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公开(公告)号:KR1020160056376A
公开(公告)日:2016-05-20
申请号:KR1020140155548
申请日:2014-11-10
Applicant: 삼성전자주식회사
CPC classification number: H01L43/12 , C23C14/08 , C23C14/081 , C23C14/082 , C23C14/083 , C23C14/165 , C23C14/185 , C23C14/34 , C23C14/3492 , C23C14/5853 , G11C11/161 , H01F10/3286 , H01F41/307
Abstract: 금속산화막을형성하는방법및 이를포함하는자기메모리장치가제공된다. 이방법은, 자성막상에금속막을증착하는단계및 금속막을산화시키는단계를포함하는공정사이클이적어도한번실시되는, 후-산화공정을포함할수 있다.
Abstract translation: 提供一种形成金属氧化物层的方法和包括该方法的磁存储器件。 形成金属氧化物层的方法包括进行至少一个工艺循环的后氧化工艺,包括以下步骤:在磁性层上沉积金属层; 并且氧化金属层,从而容易地控制磁性层的下部与金属氧化物层之间的界面的性质,并减少对磁性层的下部的损伤。 因此,可以制备具有改善的结晶性和低RA性能的金属氧化物层。
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公开(公告)号:KR1020160011069A
公开(公告)日:2016-01-29
申请号:KR1020140092080
申请日:2014-07-21
Applicant: 삼성전자주식회사
IPC: H01L43/08 , G11C11/15 , H01L21/8247 , H01L27/115 , H01L21/31
CPC classification number: H01L43/12 , C23C14/3492 , C23C14/5806 , G11C11/161 , G11C11/1659 , H01L27/228 , H01L43/08
Abstract: 자기소자의제조방법은자성층을형성하는단계와, Ar 보다원자량이큰 비활성가스인제1 가스를사용하여자성층상에하부절연층을형성하는단계와, Ar 가스를사용하여하부절연층상에상부절연층을형성하는단계를포함한다.
Abstract translation: 磁体装置的制造方法技术领域本发明涉及磁性装置的制造方法。 该方法包括以下步骤:形成磁性层; 通过使用具有比氩(Ar)更高的原子量的惰性气体的第一气体,在磁性层上形成下部绝缘层; 并通过使用Ar在下绝缘层上形成上绝缘层。 因此,磁性器件的制造方法可以防止在磁性器件中形成绝缘层的过程中引起的磁性劣化,并且保持可靠性。
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公开(公告)号:KR1020120106522A
公开(公告)日:2012-09-26
申请号:KR1020110074500
申请日:2011-07-27
Applicant: 삼성전자주식회사
IPC: H01L27/115 , H01L21/8247 , H01L43/00
CPC classification number: G11C11/15 , H01L27/222 , H01L43/08 , H01L43/12 , Y10S977/935
Abstract: PURPOSE: A magnetic memory device and a manufacturing method thereof are provided to increase thermal stability by comprises a perpendicular magnetization preserving layer with material in which oxygen affinity is low. CONSTITUTION: A magnetic tunnel junction comprises a tunnel barrier and an extrinsic perpendicular magnetization structure. The extrinsic perpendicular magnetization structure comprises a perpendicular magnetization preserving layer(PMP) and a perpendicular magnetization inducing layer(PMI). The perpendicular magnetization inducing layer is formed between the perpendicular magnetization preserving layer and the tunnel barrier. The perpendicular magnetization preserving layer is comprised of material having oxygen affinity smaller than metal comprising the perpendicular magnetization inducing layer.
Abstract translation: 目的:提供磁存储器件及其制造方法以通过包括垂直磁化保存层与氧亲和力低的材料来增加热稳定性。 构成:磁隧道结包括隧道势垒和外在垂直磁化结构。 外在垂直磁化结构包括垂直磁化维持层(PMP)和垂直磁化诱导层(PMI)。 在垂直磁化保持层和隧道势垒之间形成垂直磁化诱导层。 垂直磁化保护层由具有小于包含垂直磁化诱导层的金属的氧亲和性的材料构成。
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公开(公告)号:KR1020110136560A
公开(公告)日:2011-12-21
申请号:KR1020100056651
申请日:2010-06-15
Applicant: 삼성전자주식회사
CPC classification number: H01L43/08 , B82Y25/00 , B82Y40/00 , H01F10/123 , H01F10/3236 , H01F10/3254 , H01F10/3286 , H01F41/307 , H01L43/10
Abstract: PURPOSE: A magnetic memory device is provided to reduce threshold current density while maintaining thermal stability of the magnetic memory device. CONSTITUTION: A standard magnetic layer(120) is arranged on a substrate(100). A tunnel barrier layer(130) is arranged on the standard magnetic layer. A horizontal freedom layer(140) is arranged on the tunnel barrier layer. An upper electrode is arranged on the horizontal freedom layer. A magnetization inversion auxiliary layer(160) is arranged between the tunnel barrier layer and upper electrode.
