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公开(公告)号：KR101766299B1
公开(公告)日：2017-08-08
申请号：KR1020110005985
申请日：2011-01-20
Applicant: 삼성전자주식회사
CPC classification number: H01L33/486 , B29C45/14344 , B29C45/14655 , B29C45/14836 , H01L33/54 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/4826 , H01L2224/73215 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: 후몰딩(post-molding) 방식으로제조하여본딩와이어의접속신뢰성, 열방출성능및 광품질이향상된발광소자패키지의구조및 상기발광소자패키지의제조방법이개시된다. 개시된발광소자패키지는, 예를들어, 개구부를갖는배선기판, 상기배선기판의상부표면위에배치된발광소자, 상기개구부를통하여상기배선기판의저면과상기발광소자의저면사이를전기적으로연결하는본딩와이어, 및상기발광소자의발광면을제외한발광소자의측면을둘러싸도록배선기판의상면에형성되어있으며또한상기본딩와이어를봉지하도록상기배선기판의개구부내에형성되어있는몰딩부재, 및상기배선기판의저면에형성된솔더레지스트와범프;를포함할수 있다.
Abstract translation: 公开了通过后成型方法制造并提高了键合线的连接可靠性，散热性能和光质量的发光器件封装的结构以及制造该发光器件封装的方法。 所公开的发光装置，例如，设置在所述电路板的发光器件，印刷电路板的上表面具有开口，所述接合为通过所述开口所述底表面的底表面和所述布线基板的发光元件之间进行电连接 线，并且它被形成在电路板的上表面上，以包围除光的发光面以外的发光元件的侧面的发光元件，并且还其在印刷电路板的开口部形成的模制元件，以便密封所述接合线，和印刷电路板的 并在底面上形成阻焊剂和凸块。
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公开(公告)号：KR101740484B1
公开(公告)日：2017-05-26
申请号：KR1020110004528
申请日：2011-01-17
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014
Abstract: 후몰딩(post-molding) 방식으로제조할수 있으며열 방출성능및 광품질을향상시킬수 있는발광소자패키지의구조및 상기발광소자패키지의제조방법이개시된다. 개시된발광소자패키지는방열패드, 방열패드위에배치된발광소자, 발광소자와방열패드의양측에각각이격되어배치된리드프레임, 방열패드과리드프레임을매립하는동시에발광소자의발광면을제외한측면둘레를둘러싸도록형성된몰딩부재, 및리드프레임과발광소자를전기적으로연결하는본딩와이어를포함할수 있다.
Abstract translation: 公开了可以通过后成型方法制造并且可以改善散热性能和光质量的发光器件封装的结构以及制造该发光器件封装的方法。 所公开的发光装置是除了光在嵌入发光元件的同时发光元件的发光面侧周，在所述发光装置和所述热辐射垫的引线框，配置在热垫热paedeugwa引线框架，散热垫的相对两侧分别设置间隔 以包围它的方式形成的模制部件，以及电连接引线框架和发光器件的接合线。
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公开(公告)号：KR101662038B1
公开(公告)日：2016-10-05
申请号：KR1020100043171
申请日：2010-05-07
Applicant: 삼성전자주식회사
CPC classification number: H01L33/62 , H01L33/486 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
Abstract: 칩패키지는칩, 칩이탑재되는탑재부와, 칩을외부에전기적으로연결하는단자부를포함하는리드프레임을포함한다. 단자부는제1 체결부가마련된제1 형상단자및 제2 체결부가마련된제2 형상단자를포함한다. 제1 체결부및 제2 체결부는서로상보적으로맞물릴수 있는요철형상을가진다.
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公开(公告)号：KR1020130010764A
公开(公告)日：2013-01-29
申请号：KR1020110071614
申请日：2011-07-19
Applicant: 삼성전자주식회사
IPC: H01L33/48
CPC classification number: H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83385 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package is provided to prevent a fillet on the side of the light emitting device due to the residual adhesive by receiving the residual adhesive through an adhesive receiving groove. CONSTITUTION: A package substrate includes an insulation pattern layer(111), a first wiring pattern(112a) and a second wiring pattern(112b). The package substrate includes a junction target area(R1) and has a size corresponding to the size of a light emitting device junction surface. A light emitting device is mounted on the junction target area of the package substrate. An adhesive receiving groove(113) is formed in the junction target area of the package substrate and receives the residual adhesive.
