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公开(公告)号：KR1020150139660A
公开(公告)日：2015-12-14
申请号：KR1020140067441
申请日：2014-06-03
Applicant: 삼성전자주식회사
CPC classification number: H01L23/49827 , H01L24/97 , H01L33/486 , H01L33/54 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/16225 , H01L2224/97 , H01L2924/181 , H01L2924/00012
Abstract: 본발명의일 실시예는, 제1 면과상기제1 면에대향하는제2 면을구비하는패키지본체와, 상기제1 면상에배치된전자소자및 상기제1 면중 상기전자소자가배치된영역으로정의되는실장영역내에위치하는제1 단부를구비하며, 상기패키지본체를관통하는적어도하나의도전성비아를포함하고, 상기제1 단부는제1 방향에따른제1 폭이상기제1 방향과실질적으로수직인제2 방향에따른제2 폭보다큰 전자소자패키지를제공한다.
Abstract translation: 根据本发明的一个实施例，提供一种电子器件封装，其包括：封装主体，包括第一表面和面向第一表面的第二表面; 布置在所述第一表面上的电子装置; 以及至少一个导电通孔，其包括第一端部单元，其位于限定为所述第一表面的所述电子器件的区域的安装区域内并且穿透所述封装主体。 相对于基本上垂直于第一方向的第二方向，第一端单元相对于第一方向具有大于第二宽度的第一宽度。
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公开(公告)号：KR1020130037945A
公开(公告)日：2013-04-17
申请号：KR1020110102516
申请日：2011-10-07
Applicant: 삼성전자주식회사
CPC classification number: F21V19/0045 , F21K9/27 , F21K9/66 , F21V29/506 , F21V29/508 , F21V29/75 , F21V29/763 , F21Y2103/10 , F21Y2115/10
Abstract: PURPOSE: A lighting device is provided to have no use for a separate heat radiation by exposing a part of circuit board which acts as a heat radiation plate to the outside. CONSTITUTION: A circuit board(110) has a structure inserted into a cylindrical cover(120). A light emitting device is mounted on the first surface of a circuit board. The light generated from the light emitting device passes through the cover. An opening is formed on the upper part of the cover in the longitudinal direction of the cylinder. A part of a second surface(112) of the circuit board is exposed to the outside through the opening.
Abstract translation: 目的：通过将作为散热板的电路板的一部分暴露于外部，照明装置不能用于单独的散热。 构成：电路板（110）具有插入圆柱形盖（120）中的结构。 发光器件安装在电路板的第一表面上。 从发光装置产生的光通过盖。 在气缸的纵向上的盖的上部形成有开口。 电路板的第二表面（112）的一部分通过开口暴露于外部。
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公开(公告)号：KR1020130037904A
公开(公告)日：2013-04-17
申请号：KR1020110102432
申请日：2011-10-07
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L33/62 , H01L33/486 , H01L33/502 , H01L33/56 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package and a manufacturing method using the same are provided to directly connect a fluorescent material layer to a first and a second lead frame, thereby rapidly discharging the heat of the fluorescent material layer to the outside. CONSTITUTION: A package body(110) includes a cavity(111) for mounting a light emitting device(130). A first lead frame(121) is formed in the first area of the lower surface of a cavity. A second lead frame(122) is formed in the second area of the lower surface of the cavity. The light emitting device is electrically connected to the first and the second lead frame. A transparent resin layer is formed in the cavity. A fluorescent material layer(160) touches the first and the second lead frame.
Abstract translation: 目的：提供一种发光器件封装及其制造方法，用于将荧光材料层直接连接到第一引线框架和第二引线框架，从而将荧光材料层的热量快速地排出到外部。 构成：包装体（110）包括用于安装发光装置（130）的空腔（111）。 第一引线框架（121）形成在空腔的下表面的第一区域中。 第二引线框架（122）形成在空腔的下表面的第二区域中。 发光器件电连接到第一引线框架和第二引线框架。 在空腔中形成透明树脂层。 荧光材料层（160）接触第一引线框架和第二引线框架。
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公开(公告)号：KR101219106B1
公开(公告)日：2013-01-11
申请号：KR1020110076720
申请日：2011-08-01
Applicant: 삼성전자주식회사
CPC classification number: H01L33/486 , H01L24/97 , H01L25/075 , H01L33/505 , H01L33/60 , H01L2924/12041 , H01L2924/181 , H01L2924/00
Abstract: PURPOSE: A light emitting device package and a manufacturing method thereof are provided to expose a light emitting device in the lower part of a package body to a substrate, thereby maximizing the efficiency of heat dissipation. CONSTITUTION: A main body part(10) includes a through hole(11). The through hole comprises a projection part and a concavo-convex part. At least one light emitting device(20) is arranged inside the through hole. The through hole is filled with a wavelength converting part(30). The wavelength converting part supports the light emitting device.