Abstract translation: 目的:提供磁存储器件以降低阈值电流密度,同时保持磁存储器件的热稳定性。 构成:在基板(100)上布置标准磁性层(120)。 隧道势垒层(130)布置在标准磁性层上。 在隧道势垒层上布置水平自由层(140)。 上电极布置在水平自由层上。 磁化反转辅助层(160)布置在隧道势垒层和上电极之间。
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公开(公告)号:KR1020110088984A
公开(公告)日:2011-08-04
申请号:KR1020100008756
申请日:2010-01-29
Applicant: 삼성전자주식회사
IPC: H01L27/115 , H01L21/308 , H01L21/8247
CPC classification number: H01L21/28 , H01L21/28273 , H01L21/28141 , H01L21/308 , H01L21/31051 , H01L45/04 , Y10S977/935
Abstract: PURPOSE: A manufacturing method of a semiconductor device is provided to offer oxide mask having no deformity including seam etc by oxidizing a metal layer of the lower part. CONSTITUTION: An under-layer(25) is formed on the top of a substrate. A sacrificing layer is formed on the under-layer. An opening(30a) which exposes a fixed region of the under-layer is formed by patterning the sacrificing layer. A mask layer(35) is formed in the opening. An oxide mask(40) is formed by oxidizing the entire or partial mask layer. An under-layer pattern is formed by eliminating the sacrificing layer and etching the under-layer using the oxide mask as an etching mask.
Abstract translation: 目的:通过氧化下部的金属层,提供半导体器件的制造方法来提供不具有包括接缝等的变形的氧化物掩模。 构成:在衬底的顶部上形成底层(25)。 在底层上形成牺牲层。 通过对牺牲层进行图案化形成露出下层固定区域的开口(30a)。 在开口中形成掩模层(35)。 通过氧化整个或部分掩模层形成氧化物掩模(40)。 通过消除牺牲层并使用氧化物掩模来蚀刻底层来形成底层图案作为蚀刻掩模。
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公开(公告)号:KR1020110028134A
公开(公告)日:2011-03-17
申请号:KR1020090086084
申请日:2009-09-11
Applicant: 삼성전자주식회사
IPC: G11C11/15 , H01L27/115
CPC classification number: G11C11/161 , H01L43/08 , G11C11/15 , H01L27/228 , H01L43/12
Abstract: PURPOSE: A magnetic memory device is provided to increase the magneto-resistance ratio of a magnetic tunnel junction by easily aligning the spin direction of electrons passing a magnetic layer to be vertical to a substrate. CONSTITUTION: In a magnetic memory device, a magnetic memory element comprises a substrate(110), a lower magnetic material, a tunnel barrier, and an upper magnetic material The lower magnetic material, the tunnel barrier, and the upper magnetic layer are successively laminated in the substrate. The lower magnetic material comprises a lower perpendicular magnetic material(142) which is adjacent to the substrate The lower perpendicular magnetic material has a dense hexagonal lattice structure.
Abstract translation: 目的:提供一种磁存储器件,通过容易地使通过磁性层的电子的自旋方向与衬底垂直地对准,增加磁性隧道结的磁阻比。 构成:在磁存储器件中,磁存储元件包括衬底(110),下磁性材料,隧道势垒和上磁性材料。下磁性材料,隧道势垒和上磁层依次层压 在基材中。 下磁性材料包括与基底相邻的下垂直磁性材料(142)。下垂直磁性材料具有致密的六边形晶格结构。
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公开(公告)号:KR101766899B1
公开(公告)日:2017-08-10
申请号:KR1020100037017
申请日:2010-04-21
Applicant: 삼성전자주식회사
IPC: G11C11/15 , H01L27/115
CPC classification number: H01L43/10 , B82Y25/00 , G11C11/161 , H01F10/123 , H01F10/3254 , H01F10/3272 , H01F10/3286 , H01L27/222 , H01L43/02 , H01L43/08
Abstract: 자기메모리소자가제공된다. 자기메모리소자는기판상의제1 수직자성막및 제2 수직자성막, 제1 수직자성막및 제2 수직자성막사이의터널베리어막, 및제1 수직자성막의제1 서브막및 제1 수직자성막의제2 서브막사이의교환결합막을포함한다.
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公开(公告)号:KR102153559B1
公开(公告)日:2020-09-08
申请号:KR1020130091983
申请日:2013-08-02
Applicant: 삼성전자주식회사
IPC: G11C11/15 , H01L27/115 , H01L21/8247
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公开(公告)号:KR102127778B1
公开(公告)日:2020-06-29
申请号:KR1020130122870
申请日:2013-10-15
Applicant: 삼성전자주식회사
IPC: H01L21/223
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公开(公告)号:KR102062673B1
公开(公告)日:2020-01-07
申请号:KR1020120149654
申请日:2012-12-20
Applicant: 삼성전자주식회사
Inventor: 아팔코브,드미트로 , 크발코브스키,알렉시바실예비히 , 니키틴,블라디미르 , 크로운비,모하마드토우픽 , 탕,슈에티 , 오세정 , 임우창 , 이장은 , 김기웅 , 김경선
IPC: G11C11/15 , H01L21/8247 , H01L27/115
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