Abstract translation: 目的：提供发光器件封装，以通过通过粘合剂接收槽接收残留粘合剂而防止由于残留粘合剂而在发光器件侧面上的圆角。 构成：封装基板包括绝缘图案层（111），第一布线图案（112a）和第二布线图案（112b）。 封装衬底包括结目标区域（R1），并且具有与发光器件结表面的尺寸相对应的尺寸。 发光器件安装在封装衬底的接合目标区域上。 在封装基板的接合目标区域中形成粘合剂接收槽（113）并接收残留粘合剂。
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公开(公告)号：KR1020120105146A
公开(公告)日：2012-09-25
申请号：KR1020110022761
申请日：2011-03-15
Applicant: 삼성전자주식회사
CPC classification number: H01L21/67126 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/97 , H01L2933/0066 , Y10T29/49124 , Y10T29/53174 , H01L2924/00014
Abstract: PURPOSE: A manufacturing method of a light emitting device package and a manufacturing device of the light emitting device package using the same are provided to improve thermal transfer efficiency from a heater block to a light emitting device in the wire bonding process. CONSTITUTION: A heater block(10) is formed into a flat pattern. The heater block comprises a groove portion(11) and a protrusion portion(12). The groove portion is formed in the area in which a light emitting device package(30) is arranged in the wire bonding. A clamp(40) is arranged on a lead frame(20) of the light emitting device package. One or more grooves are formed on the location corresponding to the protrusion portion of the bottom of the light emitting device package. The height of the upper surface of the heater block and the height of the surface of the protrusion portion are same.
Abstract translation: 目的：提供一种发光器件封装的制造方法和使用其的发光器件封装的制造装置，以提高在引线接合工艺中从加热器块到发光器件的热传递效率。 构成：加热器块（10）形成为平坦的图案。 加热器块包括槽部分（11）和突出部分（12）。 沟槽部分形成在引线接合中布置有发光器件封装（30）的区域中。 夹具（40）布置在发光器件封装的引线框架（20）上。 在对应于发光器件封装的底部的突出部分的位置处形成一个或多个凹槽。 加热器块的上表面的高度和突出部分的表面的高度是相同的。
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Patent Agency Ranking
公开(公告)号：KR1020120104705A
公开(公告)日：2012-09-24
申请号：KR1020110022268
申请日：2011-03-14
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/502 , H01L2933/0041
Abstract: PURPOSE: A method for manufacturing a semiconductor light emitting element is provided to easily manufacture the semiconductor light emitting element which reliability is increased by removing a wavelength conversion layer, thereby increasing process efficiency. CONSTITUTION: A conductive substrate is formed on a second conduction type semiconductor layer(23) of a light emitting structure. A part of a first conduction type semiconductor layer(21), an active layer(22), and the second conduction type semiconductor layer of the light emitting structure are removed. A wavelength conversion layer is formed on an upper side of the light emitting structure and an area which the light emitting structure is removed by using a screen printing method. A mask is removed to expose a surface of an electrode, after the wavelength conversion layer is formed. An outcome is divided into an element unit. The wavelength conversion layer is exposed in each side of the divided elements.
Abstract translation: 目的：提供一种制造半导体发光元件的方法，以容易地制造通过去除波长转换层而提高可靠性的半导体发光元件，从而提高工艺效率。 构成：在发光结构的第二导电型半导体层（23）上形成导电性基板。 除去发光结构的第一导电型半导体层（21），有源层（22）和第二导电型半导体层的一部分。 在发光结构的上侧形成波长转换层，通过丝网印刷法形成发光结构的去除区域。 在形成波长转换层之后，去除掩模以暴露电极的表面。 结果分为元素单元。 波长转换层在分割元件的每一侧曝光。
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公开(公告)号：KR1020120084553A
公开(公告)日：2012-07-30
申请号：KR1020110005984
申请日：2011-01-20
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/16245 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: PURPOSE: A package of a light emitting device and a manufacturing method thereof and a lead frame are provided to simplify a manufacturing process since separate members like a sub mount and a heat sink are not necessary. CONSTITUTION: A chip includes a light emitting device. The chip is mounted on the lead frame. A mold(50) covers the side of the chip. A fluorescent layer(52) covers a light emission side of the chip. A transparent sealing member(54) covers the fluorescent layer. An electrode of the chip faces the lead frame. The chip and the lead frame can be bonded by a flip chip or contacted by a bonding layer.
