公开(公告)号：KR1020140123720A

公开(公告)日：2014-10-23

申请号：KR1020130040885

申请日：2013-04-15

Applicant: 삼성전자주식회사

Inventor： 임성준 ,  권용민 ,  문서현 ,  손민영

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2933/0033 ,  H05K1/0271 ,  H05K2201/068

Abstract: A light emitting device package according to the embodiment of the present invention includes a substrate which includes a core with a laminate structure on which a plurality of metal layers with different thermal expansion coefficients are bonded, an insulation layer which covers at least one side of the core and an electrode layer which is formed on the insulation layer and is electrically insulated from the core, and a light emitting device which is mounted on the substrate and is electrically connected to the electrode layer.

Abstract translation: 根据本发明的实施例的发光器件封装包括：衬底，其包括具有层压结构的芯，多个金属层具有不同的热膨胀系数，绝缘层覆盖至少一个 芯和形成在绝缘层上并与芯电绝缘的电极层，以及安装在基板上并与电极层电连接的发光器件。

公开(公告)号：KR1020140094752A

公开(公告)日：2014-07-31

申请号：KR1020130007021

申请日：2013-01-22

Applicant: 삼성전자주식회사

Inventor： 권용민 ,  문서현 ,  임성준 ,  손민영

IPC: H01L23/12 ,  H01L33/00 ,  H01L31/042

CPC classification number: H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L33/38 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

Abstract: One aspect of the present invention provides an electronic device package which includes a first surface and a second surface facing the first surface, a first electrode pattern and a second electrode pattern which are formed on the first surface, a first external terminal and a second external terminal which are connected to the first and the second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern. A package substrate surrounds the first electrode pattern. An electrode device has a first electrode and a second electrode, which are mounted on the first surface of the package substrate and is formed on a surface which faces the package substrate to be located on the first and the second electrode patterns.

Abstract translation: 本发明的一个方面提供了一种电子器件封装，其包括第一表面和面向第一表面的第二表面，形成在第一表面上的第一电极图案和第二电极图案，第一外部端子和第二外部端子 端子，其连接到第一和第二电极图案。 第二电极图案与第一电极图案电绝缘。 封装基板围绕第一电极图案。 电极装置具有第一电极和第二电极，其安装在封装基板的第一表面上，并且形成在面向封装基板的表面上，以位于第一和第二电极图案上。