Abstract translation: 目的：提供一种发光器件封装及其制造方法，以将封装体的下部的发光器件暴露于基板，从而最大化散热效率。 构成：主体部分（10）包括通孔（11）。 通孔包括突出部和凹凸部。 至少一个发光器件（20）布置在通孔的内部。 通孔填充有波长转换部（30）。 波长转换部分支持发光器件。
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Patent Agency Ranking
公开(公告)号：KR101693642B1
公开(公告)日：2017-01-17
申请号：KR1020100131667
申请日：2010-12-21
Applicant: 삼성전자주식회사
CPC classification number: H01L33/60 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: 개시된발광소자패키지제조방법은금속판재를가공하여, 탑재부와, 탑재부의제1방향의양측에위치되고각각제1, 제2지지아암에의하여금속판재와연결된제1, 제2연결부와, 탑재부의제1방향에직각인제2방향의양측가장자리로부터상방으로경사지게연장되고제3지지아암에의하여금속판재와연결된제1반사면을구비하는리드프레임을형성하는단계와, 리드프레임에폴리머를사출성형에하여, 리드프레임과결합되고탑재부의제1방향의양측에배치되는제2반사면을구비하는몰드프레임을형성하여, 리드프레임과몰드프레임을형성하는단계와, 발광소자칩을탑재부에탑재하는단계와, 제1, 제2아암을절단한후, 와이어본딩에의하여발광소자칩과제1, 제2연결부를전기적으로연결하는단계를포함한다.
Abstract translation: 一种发光器件封装，包括由金属形成的引线框架，其上安装有发光器件芯片; 以及通过注射成型联接到引线框架的模框。 引线框架包括：安装有发光器件芯片的安装部分; 以及第一和第二连接部分，其在第一方向上设置在安装部分的两侧，并且通过引线接合连接到发光器件芯片，其中第一连接部分相对于安装部分是阶梯状的，并且台阶 量小于引线框架的材料厚度。
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公开(公告)号：KR1020130025597A
公开(公告)日：2013-03-12
申请号：KR1020110089000
申请日：2011-09-02
Applicant: 삼성전자주식회사
CPC classification number: F21K9/272 , F21K9/275 , F21V19/0045 , F21V29/00 , F21Y2103/10
Abstract: PURPOSE: A lighting device is provided to improve an assembly property of a circuit board by reducing a contact resistance between a close protrusion and the circuit board. CONSTITUTION: A circuit board(110) includes a light emitting device(112) on one side thereof and is formed with a panel shape. An insertion unit(122) is formed on a cover(120). The circuit board is inserted into the insertion unit. A close protrusion(130) protrudes from the other side of the insertion unit to closely adhere the circuit board.
Abstract translation: 目的：提供一种照明装置，通过减小紧密突起与电路板之间的接触电阻来改善电路板的组装性能。 构成：电路板（110）的一侧包括发光装置（112），并形成有面板形状。 插入单元（122）形成在盖（120）上。 电路板插入插入单元。 闭合突起（130）从插入单元的另一侧突出，以紧密地粘附电路板。
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公开(公告)号：KR1020120108749A
公开(公告)日：2012-10-05
申请号：KR1020110027022
申请日：2011-03-25
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/32245 , H01L2224/45139 , H01L2224/48 , H01L2224/48247 , H01L2224/48465 , H01L2224/48997 , H01L2224/73265 , H01L2224/85951 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
Abstract: PURPOSE: A light emitting device package is provided to prevent a short circuit of a wire by using a short circuit preventing unit. CONSTITUTION: A body(110) includes a top body(111) and a bottom body(112). A plurality of lead frames(120) surround a part of the bottom body. A light emitting device(130) is mounted on one of the lead frames and emits light. A wire(150) connects the light emitting device to another frame. A short circuit preventing unit(170) is formed near the wire to prevent a short circuit of the wire.
Abstract translation: 目的：提供一种发光器件封装，以通过使用防短路单元来防止电线短路。 构成：主体（110）包括顶部主体（111）和底部主体（112）。 多个引线框架（120）围绕底部本体的一部分。 发光装置（130）安装在引线框架之一上并发光。 电线（150）将发光器件连接到另一个框架。 在电线附近形成有短路防止单元（170），以防止电线短路。
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公开(公告)号：KR1020120082192A
公开(公告)日：2012-07-23
申请号：KR1020110003556
申请日：2011-01-13
Applicant: 삼성전자주식회사
CPC classification number: H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L33/50 , H01L33/60 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: PURPOSE: A light-emitting device package is provided to improve luminous efficiency by placing a refraction index matching layer between a light-emitting device chip and a space in which a wire is installed. CONSTITUTION: A package body comprises a cavity and a lead frame(200). A loading unit is located on the cavity. A plurality of terminal units is located on the lead frame. A light-emitting device chip(300) is mounted on the loading unit. A plurality of bonding wires(301, 302) electrically interlinks the light-emitting device chip and the plurality of terminal units. The cavity is filled with a translucency sealing layer. A translucency cap member(500) is located within the cavity and blocks the translucency sealing layer to contact with the plurality of bonding wires.
Abstract translation: 目的：提供一种发光器件封装，通过在发光器件芯片和安装导线的空间之间放置折射率匹配层来提高发光效率。 构成：包装体包括空腔和引线框架（200）。 加载单元位于空腔上。 多个终端单元位于引线框架上。 发光装置芯片（300）安装在装载单元上。 多个接合线（301,302）将发光器件芯片和多个端子单元电连接。 空腔中充满半透明密封层。 半透明帽构件（500）位于空腔内并阻挡半透明密封层与多个接合线接触。
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