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公开(公告)号:KR100688974B1
公开(公告)日:2007-03-08
申请号:KR1020060022053
申请日:2006-03-09
Applicant: 삼성전자주식회사
IPC: H01L21/66
Abstract: An inspecting apparatus using a charged particle beam in a vacuum chamber is provided to secure easily an installation space and detect a correct image from a target to be inspected. An inspecting unit(140) is supported by one side of a vacuum chamber(110). The inspecting unit includes a lens(141) for collecting charged particles which are reflected from a target(120) to be inspected. A driving unit(150) includes a focus driving device(151) for controlling a focus of the lens and a horizontal driving device(152) for driving a stage. A sensor unit(160) is coupled with the inside of the vacuum chamber and senses a gap between the lens and the target by using a capacitance effect. A control unit(170) controls the driving unit by using the sensed information of the sensor unit.
Abstract translation: 提供一种在真空室中使用带电粒子束的检查设备,以容易地确保安装空间并且从待检查目标检测正确图像。 检查单元(140)由真空室(110)的一侧支撑。 检查单元包括用于收集从待检查目标(120)反射的带电粒子的透镜(141)。 驱动单元(150)包括用于控制透镜的焦点的聚焦驱动装置(151)和用于驱动平台的水平驱动装置(152)。 传感器单元(160)与真空室的内部耦合,并通过使用电容效应来感测透镜和目标之间的间隙。 控制单元(170)通过使用传感器单元的感测信息来控制驱动单元。
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公开(公告)号:KR1020170115217A
公开(公告)日:2017-10-17
申请号:KR1020160042447
申请日:2016-04-06
Applicant: 삼성전자주식회사
IPC: H01L21/304 , H01L21/306 , H01L21/66 , H01L21/02 , H01L21/67 , H01L21/677
CPC classification number: B24B49/12 , B24B37/04 , B24B53/017 , G01B11/22 , G01B11/24
Abstract: 본발명은연마패드측정장치및 이를이용한화학적기계적연마설비에관한것이다. 본발명은웨이퍼를연마하는연마패드의프로파일을측정하는연마패드측정장치에있어서, 연마패드의일면으로부터상기일면과대향된타면을향해연장된그루브들내의이물질을제거하기위한이물질제거부; 및상기이물질이제거된상기그루브들의깊이를측정하기위한거리측정부를포함한다.
Abstract translation: 研磨垫测定装置及使用其的化学机械研磨装置技术领域本发明涉及研磨垫测定装置及使用该研磨垫测定装置的化学机械研磨装置 本发明涉及一种抛光垫,测量装置用于测量所述抛光垫的轮廓以抛光晶片,和从抛光垫的一个表面上的一个表面,并拒绝用于去除朝向另一个表面相对的异物延伸的凹槽内的异物; 以及距离测量单元,用于测量去除异物的凹槽的深度。
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