公开(公告)号：KR100871067B1

公开(公告)日：2008-11-27

申请号：KR1020070070499

申请日：2007-07-13

Applicant: 성균관대학교산학협력단

Inventor： 정승부 ,  김종웅 ,  구자명 ,  윤정원 ,  노보인

IPC: H01L23/488

CPC classification number: H01L2224/11 ,  H01L2924/00012

Abstract: The bonding strength of the solder bump can be improved by extending the role of UBM without an additional process. A step is for forming the thin conductive film on the substrate. A step is for forming a photoresist or the dry film in the region except for the bump(14) on the thin conductive film. A step is for forming a bump on the thin conductive film by uisng the electro or electroless plating. A step is for removing photoresist or the dry film. A step is for forming the solder bump by forming the solder(16) on the bump. A step is for performing a reflow process to make the spheric solder bump.

Abstract translation: 通过在没有额外的工艺的情况下扩展UBM的作用，可以提高焊料凸点的结合强度。 在衬底上形成薄导电膜的步骤。 在除了薄导电膜上的凸起（14）之外的区域中形成光致抗蚀剂或干膜的步骤。 通过利用电化学镀或非化学镀来在薄导电膜上形成凸点的步骤。 步骤是去除光致抗蚀剂或干膜。 步骤是通过在凸块上形成焊料（16）来形成焊料凸块。 步骤是进行回流处理以制造球形焊料凸块。

公开(公告)号：KR1020110097329A

公开(公告)日：2011-08-31

申请号：KR1020100017124

申请日：2010-02-25

Applicant: 성균관대학교산학협력단

Inventor： 노보인 ,  윤정원 ,  최정현 ,  이어화 ,  정승부

IPC: B23K35/26 ,  C22C13/00

Abstract: 본 발명은 Pb를 포함하지 않으면서, 낮은 Ag 함량을 갖는 주석-은-세륨(Sn-Ag-Ce) 3원계 무연솔더합금 조성물에 관한 것으로서, 상기 3원계 무연솔더합금 조성물을 제공함으로써, 환경오염 등의 문제점을 근본적으로 해결하고, 합금의 고온 신뢰성을 향상시키며, Ag의 과다 사용에 따른 비용 증가 문제를 해결할 수 있으며, 제조가 용이하여 생산비용을 크게 절감할 수 있다.

公开(公告)号：KR1020090055880A

公开(公告)日：2009-06-03

申请号：KR1020070122740

申请日：2007-11-29

Applicant: 성균관대학교산학협력단

Inventor： 정승부 ,  구자명 ,  윤정원 ,  최돈현 ,  노보인

IPC: B22F3/11 ,  B22F1/00

Abstract: A manufacturing method of open-celled metal hollow sphere is provided to connect inner wall and outer wall networks to pores formed within the copper base and circulate gas and liquid materials. A manufacturing method of open-celled metal hollow sphere comprises: a step for manufacturing slurry which is made of metal oxide powder, low melting point metal, solvent, and binder; a step for coating the manufactured slurry on the surface of a polymer ball or a paraffin ball; a step for evaporating solvent by drying the coated polymer ball or the coated paraffin ball; and a step for reducing metal oxide by heating the metal oxide under the hydrogen atmosphere. The low melting point metal is made of zinc and is added from 0.01 to 50 weight% based on the slurry total weight. The diameter of the metal oxide powder is 1/50 or less of the metal hollow sphere diameter. The solvent is made of water, alcohol or acetone.

Abstract translation: 提供开孔金属中空球的制造方法，将内壁和外壁网络连接到铜基底内形成的孔，并循环气体和液体材料。 开孔金属中空球的制造方法包括：制造由金属氧化物粉末，低熔点金属，溶剂和粘合剂构成的浆料的工序; 将制造的浆料涂布在聚合物球或石蜡球的表面上的步骤; 通过干燥涂覆的聚合物球或涂覆的石蜡球来蒸发溶剂的步骤; 以及通过在氢气氛下加热金属氧化物来还原金属氧化物的工序。 低熔点金属由锌制成，并且以浆料总重计为0.01〜50重量％。 金属氧化物粉末的直径为金属中空球体直径的1/50以下。 溶剂由水，酒精或丙酮制成。