반도체 제조장치의 세정방법
    3.
    发明公开
    반도체 제조장치의 세정방법 无效
    半导体制造装置的清洁方法

    公开(公告)号:KR1020120004190A

    公开(公告)日:2012-01-12

    申请号:KR1020100064916

    申请日:2010-07-06

    CPC classification number: H01J37/32862

    Abstract: PURPOSE: A method for cleaning a semiconductor apparatus is provided to minimize the damage of an electrostatic chuck by plasma by controlling the plasma which reaches the surface of an electrostatic chuck. CONSTITUTION: A reaction gas supply unit(140) is connected to the reaction gas injector(114) of a processing chamber(110) through a supply line(141). The processing chamber includes a first electrode(132) and a second electrode(137) for generating the electrostatic chuck(120) and plasma. A chiller supplies a cooling gas or a cool liquid to a circulation pipe which is formed in the electrostatic chuck. An exhaust pump(150) is connected to the discharge end portion of the processing chamber. An exhaust volume controller(151) is placed between the discharge end portion and an exhaust pump.

    Abstract translation: 目的:提供一种用于清洁半导体装置的方法,通过控制到达静电卡盘表面的等离子体来最小化等离子体的静电卡盘的损坏。 构成:反应气体供应单元(140)通过供应管线(141)连接到处理室(110)的反应气体注入器(114)。 处理室包括用于产生静电卡盘(120)和等离子体的第一电极(132)和第二电极(137)。 冷却器将冷却气体或冷却液供给到形成在静电卡盘中的循环管道。 排气泵(150)连接到处理室的排放端部。 排气量控制器(151)被放置在排出端部和排气泵之间。

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