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公开(公告)号：KR101811689B1
公开(公告)日：2017-12-22
申请号：KR1020110066640
申请日：2011-07-06
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/005 , H01L33/0095 , H01L2933/0041
Abstract: 본발명은반도체발광소자제조방법및 이에이용되는페이스트도포장치에관한것으로, 본발명의일 실시형태에따른반도체발광소자제조방법은, 제1 도전형반도체층, 활성층및 제2 도전형반도체층을포함하는발광구조물을마련하는단계와, 상기발광구조물상에상기발광구조물의일부를노출시키는개구부를갖는마스크를배치하는단계와, 가압수단을이용하여상기마스크의상기개구부를통해상기발광구조물상에파장변환물질을포함하는페이스트를도포하는단계와, 롤러를이용하여상기도포된페이스트를평탄화하는단계를포함한다.
Abstract translation: 本发明涉及制造半导体发光器件的方法和用于此的半导体发光器件以及制造半导体发光器件的方法，其中制造半导体发光器件的方法是制造半导体发光器件的方法， 该方法包括以下步骤：在衬底上提供包括发光结构的发光结构;布置具有用于暴露发光结构的一部分的开口的掩模; 应用含有波长转换材料的糊剂，并使用辊将所施加的糊剂平面化。
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公开(公告)号：KR1020120105828A
公开(公告)日：2012-09-26
申请号：KR1020110023499
申请日：2011-03-16
Applicant: 삼성전자주식회사
CPC classification number: H01L27/15 , F21K9/23 , F21Y2115/10 , H01L25/167 , H01L27/153 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: A semiconductor light emitting diode chip, a manufacturing method thereof and a quality management method are provided to determine the cause of problems of a product in an expanded wafer base process area by checking the history of the chip using the measurement of an electrical characteristic value. CONSTITUTION: A light emitting laminate is formed between first and second compound semiconductor layers(12a,12b). A light emitting diode(LD) includes first and second electrodes. A circuit unit has an electrical characteristic value corresponded to the related information. A fuse signature circuit(S4,S5) includes a plurality of electrode pads(17) connected to the circuit unit. The circuit unit includes a plurality of fuses connected to a plurality of semiconductor devices.
Abstract translation: 目的：提供一种半导体发光二极管芯片及其制造方法和质量管理方法，以通过使用电特性的测量来检查芯片的历史来确定扩大的晶片基底工艺区域中的产品的问题的原因 值。 构成：在第一和第二化合物半导体层（12a，12b）之间形成发光层压体。 发光二极管（LD）包括第一和第二电极。 电路单元具有对应于相关信息的电特性值。 熔丝签名电路（S4，S5）包括连接到电路单元的多个电极焊盘（17）。 电路单元包括连接到多个半导体器件的多个熔丝。
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公开(公告)号：KR1020120032305A
公开(公告)日：2012-04-05
申请号：KR1020100093892
申请日：2010-09-28
Applicant: 삼성전자주식회사
IPC: H01L33/48
CPC classification number: H01L33/38 , H01L23/544 , H01L33/0095 , H01L33/20 , H01L2223/54406 , H01L2223/5442 , H01L2223/54433 , H01L2223/5448 , H01L2223/54486 , H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A semiconductor light emitting diode chip, a manufacturing method, and a quality management method thereof are provided to diagnose a cause of a problem according to characteristics of a package product within a wafer base process region by recognizing a chip information mark through a vision system or with naked eye after completing a package. CONSTITUTION: A semiconductor laminated body(12) is arranged on a substrate(11). The semiconductor laminated body comprises a first compound semiconductor layer(12a), a second compound semiconductor layer(12b), and an active layer(12c). A transparent electrode layer(14) is arranged on the upper surface of the second compound semiconductor layer. A first electrode(15) and a second electrode are respectively and electrically connected to the first and second compound semiconductor layers. A chip information mark is formed on the upper surface of the second compound semiconductor layer. The chip information mark displays information related to a wafer base process.
