Abstract:
A method for forming a metal oxide layer, and methods for manufacturing a gate structure and a capacitor using the same are provided to form the metal oxide layer in which impurities are reduced by atomic layer deposition. A method for forming a metal oxide layer includes: providing an organic metal compound having a following general equation; and introducing oxidizing agent to an upper portion of the substrate to form a metal oxide on the substrate. The general equation is M(NR^1R^2)3R^3, where, M denotes metal, R^1 and R^2 are identical with or different from each other, and are alkyl group the number of hydrogen or carbons of which is one to five, R ^3 is alkyl group the number of carbons of which is one to five or aromatic cyclic compound or hetero cyclic compound the number of carbons of which is equal to or greater than four, and the cyclic compound does not have substituent or have methyl groups, ethyl groups, or t-butyl groups having the number of carbons as many as that in the cyclic compound.
Abstract:
A chamber gas generating apparatus for semiconductor device fabricating equipment is provided to maximize equipment efficiency and productivity by increasing the evaporation quantity of an ALD(atomic layer deposition) source and a CVD(chemical vapor deposition) source without increasing a carrier gas flow rate. A canister includes a sidewall, a top and a bottom that form an inner space including an upper region and a lower region. An inlet port and an outlet port are connected to the upper region, penetrating the canister. A partition part covers at least part of the bottom of the canister to make the bubbling of the canister uniformly distributed in the canister, installed as a type of a circular shield layer(110) near to the bottom of the canister. The source of the bubbling is formed as a type of an ALD or CVD precursor.
Abstract:
A method of forming a thin film is provided. The method includes introducing an organometallic compound represented by the following formula onto a substrate; wherein M represents a metal in listed in Group 4A of the periodic table of elements, R1, R2 and R3 independently represent hydrogen or an alkyl group having a carbon number from 1 to 5, and X represents hydrogen or an alkyl group having a carbon number from 1 to 5 and then chemisorbing a portion of the organometallic compound on the substrate. The method further includes removing a non-chemisorbed portion of the organometallic compound from the substrate, providing an oxidizing agent onto the substrate and forming a thin film including a metal oxide on the substrate by chemically reacting the oxidizing agent with a metal in the organometallic compound and by separating ligands of the organometallic compound.
Abstract:
원자층 증착법을 이용한 물질 형성에서, 일반식 M[L1]x[L2]y (식중에서, M 은 금속을 나타내고, L1 및 L2는 할라이드계, 디케토네이트계, 알콕사이드계, 아미노계, 알콕시아민계, 아미디네이트계 또는 적어도 두 개이상의 전자 쌍주개가 가능한 멀티덴테이트 리간드이며, L1 및 L2는 서로 상이하고, x, y는 정수이고, x+y 은 3 내지 5의 정수이다)인 유기 금속 화합물을 기판 상에 화학 흡착시킨다. 이어서, 상기 기판의 상부에 산소 원자를 포함하는 반응물을 도입하여, 상기 유기 금속화합물의 금속 원소와 상기 반응물 내의 산소 원자를 화학적으로 반응시키고 상기 유기 금속 화합물의 리간드를 분리시켜 금속 산화물을 형성한다. 따라서, 고유전율을 가지면서 우수한 스텝커버러지 특성을 갖는 유전 물질을 형성할 수 있다.
Abstract:
PURPOSE: A method for forming a capacitor using a SOG(Spin On Glass) composition is provided to reduce the number of processes and enhance the productivity by using an SOG layer instead of a BPSG layer. CONSTITUTION: A bottom oxide layer is formed on a semiconductor substrate(100) by using an SOG solution including polysilizane. A top oxide layer is formed on the bottom oxide layer. An opening part is formed by patterning the top oxide layer and the bottom oxide layer. A conductive layer for storage electrode is formed on a lateral part of the opening part, an exposed conductive structure, and the top oxide layer. The opening part is buried by using an insulating layer. A surface of the top oxide layer is exposed by planarizing the insulating layer. The insulating layer, the top oxide layer, and the bottom oxide layer are etched. An etch-stop layer(200), a dielectric layer(300), and a conductive layer(320) are formed thereon.
Abstract:
An image forming apparatus, and an LSU and a polygon mirror thereof are provided to form the reflecting surfaces of the polygon mirror in an aspheric surface or a free-form surface, thereby converging deflected beam on the surface of a photoreceptor uniformly along a main scanning direction without an f-Theta lens. An image forming apparatus includes a photoreceptor(20), an LSU(Laser Scanning Unit), a developer, and a transfer unit. An electrostatic latent image is on the photoreceptor. The LSU includes a light source(110), a polygon mirror, and a motor(190). The light source generates beam according to an image signal. The polygon mirror has plural reflecting surfaces(141). The plural reflecting surfaces deflect the beam emitted from the light source in a main scanning direction. The polygon mirror is composed of an aspheric surface so as for the plural reflecting surfaces, corrects the aberration of the beam and converges the beam deflected in the main scanning direction on the photoreceptor uniformly. The motor rotates the polygon mirror. The developer attaches developer to the photoreceptor on which the electrostatic latent image forms a visible image. The transfer unit transfers the visible image formed on the photoreceptor to a print medium.
Abstract:
An organic aluminium precursor and a method for forming a metal line using the same are provided to acquire an improved step coverage characteristic and enhanced electrical conductivity from an aluminium line. An organic aluminium precursor forms an aluminium line(140,150). The organic aluminium precursor contains aluminium as a main metal. The organic aluminium precursor further contains boro-hydride and tri-methylamine as ligand. An aluminium boro-hydride trimethylamine is used as the organic aluminium precursor. The aluminium boro-hydride trimethylamine is represented by a predetermined structural formula.
Abstract:
원자층 적층 방법과 이를 이용한 커패시터의 제조 방법 및 게이트 구조물의 제조 방법에 있어서, 원자층 적층 방법은 하기의 화학식(1)을 갖는 유기금속 화합물을 기판의 상부로 도입하여 상기 유기금속 화합물의 일부를 상기 기판 상에 화학 흡착시킨다. 이어서, 상기 기판에 화학 흡착되지 않은 유기금속 화합물을 기판으로부터 제거한다. 이어서, 상기 유기금속 화합물이 흡착된 기판의 상부로 산화제를 도입하여 상기 유기금속 화합물의 금속 원소와 상기 산화제 내의 산소를 화학적으로 반응시키고, 상기 유기금속 화합물의 리간드를 분리시킨다. 그 결과 금속 산화물을 포함하는 박막이 형성된다. ---------화학식(1)
Abstract:
In a method of forming a metal oxide, an organic metal compound represented by the following chemical formula is introduced into a chamber to chemisorb the organic metal compound onto a substrate, M[L1]x[L2]y where M represents a metal, L1 and L2 respectively represents a first and second ligands. In addition, x and y are independently integers and a value of (x+y) is 3 to 5. An oxygen-containing compound is introduced into the chamber to form the metal oxide. The metal oxide is formed by reacting an oxygen of the oxygen-containing compound with the metal, and separating the ligand from the metal. Thus, the metal oxide having a superior step coverage and a high dielectric constant may be formed using the organic metal compound by an atomic layer deposition process.