Abstract translation: 目的：提供一种发光器件及其制造方法和引线框架，以简化制造工艺，因为不需要诸如子安装座和散热器的分立构件。 构成：芯片包括发光器件。 芯片安装在引线框架上。 模具（50）覆盖芯片的侧面。 荧光层（52）覆盖芯片的发光侧。 透明密封构件（54）覆盖荧光层。 芯片的电极面向引线框架。 芯片和引线框架可以通过倒装芯片接合或由接合层接触。
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公开(公告)号：KR1020120083080A
公开(公告)日：2012-07-25
申请号：KR1020110004528
申请日：2011-01-17
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L33/644 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/48465 , H01L2933/0033 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package and method of manufacturing the light emitting device package are provided to prevent the decrease of optical quality by sputtering fluorescent matters on top of the emitting elements. CONSTITUTION: A pair of lead frame(102) is separately arranged on both sides of heat emitting pads where an emitting device(104) is arranged. A molding member(107) is formed to surround the all sides except the top surface of the emitting device. A bonding wire(106) electrically connects between the lead frame and emitting device. A cover member(108) completely covers a part of a lead frame and emitting device exposed out of the molding member.
Abstract translation: 目的：提供发光器件封装和制造发光器件封装的方法，以防止通过在发光元件顶部溅射荧光物质来降低光学质量。 构成：一对引线框架（102）分别布置在发射焊盘的两侧，其中布置发射装置（104）。 模制构件（107）形成为围绕除了发射装置的顶表面之外的所有侧面。 接合线（106）在引线框架和发射器件之间电连接。 盖构件（108）完全覆盖引出框架的一部分和从模制构件露出的发射装置。
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公开(公告)号：KR1020110121927A
公开(公告)日：2011-11-09
申请号：KR1020100041445
申请日：2010-05-03
Applicant: 삼성전자주식회사
IPC: F21K99/00 , F21V29/83 , F21V29/507 , F21V23/06 , F21Y101/02 , F21Y103/00
CPC classification number: F21V23/06 , F21K9/275 , F21V29/507 , F21V29/83 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , F21K9/00 , F21K9/27 , F21Y2101/00 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: An illumination apparatus employing a light emitting device package is provided to making a lighting device light by using a lead frame having an exposed structure. CONSTITUTION: In an illumination apparatus employing a light emitting device package, a light source is comprised of at least one light module(100) having a lead frame. The lead frame interlinks a plurality of light-emitting device chips. A diffusion cover(210) has an internal space accepting the light source module. The diffusion cover diffuses the light coming out from the light source module. A mounting unit(240) is formed in the diffusion cover adjacency to be adjunct to the light source module.
Abstract translation: 目的：提供采用发光器件封装的照明装置，通过使用具有暴露结构的引线框来使照明装置发光。 构成：在采用发光器件封装的照明装置中，光源由至少一个具有引线框架的光模块（100）组成。 引线框架连接多个发光器件芯片。 扩散罩（210）具有容纳光源模块的内部空间。 扩散罩扩散从光源模块出来的光。 一个安装单元（240）形成在扩散盖相邻中以附加到光源模块。
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公开(公告)号：KR1020080046824A
公开(公告)日：2008-05-28
申请号：KR1020060116325
申请日：2006-11-23
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00011 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/01049
Abstract: A semiconductor memory module is provided to protect a semiconductor memory device from physical impact caused by irregularly arranged dummy pads and dummy balls by installing an impact absorption structure on a semiconductor memory package corresponding to dummy pads and dummy balls irregularly arranged in a mother board. A semiconductor memory module includes a mother board(10) and semiconductor memory packages(5). An impact absorption structure(100) is disposed on at least one of the semiconductor memory packages to correspond to dummy pads(24) and dummy balls(28) irregularly arranged on the mother board. The semiconductor memory module can include a DIMM(dual in-line memory module) or an RDIMM(resistor dual in-line memory module). The impact absorption structure can be composed of an impact absorption pattern and a protection housing surrounding the impact absorption pattern wherein a space can be formed between the protection housing and the impact absorption pattern.
Abstract translation: 提供半导体存储器模块以通过在对应于不规则地布置在母板中的虚拟焊盘和虚拟焊盘的半导体存储器封装上安装冲击吸收结构来保护半导体存储器件免受由不规则排列的虚拟焊盘和虚拟焊球引起的物理冲击。 半导体存储器模块包括母板（10）和半导体存储器封装（5）。 冲击吸收结构（100）设置在半导体存储器封装中的至少一个上，以对应于不规则地布置在母板上的虚拟焊盘（24）和虚拟焊球（28）。 半导体存储器模块可以包括DIMM（双列直插存储器模块）或RDIMM（电阻双列直插存储器模块）。 冲击吸收结构可以由冲击吸收图案和围绕冲击吸收图案的保护壳体组成，其中可以在保护壳体和冲击吸收图案之间形成空间。
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