公开(公告)号：KR101811689B1

公开(公告)日：2017-12-22

申请号：KR1020110066640

申请日：2011-07-06

Applicant: 삼성전자주식회사

Inventor： 쯔쯔이,쯔요시 ,  김신군 ,  홍성재 ,  박일우

IPC: H01L33/50

CPC classification number: H01L33/005 ,  H01L33/0095 ,  H01L2933/0041

Abstract: 본발명은반도체발광소자제조방법및 이에이용되는페이스트도포장치에관한것으로, 본발명의일 실시형태에따른반도체발광소자제조방법은, 제1 도전형반도체층, 활성층및 제2 도전형반도체층을포함하는발광구조물을마련하는단계와, 상기발광구조물상에상기발광구조물의일부를노출시키는개구부를갖는마스크를배치하는단계와, 가압수단을이용하여상기마스크의상기개구부를통해상기발광구조물상에파장변환물질을포함하는페이스트를도포하는단계와, 롤러를이용하여상기도포된페이스트를평탄화하는단계를포함한다.

Abstract translation: 本发明涉及制造半导体发光器件的方法和用于此的半导体发光器件以及制造半导体发光器件的方法，其中制造半导体发光器件的方法是制造半导体发光器件的方法， 该方法包括以下步骤：在衬底上提供包括发光结构的发光结构;布置具有用于暴露发光结构的一部分的开口的掩模; 应用含有波长转换材料的糊剂，并使用辊将所施加的糊剂平面化。

公开(公告)号：KR101748334B1

公开(公告)日：2017-06-16

申请号：KR1020110004530

申请日：2011-01-17

Applicant: 삼성전자주식회사

Inventor： 유철준 ,  홍성재 ,  쯔쯔이쯔요시 ,  김신군

IPC: H01L21/67 ,  H01L21/683 ,  H01L33/00 ,  H01L33/50 ,  B05C1/02

CPC classification number: B05C1/027 ,  H01L21/6715 ,  H01L21/6838 ,  H01L33/0079 ,  H01L33/50 ,  H01L2933/0041

Abstract: 웨이퍼레벨에서반도체발광소자의발광면의상부에형광층을형성함으로써백색발광을하는반도체발광소자를제조하는방법및 장치를제공를개시한다. 개시도니반도체발광소자의제조방법은, 웨이퍼상에다수의발광소자를형성하는단계; 발광소자들이완성된웨이퍼를박막화하는단계; 박막화된웨이퍼를캐리어테이프위에배치하는단계; 및웨이퍼위의다수의발광소자들을덮도록형광층을형성하는단계;를포함할수 있다.

公开(公告)号：KR1020130005323A

公开(公告)日：2013-01-16

申请号：KR1020110066640

申请日：2011-07-06

Applicant: 삼성전자주식회사

Inventor： 쯔쯔이,쯔요시 ,  김신군 ,  홍성재 ,  박일우

IPC: H01L33/50

CPC classification number: H01L33/005 ,  H01L33/0095 ,  H01L2933/0041

Abstract: PURPOSE: A method for manufacturing a semiconductor light emitting device and a paste coating device used fro the same are provided to improve light uniformity by omitting an alignment process in a light emitting device. CONSTITUTION: An active layer is formed in a light emitting structure(20). A first conductive semiconductor layer and a second conductive semiconductor layer are formed in the light emitting structure. A mask is arranged in the light emitting structure. Paste(30) is coated through an opening part of the mask. The coated paste is planarized using a roller.

Abstract translation: 目的：提供一种用于制造半导体发光器件的方法和使用其的糊状涂覆器件，以通过省略发光器件中的取向处理来提高光均匀性。 构成：在发光结构（20）中形成有源层。 在发光结构中形成第一导电半导体层和第二导电半导体层。 在发光结构中设置掩模。 糊剂（30）通过掩模的开口部分涂覆。 使用辊将涂覆的糊状物平坦化。

公开(公告)号：KR1020120104705A

公开(公告)日：2012-09-24

申请号：KR1020110022268

申请日：2011-03-14

Applicant: 삼성전자주식회사

Inventor： 쯔쯔이,쯔요시 ,  송영희 ,  황성덕 ,  홍성재 ,  김신군

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L2933/0041

Abstract: PURPOSE: A method for manufacturing a semiconductor light emitting element is provided to easily manufacture the semiconductor light emitting element which reliability is increased by removing a wavelength conversion layer, thereby increasing process efficiency. CONSTITUTION: A conductive substrate is formed on a second conduction type semiconductor layer(23) of a light emitting structure. A part of a first conduction type semiconductor layer(21), an active layer(22), and the second conduction type semiconductor layer of the light emitting structure are removed. A wavelength conversion layer is formed on an upper side of the light emitting structure and an area which the light emitting structure is removed by using a screen printing method. A mask is removed to expose a surface of an electrode, after the wavelength conversion layer is formed. An outcome is divided into an element unit. The wavelength conversion layer is exposed in each side of the divided elements.

Abstract translation: 目的：提供一种制造半导体发光元件的方法，以容易地制造通过去除波长转换层而提高可靠性的半导体发光元件，从而提高工艺效率。 构成：在发光结构的第二导电型半导体层（23）上形成导电性基板。 除去发光结构的第一导电型半导体层（21），有源层（22）和第二导电型半导体层的一部分。 在发光结构的上侧形成波长转换层，通过丝网印刷法形成发光结构的去除区域。 在形成波长转换层之后，去除掩模以暴露电极的表面。 结果分为元素单元。 波长转换层在分割元件的每一侧曝光。

公开(公告)号：KR1020120083082A

公开(公告)日：2012-07-25

申请号：KR1020110004530

申请日：2011-01-17

Applicant: 삼성전자주식회사

Inventor： 유철준 ,  홍성재 ,  쯔쯔이쯔요시 ,  김신군

IPC: H01L21/67 ,  H01L21/683 ,  H01L33/00 ,  H01L33/50 ,  B05C1/02

CPC classification number: B05C1/027 ,  H01L21/6715 ,  H01L21/6838 ,  H01L33/0079 ,  H01L33/50 ,  H01L2933/0041

Abstract: PURPOSE: Apparatus and method of manufacturing white light emitting device are provided to minimize a process error and wafer damages by having a thin wafer form a fluorescent layer on a carrier. CONSTITUTION: A plurality of light emitting devices are formed on a wafer(101). The wafer becomes thinner and is arranged on a carrier film(120) located on a vacuum table(130). A printing mask(140) is located above the wafer. A fluorescent layer(150) is formed on the emission surface of the plurality of the emitting devices.

Abstract translation: 目的：提供制造白色发光器件的装置和方法，以通过使薄晶片在载体上形成荧光层来最小化工艺误差和晶片损坏。 构成：在晶片（101）上形成多个发光器件。 晶片变薄并且布置在位于真空台（130）上的载体膜（120）上。 印刷掩模（140）位于晶片上方。 荧光层（150）形成在多个发光器件的发射表面上。