公开(公告)号：KR100642201B1

公开(公告)日：2006-11-10

申请号：KR1020050098141

申请日：2005-10-18

Applicant: 성균관대학교산학협력단

Inventor： 한전건 ,  정윤모 ,  정우성 ,  문창성

IPC: H05K3/10 ,  H05K3/38

Abstract: A method for manufacturing a flexible printed circuit board is provided to improve an adhesive property between a polyimide film and a metal thin film by depositing a metal seed layer by using a magnetron sputtering method. A cross-linking layer forming process is performed to form a cross-linking layer(110) on a surface of a polyimide film by using a magnetron sputtering device for colliding with high-energy ions and target metal ions. A copper thin film forming process is performed to form a copper thin film(120) by colliding with the metal ions and the cross-linking layer. A copper thick film forming process is performed to form a copper thick film(130) on the copper thin film by using a wet plating method.

Abstract translation: 提供了一种制造柔性印刷电路板的方法，以通过使用磁控溅射方法沉积金属种子层来提高聚酰亚胺膜和金属薄膜之间的粘附性能。 进行交联层形成过程以通过使用磁控溅射装置在聚酰亚胺膜的表面上形成交联层（110）以与高能离子和目标金属离子碰撞。 进行铜薄膜形成工艺以通过与金属离子和交联层碰撞形成铜薄膜（120）。 进行铜厚膜形成工艺以通过使用湿式镀覆法在铜薄膜上形成铜厚膜（130）。