Abstract:
Provided is an organic solution coating apparatus including a nozzle which has a super oil repellent surface. According to an embodiment of the present invention specification, the coating apparatus may include a rotary chuck and an organic solution supply nozzle which has a super oil repellent surface. A substrate is attached and fixed on the rotary chuck. The super oil repellent surface supplies an organic solution to the substrate and has a contact angle of 90 degrees or more with the organic solution.
Abstract:
PURPOSE: A method for forming micro pattern and photoresist composition are provided to enhance resolution of the pattern and to reduce pattern defect. CONSTITUTION: A method for forming a micro pattern comprises: a step of applying a photoresist composition on the substrate(20) to form photoresist film(22); a step of exposing the photoresist film to the light; and a step of developing the photoresist film using aqueous alkali developing liquid to form a photoresist pattern. The photoresist composition contains: a hydrophobic first repeat unit having a side chain with 3 or more hydroxyl group-substituted heterocyclic ring; a polymeric polymer resist additive having hydrophobic second repeat unit; a polymer having an acid-labile protection group at the side chain; photoacid generator; and solvent.
Abstract:
A composition for anti-reflective coating containing a polymer for anti-reflective coating is provided to form the pattern of excellent profile by regulating the diffusion of acid in an anti-reflective coating film. A polymer for anti-reflective coating comprises a first repeating unit containing basic functional group of the chemical formula 1, a second repeating unit having a light absorbing functional group and a third repeating unit having crosslinking functional group. In the chemical formula 1, R1 is hydrogen or low alkyl group of C1-C4; X is alkylene, arylene, oxyakylene, alkyleneoxy, oxyarylene, aryleneoxy, carbonyl, oxy, oxycarbonyl, carbonyloxy, carbonyl alkylene, carbonyl arylene, alkylene carbonyl, arylene carbonyl and bivalent selected from them.
Abstract:
A method for forming fine patterns of a semiconductor device is provided to store energy in a photoresist layer even if smaller energy is projected than threshold energy, thereby obtaining the desired fine patterns. A method for forming fine patterns of a semiconductor device comprises the steps of: forming a photoresist layer having threshold energy on a semiconductor substrate(101), the threshold energy corresponding to minimum exposure energy to react to the photoresist layer chemically; projecting a first light having a first energy which is lower than the threshold energy to a first region of the photoresist layer to form a preliminary exposure region maintaining the first energy, the preliminary exposure region limiting a non-exposure region; projecting a second light having a second energy which is lower than the threshold energy to a second region in the preliminary exposure region and to the non-exposure region to convert the second region into an exposure region, the sum of the first and second energies the same and higher as/than the threshold energy; and removing the exposure region selectively to form photoresist patterns(110).
Abstract:
In a method of forming a pattern, a lower film which includes a silicon compound which contains a photoacid-foaming agent on an etch object film. A photosensitive film is formed on the lower film. A pattern of the photosensitive film is formed by emitting extreme ultraviolet (EUV) to the photosensitive film. The etch object film is etched by using the pattern of the photosensitive film as an etch mask. Therefore, the present invention can improve resolution, sensitivity, and efficiency and simplifies processes when forming a fine pattern.