Abstract:
A pad option apparatus and a method for enhancing internal power of a semiconductor memory are provided to improve the internal power by changing unused pads among signal input/output pads used in a design and test process of a semiconductor integrated circuit into a power supply pad. An option signal generation part(300) generates a pad option control signal. A pad option circuit part(310) connects a selected line of an internal signal input/output line(340) and a power supply line(330) to a signal input/output pad(320), in response to the pad option control signal. The option signal generation part generates the pad option control signal by a fuse or an external command. The external command is a mode register set signal. The signal input/output line is a data signal input/output line or a test signal input/output line.
Abstract:
본 발명은 반도체 소자의 퓨즈 구조 및 퓨즈 형성방법에 관한 것으로, 본 발명에 따른 반도체 소자의 퓨즈 구조는, 반도체 기판 상에 배치되는 제1퓨즈라인과; 상기 제1퓨즈라인과는 수직적으로 중첩되고 서로 다른 배선층에 배치되는 제2퓨즈라인과; 상기 제1퓨즈라인과 상기 제2퓨즈라인을 전기적으로 연결하기 위하여 배치되는 콘택을 구비함을 특징으로 한다. 본 발명에 따르면, 퓨즈 형성면적을 줄일 수 있으며, 커팅 신뢰성을 향상시킬 수 있는 효과가 있다. 퓨즈, 콘택, 레이어, 커팅, 레이저
Abstract:
본 발명은 반도체 장치 및 정보 처리 시스템을 공개한다. 이 장치는 드라이버 조정신호에 응답하여 구동 능력이 조정되고, 출력신호를 출력하는 복수개의 드라이버들, 설정 신호에 응답하여 상기 복수개의 드라이버 중 일부의 드라이버들 각각에 상기 드라이버 조정신호를 출력하는 복수개의 설정부들, 및 외부로부터 입력되는 신호에 응답하여 상기 복수개의 설정부들 중 일부를 선택하여 선택된 상기 설정부로 상기 설정 신호를 출력하는 설정신호 발생부를 구비하는 것을 특징으로 한다. 따라서, 각 드라이버와 연결되는 데이터 출력 라인의 로딩 등이 달라지더라도 지연시간의 차이 등을 감소시킬 수 있어 최적의 신호 전송을 가능하게 한다.
Abstract:
A multi-path accessible semiconductor memory device for assuring data matching in case of independent data unit per port and a method for matching data therefor are provided to access a shared memory region and a dedicated memory region in the semiconductor memory device in independent bit unit per port. A semiconductor memory device comprises a memory cell array. The memory cell array has a first memory bank, a second memory bank and a third memory bank. The first memory bank is connected to a first processor through a first port having N data input/output bits. The second memory bank is connected to a second processor through a second port having 2N data input/output bits. The third memory bank is connected to the first and the second processor in common through the first and the second port. An address coding shifting part(500) performs bit-shifting of a first and a second column address applied in a read operation mode selectively, in order for data stored in the third memory bank to match the first and the second processors according to the first and the second column address applied through the first and the second port correspondingly.
Abstract:
A schottky diode structure for high voltage is provided to prevent generation of a parasitic transistor by arranging a conductive electrode on a substrate at both sides of a schottky diode. A second conductive type well(102) is disposed on an upper portion of a first conductive type semiconductor substrate(100). A first conductive layer(126) is arranged on a surface of the substrate including the well. A conductive electrode(122) is arranged on at least one side of the first conductive electrode. The conducive electrode is arranged on the substrate including the well by interposing a dielectric(120). A second conductive type doped cathode contact region(114) is arranged at the outside of the conductive electrode with respect to the first conductive layer. The first conductive layer is a metal silicide. A second conductive layer(124) is located on the first conductive electrode. The first and the second conductive layers are anode electrodes having the same potential value.