Abstract translation: 目的：提供一种半导体发光二极管芯片，其制造方法和质量管理方法，通过通过视觉识别芯片信息标记来根据晶片基底工艺区域内的封装产品的特性来诊断问题的原因 系统或肉眼完成包装后。 构成：在基板（11）上配置半导体层叠体（12）。 半导体层叠体包括第一化合物半导体层（12a），第二化合物半导体层（12b）和有源层（12c）。 在第二化合物半导体层的上表面上配置有透明电极层（14）。 第一电极（15）和第二电极分别电连接到第一和第二化合物半导体层。 在第二化合物半导体层的上表面上形成芯片信息标记。 芯片信息标记显示与晶片基底工艺有关的信息。
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公开(公告)号：KR1020110070518A
公开(公告)日：2011-06-24
申请号：KR1020090127375
申请日：2009-12-18
Applicant: 삼성전자주식회사
Inventor： 홍성재
CPC classification number: F21K9/60 , F21K9/66 , F21K9/68 , F21V5/048 , F21Y2101/00
Abstract: PURPOSE: A light illuminating apparatus is provided to obtain uniform white light and overcome a color splitting phenomenon by changing the thickness of a layer containing fluorescent materials. CONSTITUTION: A light illuminating module(10) includes a light emitting element package and a substrate. A plurality of light emitting element packages is mounted in the substrate. A housing(20) includes an opening part at the front side and contains the light illuminating module. The light emitting element packages are toward the opening part. A cover unit(30) contains fluorescent materials and is installed in the opening part of the housing to protect the light illuminating module. The cover unit includes protrusions.
Abstract translation: 目的：提供一种照明装置以获得均匀的白光，并通过改变含有荧光材料的层的厚度来克服分色现象。 构成：光照射模块（10）包括发光元件封装和基板。 多个发光元件封装安装在基板中。 壳体（20）包括在前侧的开口部分并且包含光照射模块。 发光元件封装朝向开口部。 盖单元（30）包含荧光材料并且安装在壳体的开口部分中以保护光照射模块。 盖单元包括突起。
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公开(公告)号：KR1020170104031A
公开(公告)日：2017-09-14
申请号：KR1020160025680
申请日：2016-03-03
Applicant: 삼성전자주식회사
CPC classification number: H01L25/0753 , H01L33/62
Abstract: 본발명의실시형태에따른패키지기판은, 복수의실장영역, 및상기복수의실장영역중 적어도하나를포함하는복수의단위발광영역을갖는베이스기판, 상기베이스기판의일면에마련되며, 상기복수의실장영역에서복수의발광소자와연결되는복수의제1 회로패턴, 상기복수의단위발광영역에연결되는복수의제2 회로패턴, 및서로다른상기단위발광영역에각각연결되는상기제2 회로패턴들을서로전기적으로연결하거나, 상기제1 회로패턴과상기제2 회로패턴을서로전기적으로연결하는와이어를포함한다.
Abstract translation: 被设置在所述基底基板的一个表面上，根据本发明，多个安装区域的实施例封装衬底，并且，所述具有多个单元的光的基体基板的发光区域包括所述多个安装区域的中的至少一个，所述多个 多个所述第二连接到第一多个电路图案的，发射连接到所述多个发光器件中的安装区域中的电路图案区域中的多个单元的光，并且所述第二电路图案彼此分别连接到另一所述单元的光发射区 彼此或电连接，包括：第一电路图案和第二电路图案彼此连接电导线。
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Patent Agency Ranking
公开(公告)号：KR1020120071189A
公开(公告)日：2012-07-02
申请号：KR1020100132819
申请日：2010-12-22
Applicant: 삼성전자주식회사
CPC classification number: H01L22/20 , H01L33/005 , H01L33/0095 , H01L33/50 , H01L33/52 , H01L2924/0002 , H01L2933/0041 , H01L2924/00 , H01L21/78
Abstract: PURPOSE: A method of applying a phosphor by using a transfer molding method and an apparatus thereof are provided to uniformly apply the phosphor on side and upper portions of a light emitting device by applying the phosphor using a transfer molding method after the light emitting devices having similar light emitting properties are rearranged. CONSTITUTION: A plurality of LED chips is formed on a wafer. The plurality of LED chips is rearranged while being arrayed on a carrier substrate according to light emitting properties. A phosphor is applied on a plurality of rearranged light emitting devices with a transfer molding method. The light emitting devices on the carrier substrate are separated from each other.
Abstract translation: 目的：提供一种通过使用传递模塑方法施加荧光体的方法及其装置，以在发光装置具有发光装置之后通过使用传递模制方法施加荧光体来均匀地施加荧光体的发光装置的侧部和上部 类似的发光特性被重新排列。 构成：在晶片上形成多个LED芯片。 根据发光特性，将多个LED芯片重新布置在载体基板上。 用传递模塑法将荧光体施加到多个重排的发光器件上。 载体基板上的发光器件彼此分离。
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公开(公告)号：KR1020120040444A
公开(公告)日：2012-04-27
申请号：KR1020100101873
申请日：2010-10-19
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/14 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A light emitting device package and a manufacturing method thereof are provided to reduce manufacturing processes by shaping a lens and a chip encap on a lower part of a fluorescent substance sheet and underfilling a lower part of a chip by batch processing. CONSTITUTION: A body has a concave part. A flow path(15) is formed to be connected to the concave part from one side of the body. A chip bonding pad is fixed with the body. A light emitting diode is loaded on the chip bonding pad. A lead(40) is fixed with the body and electrically combined with the light emitting diode. A fluorescent substance sheet(20) is loaded on an upper part of the body to be separated from the light emitting diode. A molding resin fills the concave part on a lower part of the fluorescent substance sheet. A lens is included on an upper part of the fluorescent substance sheet.
