Abstract:
본 발명은 하나의 고전압 레벨 쉬프터를 공유하는 로우 디코더를 갖는 플래쉬 메모리 장치에 대하여 개시된다. 플래쉬 메모리 장치는 적어도 2개 이상의 메모리 셀 어레이 블락들을 포함한다. 메모리 셀 어레이 블락들은, 복수개의 워드라인들과 복수개의 비트라인들을 포함하고, 하나의 비트라인에 직렬 연결된 복수개의 메모리 셀들이 하나의 스트링을 구성하고, 하나의 워드라인에 연결되는 메모리 셀들을 기준으로 페이지로 구분되고, 복수개의 페이지들로 구성된 블락으로 구분된다. 적어도 2개의 메모리 셀 어레이 블락들이 하나의 로우 디코더를 공유한다. 로우 디코더는, 제1 메모리 셀 어레이 블락을 선택하는 제1 블락 신호와 제2 메모리 셀 어레이 블락을 선택하는 제2 블락 신호에 응답하여 블락 선택 신호를 발생하는 블락 디코더, 블락 선택 신호에 응답하여 고전압의 블락 워드라인 신호를 발생하는 고전압 레벨 쉬프터, 그리고 블락 워드라인 신호에 응답하여 제1 메모리 셀 어레이 블락의 워드라인들로 제1 구동 전압들을 전달하는 제1 패스 트랜지스터부와 제2 메모리 셀 어레이 블락의 워드라인들로 제2 구동 전압들을 전달하는 제2 패스 트랜지스터부를 포함한다. 플래쉬 메모리 장치, 메모리 셀 어레이 블락, 메모리 셀 어레이 레이어, 로 우 디코더, 칩 레이아웃 면적, 프로그램 디스터브 현상
Abstract:
PURPOSE: A flash memory device and a memory system including the same are provided to improve the operation speed of the flash memory device by programming all cell strings at the same time with the application of a bias voltage. CONSTITUTION: A first switch(111_1) connects electrically one of a first and a second cell strings to a first bit-line. A second switch(113_1) connects electrically to the second cell string to a second bit-line. A control logic(150) applies a bias voltage to the first cell string through the first bit-line. The control logic applies the bias voltage to the second cell string through the second bit-line. The control logic controls the first and the second cell strings to be programmed simultaneously.
Abstract:
A flash memory device is provided to reduce a chip layout area by sharing one row decoder between two memory cell array blocks. Each of first and second memory cell array blocks includes a plurality of word lines, a plurality of bit lines, and a plurality of memory cells. A row decoder(311) includes a block decoder(410), a high voltage level shifter(420), a first pass transistor(441) and a second pass transistor(442). The block decoder generates the block selection signal in response to a first block signal and a second block signal. The high voltage level shifter generates the block word line signal of the high voltage in response to the block selection signal. The first pass transistor transmits the first driving voltage to the word line of the first memory cell array block in response to the block word line signal. The second pass transistor transmits the second driving voltage to the word line of the second memory cell array block in response to the block word line signal.
Abstract:
A non volatile memory device is provided to reduce layout area by reducing an unnecessary switching transistor. A non volatile memory device comprises a memory cell array, a first type global word line decoder, and a second type global word line decoder. The memory cell array includes a plurality of word lines, a plurality of bit lines, and a plurality of memory cells comprising in order to read out data through a plurality of bit lines. The first and second type global word lines selectively provides a voltage of a different level of 3 kinds with a word line corresponding among a plurality of word lines.
Abstract:
A semiconductor memory device and an operation method of the same are provided to read data without a reference memory cell, as simplifying configuration of a sensing block used for reading data. A memory cell array(100) comprises a first block comprising a first memory cell and a second block comprising a second memory cell. The first memory cell is connected between a first bit line and a source line receiving a source voltage, and has a floating body having a gate connected to a first word line. The second memory cell is connected between a second bit line and the source line, and has a floating body having a gate connected to a second word line. A bit line isolation part transmits data between the first bit line and a sense bit line, and transmits data between the second bit line and an inverted sense bit line. A sense amplifier part equalizes the sense bit line and the inverted sense bit line with an equalization voltage level during equalization operation, and precharges one of the sense bit line and the inverted sense bit line with a first precharge voltage line higher than the equalization voltage and the other one of the sense bit line and the inverted sense bit line with a second precharge voltage level lower than the first precharge voltage during precharge operation, and senses and amplifies voltage difference between the sense bit line and the inverted sense bit line during read and write operation.
Abstract:
PURPOSE: A stacked flash memory device using TSV is provided to prevent the change of device characteristics while reducing current consumption. CONSTITUTION: A flash memory device(100) comprises a plurality of the chips(CHP1,CHP2,CHP3) and TSV(Through Silicon Via). A plurality of chips are stacked. TSV transmit an address or data to chips and receives them from the chips. Each chip has an input/output pad, a TSV pad, and a controller. The input/output pad receives the address or data from the outside and transmits them to the outside. The TSV pad receives the address or data from the TSV and transmits them to the TSV. The controller control the activation of the input/output pad and the TSV pad.
Abstract:
PURPOSE: A memory device which reduces a coupling phenomenon between memory cells and a semiconductor system including the same are provided to constantly maintain the channel voltage of a cell which is prohibited to be programmed. CONSTITUTION: A first bit line(BL1) is connected to a cell which is prohibited to be programmed. A second bit line is connected to a cell to be programmed. A power supply control circuit(180) supplies a first voltage to the first bit line in response with first control signal. The power supply control circuit is supplies a ground voltage to the second bit line. The power supply control circuit supplies a second voltage to the second bit line in response with second control signal.
Abstract:
An electrostatic discharge protection device is provided to reducing a trigger voltage by increasing a current gain of a junction transistor and increasing resistance between the junction transistor and a first power supply and increasing a holding voltage through a diode. An electrostatic discharge protection apparatus includes a first n well(21), a first n+ region(31), a first p+ region(32), a second n+ region(33), a third n+ region(34), and a gate electrode(40). The first n well is formed in a p-type substrate(20). The first n+ region and the first p+ region are formed in the first n well. The second n+ region is spaced apart from the p+ region. Insulation layers(30) are inserted between the first n+ region and the p+ region, and between the p+ region and the second n+ region, respectively. The third n+ region is spaced apart from the second n+ region. The gate electrode is formed on the p-type substrate between the second n+ region and the third n+ region. A second n well is formed under the third n+ region. A third n well is spaced apart from a second p+ region. An input/output terminal is connected to the first n+ region and the first p+ region.