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公开(公告)号：KR100905310B1
公开(公告)日：2009-07-02
申请号：KR1020070124568
申请日：2007-12-03
Applicant: 삼성전기주식회사
IPC: H01L21/288
Abstract: 기판 패널이 개시된다. 전해도금용 지그로부터 전류를 인가 받아 소정의 위치에 도금층이 형성되는 기판 패널로서, 절연체; 절연체에 형성되는 복수의 단위패턴; 절연체의 가장자리에 형성되어 지그로부터 전류를 인가 받는 복수의 외측 접점; 및 절연체의 중앙부에 형성되어 지그로부터 전류를 인가 받는 내측 접점을 포함하는 기판 패널은, 가장자리뿐만 아니라 중앙부에도 전류 인가를 위한 접점을 구비함으로써, 균일한 도금이 이루어질 수 있다.
유닛, 스트립, 패널, 도금-
公开(公告)号：KR101814113B1
公开(公告)日：2018-01-02
申请号：KR1020120123420
申请日：2012-11-02
Applicant: 삼성전기주식회사
CPC classification number: H05K3/007 , H05K3/0032 , H05K3/4007 , H05K3/4652 , H05K3/4697 , H05K2201/09472 , H05K2203/061 , H05K2203/308
Abstract: 본발명은인쇄회로기판의제조방법에관한것으로서, 내층패드에박리용보호필름및 박리용보호필름과밀착된메탈층을형성하여, 캐비티가공과관련된레이저가공및 에칭액적용시 내층패드를보호하여이후제품의신뢰성을향상시키는것을특징으로한다.
Abstract translation: 本发明，因为涉及一种制造印刷电路板，以形成在与剥离保护膜和内衬垫的保护性剥离膜密切接触的金属层，以保护激光加工和内层衬垫蚀刻溶液适用的相关型腔的加工过程中的方法 从而提高产品的可靠性。
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公开(公告)号：KR1020110044529A
公开(公告)日：2011-04-29
申请号：KR1020090101253
申请日：2009-10-23
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A flexible printed circuit board and manufacturing method thereof are provided to efficiently improve radiation property by grounding current of a flexible printed circuit board on a ground line. CONSTITUTION: An inflexible unit(120) has an outer ground line. A flexible unit(110) occurs to bend with the operation of the inflexible unit. The flexible unit includes a non-curved unit in order to prevent the inflexible unit from being bent. The flexible unit includes a first insulation layer, a first metal layer, and a conductive layer. The first metal layer covers the front side of the first insulation layer. The first metal layer has an inner ground line. A cover lay covers the first metal layer. The conductive layer has the junction electrically connected to the inner ground line.
Abstract translation: 目的：提供一种柔性印刷电路板及其制造方法，以通过接地线上的柔性印刷电路板的接地电流有效地提高辐射性能。 构成：不灵活的单元（120）具有外部接地线。 发生柔性单元（110）以随着不灵活单元的操作而弯曲。 柔性单元包括非弯曲单元，以防止刚性单元弯曲。 柔性单元包括第一绝缘层，第一金属层和导电层。 第一金属层覆盖第一绝缘层的前侧。 第一金属层具有内部接地线。 盖子覆盖第一金属层。 导电层具有电连接到内部接地线的结。
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公开(公告)号：KR1020140017328A
公开(公告)日：2014-02-11
申请号：KR1020120084156
申请日：2012-07-31
Applicant: 삼성전기주식회사
Abstract: A long hole machining method for a printed circuit board according to the present invention comprises: a step of forming a primary first hole and a primary second hole, in which a first and a second automatic insertion pin for fixing the location of a printed circuit board are respectively inserted, in a printed circuit board; and a step of forming a secondary first hole and a secondary second hole which are respectively connected to the primary first hole and the primary second hole.
