强基板（S11）进行穿孔而形成贯通孔的工序; 通过在加强基板的两侧层叠绝缘材料，用绝缘材料填充通孔（S12）; 对应于通孔的对应位置穿透贯穿绝缘材料和通孔的通孔（S13）; 并对通孔的内周面进行电镀，在绝缘材料的表面形成电路图案（S14）。
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