저온 공정을 사용한 실리콘 박막 트랜지스터의 제조방법
    1.
    发明授权
    저온 공정을 사용한 실리콘 박막 트랜지스터의 제조방법 失效
    使用低温工艺的薄膜晶体管的制备方法

    公开(公告)号:KR101081479B1

    公开(公告)日:2011-11-08

    申请号:KR1020100091776

    申请日:2010-09-17

    CPC classification number: H01L29/66757 H01L21/28556 H01L29/458

    Abstract: PURPOSE: A method for manufacturing a silicon thin film transistor using a low temperature process is provided to reduce manufacturing costs by simplifying a crystallization process using a laser and a doping process. CONSTITUTION: A buffer layer(110) is formed on a substrate. An n type or p type micro crystal silicon thin film is deposited on the buffer layer. A source electrode or drain electrode is formed by patterning the n type or p type micro crystal silicon thin film. An active layer is formed on the source electrode or drain electrode. An insulation layer and a metal electrode(150) are formed on the active layer. A gate electrode(160) is formed by patterning the active layer, the insulation layer, and the metal electrode on the substrate. The n type or p type micro crystal silicon thin film is formed by a low temperature chemical vapor deposition process.

    Abstract translation: 目的:提供使用低温工艺制造硅薄膜晶体管的方法,通过简化使用激光和掺杂工艺的结晶过程来降低制造成本。 构成:在衬底上形成缓冲层(110)。 n型或p型微晶硅薄膜沉积在缓冲层上。 通过图案化n型或p型微晶硅薄膜形成源电极或漏电极。 在源电极或漏电极上形成有源层。 绝缘层和金属电极(150)形成在有源层上。 栅极电极(160)通过在基板上构图有源层,绝缘层和金属电极而形成。 n型或p型微晶硅薄膜是通过低温化学气相沉积工艺形成的。

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