Abstract translation: 根据本发明的用于印刷电路板的长孔加工方法包括：形成初级第一孔和初级第二孔的步骤，其中用于固定印刷电路板的位置的第一和第二自动插入销 分别插入印刷电路板中; 以及形成分别连接到主要第一孔和主要第二孔的次级第一孔和次级第二孔的步骤。
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公开(公告)号：KR1020120075852A
公开(公告)日：2012-07-09
申请号：KR1020100137733
申请日：2010-12-29
CPC classification number: H05K3/244 , C23C18/1605 , C23C18/1651 , C23C18/44 , C23C18/54 , H05K3/243 , H05K2203/073 , Y10T428/12493 , Y10T428/12514 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/24802
Abstract: PURPOSE: A substrate structure and a manufacturing method thereof are provided to improve soldering and wire bonding properties for a conductive pattern by forming a thick silver-plating film of a conductive pattern used as a circuit pattern on a printed circuit board. CONSTITUTION: A conductive pattern(116) is formed on a base substrate(112). A first plating layer(122) covers the conductive pattern. A second plating layer(124) covers the first plating layer. The first plating layer includes an electroless reduction plating layer. A first pattern(116a) performs a soldering process for mounting components. A second pattern(116b) performs a wire bonding process for electrical contact with electronic components.
Abstract translation: 目的：提供一种基板结构及其制造方法，通过在印刷电路板上形成用作电路图案的导电图案的厚镀银膜来提高导电图案的焊接和引线接合性能。 构成：在基底基板（112）上形成导电图案（116）。 第一镀层（122）覆盖导电图案。 第二镀层（124）覆盖第一镀层。 第一镀层包括无电解还原镀层。 第一图案（116a）执行用于安装部件的焊接工艺。 第二图案（116b）执行与电子部件的电接触的引线接合处理。
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Patent Agency Ranking
公开(公告)号：KR1020090057821A
公开(公告)日：2009-06-08
申请号：KR1020070124568
申请日：2007-12-03
Applicant: 삼성전기주식회사
IPC: H01L21/288
CPC classification number: H01L21/2885 , C25D17/06
Abstract: A substrate panel is provided to perform uniform plating by including contact points for applying a current not only in an edge but also in a central part. A plurality of unit patterns(16) is formed in an insulator(10). A plurality of external contact points(11,12,13,14) is formed in an edge of the insulator. A plurality of external contact points receives a current from a jig. An internal contact point(15) is formed in a central part of the insulator. The internal contact point receives a current from the jig. A plurality of internal contact points is positioned in the same distance from a right center of the insulator.
Abstract translation: 提供基板面板，通过包括不仅在边缘上而且在中心部分施加电流的接触点来执行均匀的电镀。 在绝缘体（10）中形成多个单元图案（16）。 多个外部接触点（11,12,13,14）形成在绝缘体的边缘中。 多个外部接触点从夹具接收电流。 在绝缘体的中心部分形成内部接触点（15）。 内部接触点从夹具接收电流。 多个内部接触点位于与绝缘体的右中心相同的距离处。
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公开(公告)号：KR1020160080844A
公开(公告)日：2016-07-08
申请号：KR1020140192507
申请日：2014-12-29
Applicant: 삼성전기주식회사
Abstract: 접합기판시트및 기판시트의결합방법이개시된다. 본발명의일 측면에따른접합기판시트는제1 단위기판, 제1 단위기판을둘러싸는제1 더미부, 및제1 단위기판을제1 더미부에연결하는제1 연결부를포함하는제1 기판시트절편; 제2 단위기판, 제2 단위기판을둘러싸는제2 더미부, 및제2 단위기판을제2 더미부에연결하는제2 연결부를포함하는제2 기판시트절편; 및제1 기판시트절편에제2 기판시트절편이결합되도록제1 및제2 기판시트절편의일단에각각형성되는결합부;를포함한다.
