Abstract:
본 발명은 계층적 비트 라인 구조를 가지는 반도체 메모리 장치를 공개한다. 이 장치는 워드 라인들과 제1 로컬 비트 라인들 각각의 사이에 연결된 복수개의 제1 메모리 셀들 및 상기 워드 라인들과 제2 로컬 비트 라인들 각각의 사이에 연결된 복수개의 제2 메모리 셀들을 구비하는 메모리 셀 어레이, 리드 동작시 제1 센싱 기간에 상기 제1 로컬 비트 라인들 각각을 제1 글로벌 비트 라인들 각각과 연결하고, 제2 센싱 기간에 상기 제2 로컬 비트 라인들 각각을 제2 글로벌 비트 라인들 각각과 연결하는 스위칭 블록, 및 상기 리드 동작시 상기 제1 센싱 기간에 상기 제1 글로벌 비트 라인들 각각의 데이터를 감지하여 증폭하고, 상기 제2 센싱 기간에 상기 제2 글로벌 비트 라인들 각각의 데이터를 감지하여 증폭하는 센싱 블록을 구비하는 것을 특징으로 한다.
Abstract:
PURPOSE: A nonvolatile memory device using a resistive element and a memory system including the same are provided to perform an RWW(Read While Write) operation without an error by reducing a power noise. CONSTITUTION: A memory array(110) includes a plurality of memory banks(BANK0-BANK7) arranged in a first direction. Each memory bank is extended in a second direction. Each memory bank includes a nonvolatile memory cell with a variable resistive element whose resistance is varied according to stored data. A write global bit line and a read global bit line are extended in the first direction and are shared by a plurality of memory banks. A write circuit(132,142,152) is connected to the write global bit line and is arranged on the first side of the memory array. A read circuit is connected to the read global bit line and is arranged on the second side of the memory array.
Abstract translation:目的:提供使用电阻元件的非易失性存储器件和包括该电阻元件的存储器系统,通过降低功率噪声来执行RWW(Read While Write)操作而没有错误。 构成:存储器阵列(110)包括沿第一方向布置的多个存储体(BANK0-BANK7)。 每个存储体在第二方向上延伸。 每个存储体包括具有可变电阻元件的非易失性存储单元,其电阻根据存储的数据而变化。 写全局位线和读全局位线在第一方向上被扩展并由多个存储体共享。 写入电路(132,142,152)连接到写入全局位线并且布置在存储器阵列的第一侧上。 读取电路连接到读取的全局位线并且被布置在存储器阵列的第二侧上。
Abstract:
PURPOSE: A sense amplifier using a bit line boosting and a semiconductor memory device having the same are provided to maximize the sensing efficiency by pre-amplifying the voltage of the bit line and a complementary bit line. CONSTITUTION: A memory cell array includes a bit line(11), a complementary bit line(12), a memory cell array connected to the bit line and the complementary bit line. A sense amplifier circuit(13) is connected between the bit line and the complementary bit line. A sense amplifier circuit senses the voltage difference between the bit line and the complementary bit line. A plurality of MOS transistors(15,16) comprises the bit line or a gate connected to one of complementary bit lines. MOS transistors boost at least one from the bit line or the complementary bit lines before the sensing operation of the sense amplifier circuit.
Abstract:
PURPOSE: A semiconductor memory device including a dynamic memory cell without a capacitor is provided to simplify the structure of a controller for read and/or write operations by applying one fixed level of voltage to a source line. CONSTITUTION: A memory cell array includes a plurality of memory cells with transistors. A transistor includes a floating body which is connected through a plurality of word-lines, a plurality of source-lines, and a plurality of bit-lines. A controller applies a bit-line writing voltage to a selected bit-line from the bit-lines in a write-operating state. The controller applies a second word-line controlling voltage, which is higher than a first word-line controlling voltage, to a selected word-line from the word-lines. The controller stores data in the memory cells by inducing the bipolar junction transistor operation of the memory cells.
Abstract:
PURPOSE: A transistor, a method for forming the same and a semiconductor memory cell including the same are provided to reduce a gate induced drain leakage current by forming information storage element under space patterns which are located on a gate pattern and on the sidewall of the pattern. CONSTITUTION: A first semiconductor region(80) is formed on a semiconductor substrate(10). Gate patterns(90) are arranged on the first semiconductor region. Spacer patterns(78, 105) are arranged on the sidewall of the gate patterns. The first semiconductor region, a second semiconductor region and a third semiconductor region are successively arranged under the gate pattern and the spacer patterns and around the spacer patterns.
Abstract:
A semiconductor memory device and an operation method thereof are provided to reduce the refresh time by refreshing memory cells connected to all word lines at the same time. A semiconductor memory device comprises a memory cell array(50) and a controller. The memory cell array comprises a plurality of memory cells(MC1~MCi). A plurality of memory cells are connected to a plurality of word lines(WL1~WLi), a plurality of bit lines(BL1~BLj) and a plurality of source lines(SL1~SLi). Each memory cell has a floating body transistor. The controller supplies the read control signal to at least one word line and at least one source line in reading. The controller applies the refresh control signal to at least one word line in the refresh operation.
Abstract:
A semiconductor memory device is provided to accurately perform the data read action by adaptively diversifying the source line voltage or the bit line voltage. A source line goal voltage generation unit(510) produces the source line target voltage according to the source line reference voltage and the gate voltage. A comparison unit(520) outputs the voltage signal which is variable by comparing the size of the source line voltage and the source line target voltage. A power source current supply unit(530) controls the power source current supply capacity in response to the output-voltage signal of the comparison unit applied to the gate terminal. A charge pumping part(540) receives many amount of current from the power source current supply unit. The charge pumping part boosts the source line voltage up to the source line target voltage level by charging the capacitor(C1) with current.
Abstract:
A method of fabricating one-transistor floating body dram is provided to improve electrical property by minimizing electrical interaction between the increased source area the drain region. A method of fabricating one-transistor floating body dram is comprised of the step: forming a semiconductor film, forming an isolation film, and forming a buried gap. A semiconductor substrate has a cell region and a peripheral area. A sacrificing layer is formed on the cell region and is not formed on the peripheral area of the substrate. A semiconductor film is formed on the sacrificing layer of the cell region and semiconductor substrate of the peripheral area. The isolation film is formed on the semiconductor film and sacrificing layer and restricts a floating body.
Abstract:
A capacitor-less dynamic semiconductor memory device and a method of operating the same are provided to suppress memory size increase by using a shared bit line voltage sense amplifier directly sensing and amplifying voltage difference generated in bit lines by controlling a source voltage of floating body transistors of an open bit line structure. A first memory block(311) includes memory cells comprising a floating body transistor having a gate connected to a word line, a drain connected to each of bit lines and a source connected to each of source lines. A second memory block(312) comprises dummy memory cells comprising a floating body transistor having a gate connected to a dummy word line, a drain connected to each of bit lines and a source connected to each of source lines, and an equalizing transistor connected between a gate receiving an equalizing signal and an odd-numbered bit line and an even-numbered bit line adjacent to the odd-numbered bit line. A voltage sense amplification part receives one of bit lines of the first memory block as a first input, and one of the odd-numbered bit line or the adjacent even-numbered bit line of the second memory block as a second input, in response to a bit line selection signal.