Abstract translation: 目的：提供一种发光器件封装及其制造方法，以通过将透镜和芯片封装成形在荧光物质片的下部并通过批量处理对芯片的下部填充来减少制造工艺。 构成：身体有凹面。 流路（15）形成为从身体的一侧连接到凹部。 芯片接合垫与机身固定。 发光二极管装载在芯片焊盘上。 引线（40）与主体固定并与发光二极管电气组合。 荧光物质片（20）被装载在主体的上部以与发光二极管分离。 成型树脂填充荧光体片的下部的凹部。 荧光物质片的上部包含透镜。
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公开(公告)号：KR1020000002701A
公开(公告)日：2000-01-15
申请号：KR1019980023568
申请日：1998-06-23
Applicant: 삼성전자주식회사
IPC: H01L21/56
Abstract: PURPOSE: A molding device is provided to improve the reliability of a package by reducing the mechanical impact. CONSTITUTION: The molding device comprises: a package ejecting pin for ejecting the molding resin of a package upwards; a lower molding die(13) having a first lead frame ejecting pin(25) for ejecting the outer leads of a lead frame(1) upwards; and an upper molding die(11) having a second lead frame ejecting pin(22) for ejecting the outer leads of the lead frame(1) downwards.
Abstract translation: 目的：提供一种成型装置，通过减少机械冲击来提高包装的可靠性。 构成：成型装置包括：用于向上喷射包装的模制树脂的包装弹出销; 具有用于向上引出引线框架（1）的外引线的第一引线框架弹出销（25）的下成型模具（13） 和具有用于将引线框架（1）的外引线向下排出的第二引线框架弹出销（22）的上成型模具（11）。
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公开(公告)号：KR101775375B1
公开(公告)日：2017-09-06
申请号：KR1020110028308
申请日：2011-03-29
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/505 , H01L33/38 , H01L2933/0041
Abstract: 본발명은페이스트도포용마스크및 이를이용한반도체발광소자제조방법에관한것으로, 본발명의일 측면은, 제1 및제2 도전형반도체층과그 사이에배치된활성층을포함하는발광구조물을형성하는단계와, 상기발광구조물의적어도일 표면에상기제1 및제2 도전형반도체층과전기적으로연결된전극을형성하는단계와, 상기발광구조물의표면중 일부를노출시키는개구부및 상기전극에대응하는영역에는상기전극을수용하는오목부를갖는마스크를배치하는단계와, 상기개구부를통하여상기발광구조물의표면에파장변환물질함유페이스트를도포하는단계를포함하는반도체발광소자제조방법을제공한다.
Abstract translation: 本发明是一种膏还涉及一种方法，用于使用所述接合掩模制备半导体发光元件的方法，并且为此目的，本发明的一个方面包括形成发光结构，其包括布置在第二导电类型半导体层之间，并且有源层的第一mitje的步骤 和对应于所述开口部分和至少表面的形成连接到，用于暴露在发光结构的发光结构的表面的一部分的第一mitje第二导电类型半导体层和电电极的一个步骤具有电极的区域 它提供了将具有用于容纳电极的凹部的掩模的步骤，和一个半导体发光装置的制造方法包括将含有光通过开口的发光结构的表面上糊的波长转换材料的步骤。
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公开(公告)号：KR101748334B1
公开(公告)日：2017-06-16
申请号：KR1020110004530
申请日：2011-01-17
Applicant: 삼성전자주식회사
IPC: H01L21/67 , H01L21/683 , H01L33/00 , H01L33/50 , B05C1/02
CPC classification number: B05C1/027 , H01L21/6715 , H01L21/6838 , H01L33/0079 , H01L33/50 , H01L2933/0041
Abstract: 웨이퍼레벨에서반도체발광소자의발광면의상부에형광층을형성함으로써백색발광을하는반도체발광소자를제조하는방법및 장치를제공를개시한다. 개시도니반도체발광소자의제조방법은, 웨이퍼상에다수의발광소자를형성하는단계; 발광소자들이완성된웨이퍼를박막화하는단계; 박막화된웨이퍼를캐리어테이프위에배치하는단계; 및웨이퍼위의다수의발광소자들을덮도록형광층을형성하는단계;를포함할수 있다.
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