Abstract translation: 公开了接合基板和基板的接合方法。 根据本发明的一个方面，所述接合基板包括：第一基板片段，包括第一单元基板，覆盖所述第一单元基板的第一虚设单元和将所述第一单元基板连接到所述第一虚拟元件的第一连接单元 单元; 包括第二单元基板的第二基板片段，覆盖第二单元基板的第二虚设单元和将第二单元基板连接到第二虚设单元的第二连接单元; 以及分别形成在第一和第二基片片段的每一端上的耦合单元，以便将第一基片片段与第二基片片段连接。 根据本发明的一个方面，当将部件安装在接合基板上时，可以提高精度。
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公开(公告)号：KR1020130073463A
公开(公告)日：2013-07-03
申请号：KR1020110141313
申请日：2011-12-23
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A drill bit and a method for processing the panel using the same are provided to simultaneously process for obtaining a slope on the upper and lower surfaces of a terminal in a product by a horizontal processing unit formed in an identical shape such as a sandglass of the drill bit. CONSTITUTION: A drill bit (100) comprises a body unit (110), a horizontal processing unit (120), and a vertical processing unit (130). The body unit moves in the vertical and horizontal direction, and rotates. The horizontal processing unit is formed in a lower part of the body unit and processes to obtain a slope in an edge of a panel. The vertical processing unit is formed in a lower part of the horizontal processing unit and vertically processes the panel.
Abstract translation: 目的：提供钻头和使用其的面板加工方法，以通过形成为相同形状的水平处理单元（例如沙漏）同时处理以获得产品中的端子的上表面和下表面上的斜面 的钻头。 构成：钻头（100）包括主体单元（110），水平处理单元（120）和垂直处理单元（130）。 身体单元在垂直和水平方向上移动，并旋转。 水平处理单元形成在主体单元的下部，并处理以获得面板边缘的斜率。 垂直处理单元形成在水平处理单元的下部并垂直地处理面板。
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公开(公告)号：KR101085726B1
公开(公告)日：2011-11-21
申请号：KR1020090101253
申请日：2009-10-23
Applicant: 삼성전기주식회사
Abstract: 본 발명은 경연성 인쇄회로기판을 제공한다. 본 발명의 실시예에 따른 경연성 인쇄회로기판은 외부 그라운드 배선(outer ground line)을 갖는 경성부, 그리고 경성부의 동작에 의해 휘어짐이 발생되는 굴곡부 및 경성부가 동작하여도 휘어짐이 발생되지 않는 비굴곡부를 갖는 연성부를 포함하되, 연성부는 제1 절연층, 상기 제1 절연층의 전면을 덮으며 내부 그라운드 배선(inner ground line)을 갖는 제1 금속층, 제1 금속층을 덮는 커버레이, 그리고 커버레이 및 제1 절연층의 배면 중 적어도 어느 하나를 덮으며 내부 그라운드 배선에 전기적으로 연결되는 접합부분을 갖는 도전층을 포함한다.
경연성 인쇄회로기판, RF PCB, 접지, 그라운드, ground-
公开(公告)号：KR1020110094673A
公开(公告)日：2011-08-24
申请号：KR1020100014226
申请日：2010-02-17
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A method for manufacturing a flexible printed circuit board is provided to selectively plate gold on only a connect part of a flexible printed circuit board, thereby reducing the entire manufacturing costs of the flexible printed circuit board. CONSTITUTION: A ZIF(Zero Insertion Force) connector includes a connector unit(10), a connection line(20), and a ground unit(30). A first gold plating layer(40) is formed on the connector unit and the ground unit. Plating resist is coated on the ground unit. A second gold plating layer(60) is formed in the connector unit. The plating resist is eliminated.
Abstract translation: 目的：提供一种用于制造柔性印刷电路板的方法，以仅在柔性印刷电路板的连接部分上选择性地镀金，从而降低柔性印刷电路板的整体制造成本。 构成：ZIF（零插入力）连接器包括连接器单元（10），连接线（20）和接地单元（30）。 在连接器单元和接地单元上形成第一镀金层（40）。 电镀抗蚀剂涂在地面单元上。 在连接器单元中形成第二镀金层（60）。 消除电镀抗蚀剂。
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